Nondestructive testing techniques for multilayer printed wiring boards.
Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
Nondestructive testing techniques for detection of stress corrosion
Nondestructive test technique developed for large solid propellant grains
Nondestructive testing techniques for Saturn honeycomb heat shields
Nondestructive testing techniques for laminated printed circuit boards
Special requirements of the space industry for more detailed knowledge of the quality and reliability of each electroexplosive device (EED) selected for use aboard a spacecraft are described. Statistical methods do not practically demonstrate the high reliability needed. To close this gap, nondestructive test techniques and instrumentation for 1-W/1-A no-fire devices have been developed. Several lots of squibs have been evaluated using these techniques and instrumentation. They yield data as to the quality and normal behavior of each electroexplosive device without firing or degrading the unit. Performance data were obtained by initiating the EED's with an impulsive waveform and sensing the initiation characteristics, sensitivity, and output.
Nondestructive testing for detecting lack of penetration in aluminum fusion welds
Development of nondestructive testing system, using ultrasonic techniques, for detecting disbonds in composite honeycomb heat shields of Saturn launch vehicle
Literature and industrial surveys of nondestructive testing equipment and techniques for application to honeycomb heat shields, including partially annotated bibliography
The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes.
The Space Shuttle Columbia's catastrophic failure has been attributed to a piece of external tank SOFI (Spray On Foam Insulation) striking the left wing of the orbiter causing significant damage to some of the reinforced carbon/carbon leading edge wing panels. Subsequently, several nondestructive testing (NDT) techniques have been considered for inspecting the external tank. One such method involves using millimeter waves which have been shown to easily penetrate through the foam and provide high resolution images of its interior structures. This paper presents the results of inspecting three different SOFI covered panels by reflectometers at millimeter wave frequencies, specifically at 100 GHz. Each panel was fitted with various embedded anomalies/inserts representing voids and unbonds of diferent shapes, sizes and locations within each panel. In conjunction with these reJqectome&rs, radiators including a focused lens antenna and a small horn antenna were used. The focused lens antenna provided for a footprint diameter of approximately 1.25 cm (0.5") at 25.4 cm (10") away from the lens surface. The horn antenna was primarily operated in its near-field for obtaining relatively high resolution images. These images were produced using 2 0 scanning mechanisms. Discussions of the difference between the capabilities of these two types of antennas (radiators) for the purpose of inspecting the SOFI as it relates to the produced images are also presented.
Axial transverse laminography and mutual coupling nondestructive techniques for inspection of multilayer printed circuit boards
Nondestructive testing and inspection methods using infrared microscopy, X-ray television, and ultrasonic measurements - Conference
A program was conducted to evaluate nondestructive analysis techniques for the detection of defects in rigidized surface insulation (a candidate material for the Space Shuttle thermal protection system). Uncoated, coated, and coated and bonded samples with internal defects (voids, cracks, delaminations, density variations, and moisture content), coating defects (holes, cracks, thickness variations, and loss of adhesion), and bondline defects (voids and unbonds) were inspected by X-ray radiography, acoustic, microwave, high-frequency ultrasonic, beta backscatter, thermal, holographic, and visual techniques. The detectability of each type of defect was determined for each technique (when applicable). A possible relationship between microwave reflection measurements (or X-ray-radiography density measurements) and the tensile strength was established. A possible approach for in-process inspection using a combination of X-ray radiography, acoustic, microwave, and holographic techniques was recommended.
DOT /Driver-Displacement Oriented Transducer/, applicable to both lap shear type application and honeycomb sandwich structures, measures the displacement of the honeycomb composite face sheet. It incorporates an electromagnetic driver and a displacement measuring system into a single unit to provide noncontact bond strength measurements.
Explore the source record for details and available documents.
The methods and procedures used to perform nondestructive testing inspections of the Saturn S-2 liquid hydrogen and liquid oxygen tank weldments during fabrication and after proof testing are described to document special skills developed during the program. All post-test inspection requirements are outlined including radiographic inspections procedures.
Nondestructive testing of insensitive electroexplosive devices by transient techniques