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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

The Heterogeneous Integration of Electronic Components

Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry.

42 ENGINEERING↗
DOE OSTI2025

Microbead Encapsulation for Protection of Electronic Components

Here, this study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide substantial mechanical support but create thermal expansion mismatch issues, potentially leading to electronic component failure. We explore the use of finely powdered microbeads to achieve protective structures combining stiffness and energy absorption. The research focuses on key variables, including microbead size, microbead roughness, compaction of microbeads, and circuit board mounting in the encapsulation, all of which influence the encapsulation’s effectiveness. Experimental setups and testing protocols were developed to assess the performance of various microbead materials under different impact conditions. Results demonstrate that microbead encapsulation significantly reduces strain on circuit boards, minimizing the risk of damage during mechanical shocks. However, challenges remain, such as optimizing microbead characteristics and modeling their behavior within large-scale circuit board assemblies. Despite these challenges, the findings suggest that microbead encapsulation offers a promising alternative to conventional methods, enhancing the durability and reliability of electronic components in high-stress environments.

42 ENGINEERING↗
DOE OSTI2021

Two-component electronic phase separation in the doped Mott insulator Y 1-x Ca x TiO 3

One of the major puzzles in condensed matter physics has been the observation of a Mott-insulating state away from half-filling. Several theoretical proposals aimed to elucidate this phenomenon have been put forth, a notable one being phase separation and an associated percolation-induced Mott insulator-metal transition. In the present work we study the prototypical doped Mott-insulating rare-earth titanate YTiO 3 , in which the insulating state survives up to a large hole concentration of 35%. Single crystals of Y 1-x Ca x TiO 3 with 0 ≤ x ≤ 0.5, spanning the insulator-metal transition, are grown and investigated. Using x-ray absorption spectroscopy, a powerful technique capable of probing element-specific electronic states, we find that the primary effect of hole doping is to induce electronic phase separation into hole-rich and hole-poor regions. The data reveal the formation of electronic states within the Mott-Hubbard gap, near the Fermi level, which increase in spectral weight with increasing doping. From a comparison with DFT+U calculations, we infer that the hole-poor and hole-rich components have charge densities that correspond to the insulating x = 0 and metallic x ~ 0.5 states, respectively, and that the new electronic states arise from the metallic component. Our results indicate that the doping-induced insulator-metal transition in Y 1-x Ca x TiO 3 is indeed percolative in nature, and thus of inherent first-order character.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2023

Magnetostrictive materials for enhanced sensors and electronic components

Magnetostriction is a property of magnetic materials that causes them to change their shape or dimensions when their magnetization changes. Low-cost, mechanically robust magnetostrictive sensors would be valuable for a wide range of applications addressing DOE's energy, environmental, and national security missions. Several examples include monitoring internal conditions of pipelines, enhancing implantable systems for the human body, and improving the electrical grid by providing real time sensors for detecting high impedance faults that may act as ignition sources for forest fires. Historically, magnetostrictive materials tended to be expensive and mechanically brittle, but recent developments in iron-based alloys, especially those that include dilute solutions of rare earth elements, have demonstrated useful magnetostriction values, mechanical robustness, and low costs. This project investigated addition of dilute cerium doping on the magnetostrictive properties of Fe-Ga and Fe-Al alloys. Advanced manufacturing techniques were applied to these materials to take advantage of rapid cooling of the alloy to stabilize desired phases and to make near net shape coupons. These coupons develop significant texturing, offering a route to target microstructures with exceptional performance.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Magnetostrictive materials for enhanced sensors and electronic components

Magnetostriction is a property of magnetic materials that causes them to change their shape or dimensions proportional to their magnetization. Low-cost, mechanically robust magnetostrictive sensors would be valuable for a wide range of applications across the DOE and national security mission space, such as monitoring the internal conditions of pipelines, rapidly detecting high-impedance faults in power lines (e.g. trees touching power lines), or enhancing implantable systems for the human body. Dilute doping (<1 at.%) of rare earth elements (REE) has been shown to amplify the magnetostriction. Furthermore, alloy processing by rapid cooling from high temperature tends to result in texturing and therefore greater magnetostriction values, which bodes well for developing advanced manufacturing approaches significantly less expensive than single crystal growth. The goal of this effort was to develop robust, low-cost magnetostrictive materials compatible with advanced manufacturing techniques to exploit the rapid cooling of these approaches while retaining the ability to produce fully dense structures. To be useful as a sensor or actuator the coercivity of the material needs to be minimized so that there is minimal magnetic hysteresis. Employing a small scale laser powder bed fusion (L-PBF) system, specimens of Fe-Ga-Ce were built from alloy powder which had a magnetostriction of 289 ppm along the build direction and 197 ppm perpendicular to the build direction. These values are not far from the 310-350 ppm observed in single crystals of Fe-Ga. The results of the series of samples run suggest this is a very promising route for REE doping to higher levels, especially if the powders can be produced using far from equilibrium approaches such as ultrasonic atomization. The promising results from applying additive manufacturing techniques to these materials, particularly the inexpensive Fe-Al system, has potential for inexpensive high-performing magnetostrictive parts producible at large scales for low-cost sensors.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Testing of Participant's Power Electronics Component for Circuit Performance and Efficiency (CRADA Final Report)

The "Solar SEED Smart Controller is a charge control device to condition solar power to load voltage with or without Battery (also called a "DC Power Platform") invented by David Gibbs and T4D Labs Inc. T4D Inc. and the SEED Smart Controller invention were selected for American Made Challenges Solar Prize, which includes voucher for NREL to provide technical assistance.

14 SOLAR ENERGY↗
DOE OSTI2023

Multi-layered diamond-like carbon coating for electronic components

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

Selter, Thomas Matthew↗
DOE OSTI2022

Super-Resolution Approaches in Three-Dimensions for Classification and Screening of Commercial-Off-The-Shelf Components

X-ray computed tomography is generally a primary step in characterization of defective electronic components, but is generally too slow to screen large lots of components. Super-resolution imaging approaches, in which higher-resolution data is inferred from lower-resolution images, have the potential to substantially reduce collection times for data volumes accessible via x-ray computed tomography. Here we seek to advance existing two-dimensional super-resolution approaches directly to three-dimensional computed tomography data. Multiple scan resolutions over a half order of magnitude of resolution were collected for four classes of commercial electronic components to serve as training data for a deep-learning, super-resolution network. A modular python framework for three-dimensional super-resolution of computed tomography data has been developed and trained over multiple classes of electronic components. Initial training and testing demonstrate the vast promise for these approaches, which have the potential for more than an order of magnitude reduction in collection time for electronic component screening.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Energy storage devices having coated passive components

The present invention provides various passive electronic components comprising a layer of coated particles, and methods for producing and using the same. Some of the passive electronic components of the invention include, but are not limited to conductors, resistors, current collectors, capacitors, piezoelectronic devices, inductors and transformers. The present invention also provides energy storage devices and electrode layers for such energy storage devices having passive, electrically-conductive particles coated with one or more thin film materials.

25 ENERGY STORAGE↗
DOE OSTI2022

Energy storage devices having coated passive components

The present invention provides various passive electronic components comprising a layer of coated particles, and methods for producing and using the same. Some of the passive electronic components of the invention include, but are not limited to conductors, resistors, current collectors, capacitors, piezoelectronic devices, inductors and transformers. The present invention also provides energy storage devices and electrode layers for such energy storage devices having passive, electrically-conductive particles coated with one or more thin film materials.

King, David M.↗