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A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.
Abstract Solar thermal energy is trapped in a glass-covered water chamber/basin to provide the heat for evaporation of brackish water in a novel desalination system. To harvest clean water, a chimney is integrated with the water basin, which draws air into the chamber to be humidified by the vapor and then being ventilated via buoyance force. Uniquely, thermal conductive metal sheet is recommended to make the chimney, which allows the vapor in the humid air condenses easily when flowing up. The condensate at the inner wall of the chimney flows down to be collected as clean water. Mathematical modeling and numerical computation have been carried out to delineate the coupling of the buoyance-force-driven flow with the heat and mass transfer of air and water in the solar collection chamber and the condensation of vapor in the heat-dissipating chimney. The objective of the simulation and optimization of the system is to find the best match of the dimensions of the water chamber with a chimney to maximize the production of clean water and energy efficiency. The model has been used to simulation several cases (of water from 40 °C to 50 °C) with available experimental data from the authors’ previous work, and the agreement was satisfactory. The optimization studies found that there is a maximum air flowrate corresponding to a critical chimney height due to the requirement that the chimney is designated to dissipate heat as much as possible to condense water vapor. With the chimney height greater than the critical height, the airflow rate will have a slight decrease. Nevertheless, higher than a critical height is still needed for a chimney to condense more moisture. Optimized chamber diameters at different chimney heights are provided for reference of optimal system designs.
A heat dissipation system apparatus and method of operation using hygroscopic working fluid for use in a wide variety of environments for absorbed water in the hygroscopic working fluid to be released to minimize water consumption in the heat dissipation system apparatus for effective cooling in environments having little available water for use in cooling systems. The system comprises a low-volatility, hygroscopic working fluid to reject thermal energy directly to ambient air. The low-volatility and hygroscopic nature of the working fluid prevents complete evaporation of the fluid and a net consumption of water for cooling, and direct-contact heat exchange allows for the creation of large interfacial surface areas for effective heat transfer. Specific methods of operation prevent the crystallization of the desiccant from the hygrosopic working fluid under various environmental conditions.
A heat dissipation system apparatus and method of operation using hygroscopic working fluid for use in a wide variety of environments for absorbed water in the hygroscopic working fluid to be released to minimize water consumption in the heat dissipation system apparatus for effective cooling in environments having little available water for use in cooling systems. The system comprises a low-volatility, hygroscopic working fluid to reject thermal energy directly to ambient air. The low-volatility and hygroscopic nature of the working fluid prevents complete evaporation of the fluid and a net consumption of water for cooling, and direct-contact heat exchange allows for the creation of large interfacial surface areas for effective heat transfer. Specific methods of operation prevent the crystallization of the desiccant from the hygrosopic working fluid under various environmental conditions.
In various embodiments, the present invention relates to heat dissipation systems including a hygroscopic working fluid and methods of using the same. In various embodiments, the present invention provides a method for heat dissipation using a hygroscopic working fluid. The method can include transferring thermal energy from a heated process fluid to the hygroscopic working fluid in a process heat exchanger, to form a cooled process fluid. The method can include condensing liquid from a feed gas on a heat transfer surface of a feed gas heat exchanger in contact with the cooled process fluid, to form a cooled feed gas, the heated process fluid, and a condensate. The method can include dissipating thermal energy from the hygroscopic working fluid to a cooling gas composition with a fluid-air contactor. The method can include transferring moisture between the hygroscopic working fluid and the cooling gas composition with the fluid-air contactor. The method can include adding at least part of the condensate to the hygroscopic working fluid.
NREL's Battery Safety Map (Heat Generation versus Heat Dissipation Maps for Batteries) generates a response surface that is grouped into regions where the battery is deemed safe from the propagation of thermal runaway, those where an engineering solution would render the battery safe, and finally instances where thermal runaway is inevitable. The demarcation for the different regions is provided by specifications or constraints imposed by the end user. NREL's Battery Safety Map is a user-defined subroutine that sweeps through a set of parameters describing the operating conditions and short-circuit scenarios for battery safety simulations. For each run, the electrochemical-thermal model implementing reaction kinetics and gas generation are run to evaluate the amount of heat generated. A thermal model then captures the amount of heat dissipation based on boundary conditions defined (e.g., forced convection, constant temperature at the surface, etc.). Based on the rate of heat transfer and the amount of heat generated, each run is classified into "safe," "mitigation possible," or "unsafe" zones. These categories are defined based on constraints or tolerance specifications provided by the end user.
In many situations, the dual-purpose heater/thermometer wires used in the three-omega method – one of the most precise and sensitive techniques for measuring the thermal conductivity of thin films and interfaces – must include bends and curves to avoid obstructions on the surface of a sample. Although the three-omega analysis assumes that the heating wire is infinitely long and straight, recent experimental work has demonstrated that in some cases curved-wire geometries can be used without introducing detectable systematic error. We describe a general numerical method that can be used to calculate the temperature of three-omega heating wires with arbitrary wire geometries. Furthermore, this method provides experimentalists with a simple quantitative procedure for calculating how large the systematic error caused by a particular wire asymmetry will be. We show calculations of two useful cases: a straight wire with a single bend of arbitrary angle and a wire that forms a circle. We find that the amplitude of the in-phase temperature oscillations near a wire that forms a circle differs from the prediction using the analytic straight-line source solution by <12%, provided that the thermal penetration depth is less than ten times the radius of curvature of the wire path. The in-phase temperature amplitude 1.5 wire widths away from a 90° bend in a wire is within 11% of the straight-line source prediction for all penetration depths greater than the wire width. Our calculations indicate that the straight-line source solution breaks down significantly when the wire bend angle is less than 45°.
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Cryogenic environments make superconducting computing possible by reducing thermal noise, electrical resistance and heat dissipation. Heat generated by the electronics and thermal conductivity of electrical transmission lines to the outside world constitute two main sources of thermal load in such systems. As a result, higher data rates require additional transmission lines which come at an increasingly higher cooling power cost. Hybrid or monolithic integration of silicon photonics with the electronics can be the key to higher data rates and lower power costs in these systems. We present a 4-channel wavelength division multiplexing photonic integrated circuit (PIC) built from modulators in the AIM Photonics process development kit (PDK) that operate at 25 Gbps at room temperature and 10 Gbps at 40 K. We further demonstrate 2-channel operation for 20 Gbps aggregate data rate at 40 K using two different modulators/wavelengths, with the potential for higher aggregate bit rates by utilizing additional channels.
Fuel pellets and fuel pellet arrangements include thermally-conductive inserts within a fuel. The inserts have at least one portion of a thermally-conductive material, such as radially-extending fins. The inserts are configured to dissipate heat during use of the fuel pellets, while minimizing the amount of the total volume of the fuel pellet that is occupied by non-fissile material. The inclusion of heat-dissipating inserts enables the fuel pellets to exhibit improved thermal performance over the lifetime of the fuel, including a relatively low peak temperature and relatively low integrated average temperatures, while the minimal volume of the inserts avoids significantly decreasing the percent of enrichment achievable.
Thermal management has become a major barrier in the development of high-power micro-devices. Microchannel heat sinks (MCHS) are a promising method to dissipate high heat fluxes from high power density devices. Reducing the thermal resistance will reduce the temperature increase of the electronic device, allowing for higher powers to be achieved while maintaining a safe operating temperature. This paper reports on the use of silicon carbide (Sic) microchannels to dissipate high heat fluxes up to 1 kW/cm 2 over a footprint of 0.25 cm 2 . The use of high aspect ratio and decreased hydraulic diameter channels has allowed for very low thermal resistances to be achieved at higher heat duties compared to previous studies. The experiments performed resulted in heater temperatures of less than 60 °C and thermal resistances as low as 0.024 cm 2 . ° $C$/W between the heater surface and fluid inlet temperature. In conclusion, the demonstrated thermal performance of the SiC MCHS is an encouraging means for dissipating heat from high power density microelectronic devices.
The heat dissipated by the EIC accelerator system and components is ultimately removed by the conventional water-cooling systems that will be ultimately dissipated the waste heat to the atmosphere. An estimated 45 MW of heat will be dissipated to water during full beam operation and that will need to be effectively rejected to the atmosphere. Approximately 50% of the heat is required to be rejected to a low temperature heat sink that cannot be achieved by an evaporative cooling tower during summer. To operate during these summer months, a secondary chilled water refrigeration system will be required that would increase the cost of the cooling water system. Further, operating chiller compressor in the summer months will increase the energy consumption of the machine. This analysis is being prepared to evaluate the impact on operating and capital costs on the cooling system for various summer operating schedules while utilizing the most cost-effective scenario of an evaporative cooling system. The technology selection for the various heat sinks is addressed in a separate write-up and are not expected to change the conclusions of this write-up.
Collisionless shocks are a grand challenge problem in plasma physics and have been the subject of study for more than six decades. Shocks are ubiquitous phenomena in the universe and are responsible for transforming high energy and momentum flows into thermal energy and energetic particles. Understanding how shocks operate is of primary importance to understand the sun-earth coupling, protecting manned missions and spacecrafts from high energy particles, inertial confinement fusion, and radiation observed from astrophysical plasmas, such as supernova remnants and astrophysical jets. A major unanswered question on this frontier is, how does a collisionless plasma transform flow energy and momentum into electron thermal energy? Many potential mechanisms have been proposed to perform the conversion between flow and thermal energy in a collisionless plasma, but the answer has been elusive. To solve the mystery, non-relativistic perpendicular and quasi-perpendicular shocks are studied via a coordinated approach employing cutting-edge numerical simulations with the continuum kinetic code Gkeyll and spacecraft observations supplied by NASA's Magnetospheric Multiscale (MMS) mission. In both sets of data, we employ novel techniques to identify how and where energy is exchanged between electromagnetic fields and plasma particles. By combining cutting-edge spacecraft data and numerical simulations with these diagnostics, we have been able to identify some of the primary mechanisms responsible electron heating and dissipation in heliospheric shocks. In addition to electron dynamics, we have complete access to proton simulation and in situ data, enabling us to characterize proton heating and acceleration in quasi-perpendicular shocks. Many astrophysical quasi-perpendicular shocks have similar parameters to those in this study, including supernova remnants and shocks in galaxy clusters. Additionally, the simulation code, Gkeyll, and associated analysis scripts are openly available for community use. This award has supported a collaborative effort between Princeton University, the University of Arizona - Tucson, and the University of Maryland - College Park. The award funded three early career scientists, including the funding and training of one female postdoctoral researcher, who was involved in all aspects of the MMS data analysis and some portions of the simulation analysis.
Silicon (Si) is a promising high-capacity material for lithium-ion batteries; however, its limited reversibility hinders commercial adoption. Approaches such as particle and crystallite size reduction, introduction of conductive carbon, and use of different electrolyte solvents have been explored to overcome these electrochemical limitations. Herein, operando isothermal microcalorimetry (IMC) is used to probe the influence of silicon particle size, electrode composition, and electrolyte additives fluoroethylene carbonate and vinylene carbonate on the heat flow during silicon lithiation. In this work, the IMC data are complemented by X-ray photoelectron and Raman spectroscopies to elucidate differences in solid electrolyte interphase (SEI) composition. Nanosized (~50 nm, n-Si) and micrometer-sized (~4 μm, μ-Si) silicon electrodes are formulated with and without amorphous carbon and electrochemically lithiated in ethylene carbonate (EC), fluoroethylene carbonate (FEC), or vinylene carbonate (VC) based electrolytes. Notably, n-Si electrodes generate 53–61% more normalized heat relative to their μ-Si counterparts, consistent with increased surface area and electrode/electrolyte reactivity. Introduction of amorphous carbon significantly alters the heat flow profile where multiple exothermic peaks and increased normalized heat dissipation are observed for all electrolyte types. Notably, the VC-containing electrolyte demonstrates the greatest normalized heat dissipation of the electrode compositions tested showing as much as a 50% increase compared to the EC or FEC counterparts. The results are relevant to the understanding of silicon negative electrode function in the presence of electrolyte additives and provide insight relative to silicon containing cell reactivity and safety.