Forward silicon tracking detector developments for the future Electron-Ion Collider
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Atomic, Nuclear and Particle Physics↗
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Advanced silicon tracking detector developments for the future Electron-Ion Collider
The proposed Electron-Ion Collider (EIC) will operate high-luminosity high-energy electron+proton and electron+nucleus collisions at the collision energies from 20 GeV to 141 GeV to solve several fundamental questions in the high energy and nuclear physics fields. Its instantaneous luminosity can reach 10 33-34 cm -2 s -1 and the bunching crossing rate is around 10 ns. The EIC project has received CD1 approval from the US DOE in 2021 and moves toward the machine design and preparation for construction. To realize various particle measurements with high precision at the future EIC, a low material-budget and high-granularity silicon vertex and tracking detector with fine spatial and momentum resolutions and nearly 4π solid angle coverage is desired. The Monolithic Active Pixel Sensor (MAPS) and AC Coupled Low Gain Avalanche Diode (AC-LGAD) technologies stand out of several advanced technology options for the EIC silicon vertex and tracking detector subsystems. The MAPS technology has advanced features of low material budget, low power consumption, good radiation resistance and fine spatial resolution. The AC-LGAD technology can achieve fast timing resolution. Latest studies and progress of the EIC silicon vertex and tracking detector conceptual design, performance validations in simulation and ongoing MAPS and AC-LGAD R&D will be shown. Furthermore, schedule and plan of the EIC project detector development will be discussed as well.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Forward silicon vertex/tracking detector design and R$\&$D for the future Electron-Ion Collider
The proposed high-luminosity high-energy Electron-Ion Collider (EIC) will provide a clean environment to precisely study several fundamental questions in the fields of high-energy and nuclear physics . A low material budget and high granularity silicon vertex/tracking detector is critical to carry out a series of hadron and jet measurements at the future EIC especially for the heavy flavor product reconstruction or tagging. The conceptual design of a proposed forward silicon tracking detector with the pseudorapidity coverage from 1.2 to 3.5 has been developed in integration with different magnet options and the other EIC detector sub-systems. The tracking performance of this detector enables precise heavy flavor hadron and jet measurements in the hadron beam going direction. The detector R&D for the proposed silicon technology candidates: Low Gain Avalanche Diode (LGAD) and radiation hard depleted Monolithic Active Pixel Sensor (MALTA), which can provide good spatial and timing resolutions, is underway. Bench test results of the LGAD and MALTA prototype sensors will be discussed.
72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
EIC Physics from An All-Silicon Tracking Detector
The proposed electron-ion collider has a rich physics program to study the internal structure of protons and heavy nuclei. This program will impose strict requirements on detector design. This paper explores how these requirements can be satisfied using an all-silicon tracking detector, by consideration of three representative probes: heavy flavor hadrons, jets, and exclusive vector mesons.
Arrington, John↗
Forward silicon tracking studies for the EIC Yellow Report preparation
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Atomic, Nuclear and Particle Physics↗
EIC Silicon Tracking in the Forward Direction and Physics Studies
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EIC FST↗
Versatile High-Gain Low-Noise Readout ASIC for Silicon Microstrip Tracking Detectors
This work presents Turpial, a custom-designed low- power front-end readout ASIC for microstrip silicon sensors. Implemented in 130 nm CMOS technology, the chip integrates 64 identical readout channels, each including a configurable charge-sensitive amplifier, a bipolar pulse shaper, a 32-sample 50 Msps analog memory, and a 12-bit RC-hybrid SAR ADC operating at 1 Msps. To satisfy the target power budget of 5 mW per channel, the architecture employs a time-decoupled readout scheme in which fast transient signals are first captured in the analog memory and subsequently digitized at a lower rate. Turpial supports a wide dynamic range from 1 kℎ+ to 1 Mℎ+ while maintaining low noise performance, targeting an equivalent noise charge (ENC) below 200 𝑒−including the sensor, and providing a maximum gain of 1500 mV/fC. A digital block manages slow control, data acquisition, and data serialization through dual CML 300 Mb/s serializers. In addition, an on-chip reference circuit, based on a sub-1 V bandgap reference and an integrated LDO regulator, eliminates the need for external reference circuitry. Experimental results demonstrate that both the individual building blocks and the fully integrated ASIC meet the design specifications.
Hernandez, Hugo [Stanford University] (ORCID:00000↗
Development of a FELIX based readout system for ITk strip hybrid module demonstrator for ATLAS Phase-II Upgrade
The Large Hadron Collider (LHC) will undergo a major upgrade around 2024 with a roughly tenfold increase in luminosity. It results in corresponding increases in particle rates and radiation doses that the current ATLAS Inner Tracking Detector cannot cope with. Therefore the ATLAS experiment will build a new all-silicon tracking system called the ITk (Inner Tracker) that includes an inside pixel detector close to the beam line and a strip detector in outside layer. Meanwhile the ATLAS experiment will adopt the Front-End Link eXchange (FELIX) system as the interface between the data acquisition and front-end electronics for all sub-detectors in the Phase II Upgrade. In this contribution, we present a prototype of FELIX based readout system for the strip hybrid module. Its hardware, firmware and software GUI application will be discussed, as well as integration test results.
73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
Thin film charged particle detectors
Silicon tracking detectors have grown to cover larger surface areas up to hundreds of square meters, and are even taking over other sub-detectors, such as calorimeters. However, further improvements in tracking detector performance are more likely to arise from the ability to make a low mass detector comprised of a high ratio of active sensor to inactive materials, where dead materials include electrical services, cooling, mechanical supports, etc. In addition, the cost and time to build these detectors is currently large. Therefore, advancements in the fundamental technology of tracking detectors may need to look at a more transformative approach that enables extremely large area coverage with minimal dead material and is easier and faster to build. The advancement of thin film fabrication techniques has the potential to revolutionize the next-to-next generation of particle detector experiments. Some thin film deposition techniques have already been developed and widely used in the industry to make LED screens for TVs and monitors. If large area thin film detectors on the order of several square meters can be fabricated with similar performance as current silicon technologies, they could be used in future particle physics experiments. This paper aims to review the key fundamental performance criteria of existing silicon detectors and past research to use thin films and other semi-conductor materials as particle detectors in order to explore the important considerations and challenges to pursue thin film detectors.
Solid state detectors↗
Photovoltaic fleet degradation insights
Abstract In the PV Fleet Performance Data Initiative, high‐frequency data from commercial and utility‐scale photovoltaic (PV) systems have been collected to examine performance loss rates (PLRs) at a fleet scale. To date, performance data from more than 7.2‐gigawatt (GW) capacity, 1700 sites and 19,000 inverters—approximately equivalent to 6% to 7% of the entire US PV market—have been collected. An overall PLR of −0.75%/year was found, which is in line with historical and recent findings. Tracked silicon (Si) and cadmium telluride (CdTe) performed comparably with all fixed‐tilt systems. Higher PLRs were found for hotter temperature zones; cooler climates exhibit a median −0.48%/year loss, which increases to −0.88%/year in hotter climates. High‐efficiency module technologies showed median PLRs in line with conventional Si technologies but demonstrated markedly different PLR behavior when filtered only for low‐light conditions <600 W/m 2 . Causes for this technology‐dependent behavior are under investigation.
14 SOLAR ENERGY↗
Strategies and performance of the CMS silicon tracker alignment during LHC Run 2
The strategies for and the performance of the CMS silicon tracking system alignment during the 2015-2018 data-taking period of the LHC are described. The alignment procedures during and after data taking are explained. Alignment scenarios are also derived for use in the simulation of the detector response. Systematic effects, related to intrinsic symmetries of the alignment task or to external constraints, are discussed and illustrated for different scenarios.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Towards high-efficiency particle detection using superconducting microwire arrays
Here, we present a detailed study of an 8-channel 1×1 mm 2 WSi superconducting microwire single photon detector (SMSPD) array exposed to 120 GeV hadron beam and 120 GeV muon beam at the CERN Super Proton Synchrotron H6 beamline. Following up on our first detailed characterization of the efficiency and response of an SMSPD fabricated on a 3 nm WSi film, we report measurements of enhanced particle detection efficiency using a sensor fabricated from a thicker 4.7 nm-thick WSi film. We also report the first SMSPD detection efficiency measurement made for muons. Measurements are enabled by a silicon tracking telescope providing 10 μm in-situ spatial resolution. The results show a fill factor-normalized detection efficiency of 75% and a time resolution of about 130 ps across pixels. These findings represent a significant advancement toward developing high-efficiency SMSPD charged particle tracking systems with simultaneous precision timing, with potential applications in future accelerator-based experiments such as the FCC-ee and Muon Collider.
Cryogenic detectors↗
Towards High-Efficiency Particle Detection Using Superconducting Microwire Arrays
We present a detailed study of an 8-channel $1\times1$~mm$^{2}$ WSi superconducting microwire single photon detector (SMSPD) array exposed to 120~GeV hadron beam and 120~GeV muon beam at the CERN Super Proton Synchrotron H6 beamline. Following up on our first detailed characterization of the efficiency and response of an SMSPD fabricated on a 3~nm WSi film, we report measurements of enhanced particle detection efficiency using a sensor fabricated from a thicker 4.7~nm-thick WSi film. We also report the first SMSPD detection efficiency measurement made for muons. Measurements are enabled by a silicon tracking telescope providing 10~$\mu$m in situ spatial resolution. The results show a detection efficiency of 75\% and a time resolution of about 130~ps across pixels. These findings represent a significant advancement toward developing high-efficiency SMSPD charged particle tracking systems with simultaneous precision timing, with potential applications in future accelerator-based experiments such as the FCC-ee and Muon Collider.
Wang, Christina [Fermilab]↗
Conformal tracking for all-silicon trackers at future electron–positron colliders
Not Available
Brondolin, E.↗
Tracking the Oxidation of Silicon Anodes Using Cryo-EELS upon Battery Cycling
Silicon is a high-capacity material for the anode of a rechargeable lithium-ion battery. One of the fundamental challenges for using Si in anodes is capacity fading, which has been revealed to be partially associated with the interfacial instability between the Si and liquid electrolyte due to the large volume swing of Si upon charging and discharging. Smart nanoscale design concepts, either pre-synthesized or formed in-situ, have led to the mitigation of the detrimental factors associated with the volume swing of Si. However, it has never been clear as how the chemical state of Si evolves and contributes to the capacity fading upon battery cycling. Here, we use cryo-electron energy loss spectroscopy (EELS) to directly monitor, at sub-nanometer scale, the chemical evolution of Si upon battery cycling. We discover that during the cycling process, Si particles are progressively oxidized to form SiO 2 , which is initiated from the particle surface and gradually penetrates toward the interior of the particle, directly contributing to the capacity fading. Possible mechanisms of Si oxidation are postulated. We further show how the cycling stability can be improved by an electrolyte additive to form an effective passivation layer, representatively, even a small concentration of fluoroethylene carbonate (FEC) causes the formation of an LiF layer on the Si nanoparticle surface that prevents Si oxidation and improves cycling stability. Furthermore, the present work unveils Si oxidation as a previously unrecognized factor that contributes to capacity fading, therefore providing insight into the design of anodes with Si based materials.
25 ENERGY STORAGE↗
Silicon wafer fracture stress for tracking sensors in particle physics experiments
For the construction of the ATLAS Inner Tracker strip detector, silicon strip sensor modules are glued directly onto carbon fibre support structures using a soft silicone gel. During tests at temperatures below -35°C, several of the sensors were found to crack due to a mismatch in coefficients of thermal expansion between polyimide circuit boards with copper metal layers (glued onto the sensor) and the silicon sensor itself. While module assembly procedures were developed to minimise variations between modules, cold tests showed a wide range of temperatures at which supposedly comparable modules failed. The observed variance (fracture temperatures between -35°C and -70°C) for supposedly comparable modules suggests an undetected variation between modules suspected to be intrinsic to the silicon wafer itself. Therefore, a test programme was developed to investigate the fracture stress of representative sensor wafer cutoffs. This paper presents results for the fracture stress of silicon sensors used in detector modules.
Detector design and construction technologies and ↗
Search for long-lived charginos based on a disappearing-track signature using 136 fb -1 of pp collisions at $\sqrt{s}$ = 13 TeV with the ATLAS detector
A search for long-lived charginos produced either directly or in the cascade decay of heavy prompt gluino states is presented. The search is based on proton–proton collision data collected at a centre-of-mass energy of $\sqrt{s}$ = 13 TeV between 2015 and 2018 with the ATLAS detector at the LHC, corresponding to an integrated luminosity of 136 fb -1 . Long-lived charginos are characterised by a distinct signature of a short and then disappearing track, and are reconstructed using at least four measurements in the ATLAS pixel detector, with no subsequent measurements in the silicon-microstrip tracking volume nor any associated energy deposits in the calorimeter. The final state is complemented by a large missing transverse-momentum requirement for triggering purposes and at least one high-transverse-momentum jet. No excess above the expected backgrounds is observed. Exclusion limits are set at 95% confidence level on the masses of the chargino and gluino for different chargino lifetimes. Chargino masses up to 660 (210) GeV are excluded in scenarios where the chargino is a pure wino (higgsino). For charginos produced during the cascade decay of a heavy gluino, gluinos with masses below 2.1 TeV are excluded for a chargino mass of 300 GeV and a lifetime of 0.2 ns.
72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
Specifications and pre-production of n + -in-p large-format strip sensors fabricated in 6-inch silicon wafers, ATLAS18, for the Inner Tracker of the ATLAS Detector for High-Luminosity Large Hadron Collider
Abstract The ATLAS experiment is constructing new all-silicon inner tracking system for HL-LHC. The strip detectors cover the radial extent of 40 to 100 cm. A new approach is adopted to use p-type silicon material, making the readout in n + -strips, so-called n + -in-p sensors. This allows for enhanced radiation tolerance against an order of magnitude higher particle fluence compared to the LHC. To cope with varying hit rates and occupancies as a function of radial distance, there are two barrel sensor types, the short strips (SS) for the inner 2 and the long strips (LS) for the outer 2 barrel cylinders, respectively. The barrel sensors exhibit a square, 9.8 × 9.8 cm 2 , geometry, the largest possible sensor area from a 6-inch wafer. The strips are laid out in parallel with a strip pitch of 75.5 μm and 4 or 2 rows of strip segments. The strips are AC-coupled and biased via polysilicon resistors. The endcap sensors employ a “stereo-annulus” geometry exhibiting a skewed-trapezoid shapes with circular edges. They are designed in 6 unique shapes, R0 to R5, corresponding to progressively increasing radial extents and which allows them to fit within the petal geometry and the 6-inch wafer maximally. The strips are in fan-out geometry with an in-built rotation angle, with a mean pitch of approximately 75 μm and 4 or 2 rows of strip segments. The eight sensor types are labeled as ATLAS18xx where xx stands for SS, LS, and R0 to R5. According to the mechanical and electrical specifications, CAD files for wafer processing were laid out, following the successful designs of prototype barrel and endcap sensors, together with a number of optimizations. A pre-production was carried out prior to the full production of the wafers. The quality of the sensors is reviewed and judged excellent through the test results carried out by vendor. These sensors are used for establishing acceptance procedures and to evaluate their performance in the ATLAS collaboration, and subsequently for pre-production of strip modules and stave and petal structures.
Instruments & Instrumentation↗