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At least 19 records

Radiation Tolerant Intelligent Memory Stack (RTIMS)

The Radiation Tolerant Intelligent Memory Stack (RTIMS), suitable for both geostationary and low earth orbit missions, has been developed. The memory module is fully functional and undergoing environmental and radiation characterization. A self-contained flight-like module is expected to be completed in 2006. RTIMS provides reconfigurable circuitry and 2 gigabits of error corrected or 1 gigabit of triple redundant digital memory in a small package. RTIMS utilizes circuit stacking of heterogeneous components and radiation shielding technologies. A reprogrammable field programmable gate array (FPGA), six synchronous dynamic random access memories, linear regulator, and the radiation mitigation circuitries are stacked into a module of 42.7mm x 42.7mm x 13.00mm. Triple module redundancy, current limiting, configuration scrubbing, and single event function interrupt detection are employed to mitigate radiation effects. The mitigation techniques significantly simplify system design. RTIMS is well suited for deployment in real-time data processing, reconfigurable computing, and memory intensive applications.

Ng, Tak-kwong↗

Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Carson, John C.↗

Radiation-Tolerant Intelligent Memory Stack - RTIMS

This innovation provides reconfigurable circuitry and 2-Gb of error-corrected or 1-Gb of triple-redundant digital memory in a small package. RTIMS uses circuit stacking of heterogeneous components and radiation shielding technologies. A reprogrammable field-programmable gate array (FPGA), six synchronous dynamic random access memories, linear regulator, and the radiation mitigation circuits are stacked into a module of 42.7 42.7 13 mm. Triple module redundancy, current limiting, configuration scrubbing, and single- event function interrupt detection are employed to mitigate radiation effects. The novel self-scrubbing and single event functional interrupt (SEFI) detection allows a relatively soft FPGA to become radiation tolerant without external scrubbing and monitoring hardware

Ng, Tak-kwong↗

Common data buffer

Time-shared interface speeds data processing in distributed computer network. Two-level high-speed scanning approach routes information to buffer, portion of which is reserved for series of "first-in, first-out" memory stacks. Buffer address structure and memory are protected from noise or failed components by error correcting code. System is applicable to any computer or processing language.

Byrne, F.↗

Plated wire memory subsystem

The design, construction, and test history of a 4096 word by 18 bit random access NDRO Plated Wire Memory for use in conjunction with a spacecraft input/output and central processing unit is reported. A technical and functional description is given along with diagrams illustrating layout and systems operation. Test data is shown on the procedures and results of system level and memory stack testing, and hybrid circuit screening. A comparison of the most significant physical and performance characteristics of the memory unit versus the specified requirements is also included.

Carpenter, K. H.↗

Petabyte mass memory system using the Newell Opticel(TM)

A random access system is proposed for digital storage and retrieval of up to a Petabyte of user data. The system is comprised of stacked memory modules using laser heads writing to an optical medium, in a new shirt-pocket-sized optical storage device called the Opticel. The Opticel described is a completely sealed 'black box' in which an optical medium is accelerated and driven at very high rates to accommodate the desired transfer rates, yet in such a manner that wear is virtually eliminated. It essentially emulates a disk, but with storage area up to several orders of magnitude higher. Access time to the first bit can range from a few milliseconds to a fraction of a second, with time to the last bit within a fraction of a second to a few seconds. The actual times are dependent on the capacity of each Opticel, which ranges from 72 Gigabytes to 1.25 Terabytes. Data transfer rate is limited strictly by the head and electronics, and is 15 Megabits per second in the first version. Independent parallel write/read access to each Opticel is provided using dedicated drives and heads. A Petabyte based on the present Opticel and drive design would occupy 120 cubic feet on a footprint of 45 square feet; with further development, it could occupy as little as 9 cubic feet.

Newell, Chester W.↗

Spacecraft On-Board Information Extraction Computer (SOBIEC)

The Jet Propulsion Laboratory is the Technical Monitor on an SBIR Program issued for Irvine Sensors Corporation to develop a highly compact, dual use massively parallel processing node known as SOBIEC. SOBIEC couples 3D memory stacking technology provided by nCUBE. The node contains sufficient network Input/Output to implement up to an order-13 binary hypercube. The benefit of this network, is that it scales linearly as more processors are added, and it is a superset of other commonly used interconnect topologies such as: meshes, rings, toroids, and trees. In this manner, a distributed processing network can be easily devised and supported. The SOBIEC node has sufficient memory for most multi-computer applications, and also supports external memory expansion and DMA interfaces. The SOBIEC node is supported by a mature set of software development tools from nCUBE. The nCUBE operating system (OS) provides configuration and operational support for up to 8000 SOBIEC processors in an order-13 binary hypercube or any subset or partition(s) thereof. The OS is UNIX (USL SVR4) compatible, with C, C++, and FORTRAN compilers readily available. A stand-alone development system is also available to support SOBIEC test and integration.

Eisenman, David↗

Observation of Low-Energy Proton Direct Ionization in a 72-Layer 3D NAND Flash Memory

Single-event upsets are observed in a 72-layer 3D NAND flash memory operated in single-level cell mode after low-energy proton (500 keV-1.2 MeV) and heavy ion irradiation. The layer-by-layer error count is analyzed to visualize the stopping of low energy protons within the memory stack, and Monte Carlo simulations are correlated with the experimental data. Direct ionization by low-energy protons is identified by three-dimensional data analysis and the energy dependence of device sensitive cross-section. Heavy ion data is also presented for comparison.

Direct ionization↗

Intelligent Memory Module Overcomes Harsh Environments

Solar cells, integrated circuits, and sensors are essential to manned and unmanned space flight and exploration, but such systems are highly susceptible to damage from radiation. Especially problematic, the Van Allen radiation belts encircle Earth in concentric radioactive tori at distances from about 6,300 to 38,000 km, though the inner radiation belt can dip as low as 700 km, posing a severe hazard to craft and humans leaving Earth s atmosphere. To avoid this radiation, the International Space Station and space shuttles orbit at altitudes between 275 and 460 km, below the belts range, and Apollo astronauts skirted the edge of the belts to minimize exposure, passing swiftly through thinner sections of the belts and thereby avoiding significant side effects. This radiation can, however, prove detrimental to improperly protected electronics on satellites that spend the majority of their service life in the harsh environment of the belts. Compact, high-performance electronics that can withstand extreme environmental and radiation stress are thus critical to future space missions. Increasing miniaturization of electronics addresses the need for lighter weight in launch payloads, as launch costs put weight at a premium. Likewise, improved memory technologies have reduced size, cost, mass, power demand, and system complexity, and improved high-bandwidth communication to meet the data volume needs of the next-generation high-resolution sensors. This very miniaturization, however, has exacerbated system susceptibility to radiation, as the charge of ions may meet or exceed that of circuitry, overwhelming the circuit and disrupting operation of a satellite. The Hubble Space Telescope, for example, must turn off its sensors when passing through intense radiation to maintain reliable operation. To address the need for improved data quality, additional capacity for raw and processed data, ever-increasing resolution, and radiation tolerance, NASA spurred the development of the Radiation Tolerant Intelligent Memory Stack (RTIMS).

Source record↗

NASA Tech Briefs, September 2011

Topics covered include: Fused Reality for Enhanced Flight Test Capabilities; Thermography to Inspect Insulation of Large Cryogenic Tanks; Crush Test Abuse Stand; Test Generator for MATLAB Simulations; Dynamic Monitoring of Cleanroom Fallout Using an Air Particle Counter; Enhancement to Non-Contacting Stress Measurement of Blade Vibration Frequency; Positively Verifying Mating of Previously Unverifiable Flight Connectors; Radiation-Tolerant Intelligent Memory Stack - RTIMS; Ultra-Low-Dropout Linear Regulator; Excitation of a Parallel Plate Waveguide by an Array of Rectangular Waveguides; FPGA for Power Control of MSL Avionics; UAVSAR Active Electronically Scanned Array; Lockout/Tagout (LOTO) Simulator; Silicon Carbide Mounts for Fabry-Perot Interferometers; Measuring the In-Process Figure, Final Prescription, and System Alignment of Large; Optics and Segmented Mirrors Using Lidar Metrology; Fiber-Reinforced Reactive Nano-Epoxy Composites; Polymerization Initiated at the Sidewalls of Carbon Nanotubes; Metal-Matrix/Hollow-Ceramic-Sphere Composites; Piezoelectrically Enhanced Photocathodes; Iridium-Doped Ruthenium Oxide Catalyst for Oxygen Evolution; Improved Mo-Re VPS Alloys for High-Temperature Uses; Data Service Provider Cost Estimation Tool; Hybrid Power Management-Based Vehicle Architecture; Force Limit System; Levitated Duct Fan (LDF) Aircraft Auxiliary Generator; Compact, Two-Sided Structural Cold Plate Configuration; AN Fitting Reconditioning Tool; Active Response Gravity Offload System; Method and Apparatus for Forming Nanodroplets; Rapid Detection of the Varicella Zoster Virus in Saliva; Improved Devices for Collecting Sweat for Chemical Analysis; Phase-Controlled Magnetic Mirror for Wavefront Correction; and Frame-Transfer Gating Raman Spectroscopy for Time-Resolved Multiscalar Combustion Diagnostics.

Source record↗

Segmented Hexagonal Antenna Reflector Concentrically Stacked Using Shape Memory Composite Tubular Hinges

A new architecture for solid surface reflector antennas scalable to sizes greater than 10 m is presented. The design uses compact, light, and simple advanced deployable structures to create sub-reflectors that can be assembled in space into larger units using a robotic arm. The seven-panel hexagonal sub-reflector is divided into hexagonal panels that stack concentrically and vertically. The central panel is connected to each side panel on the back side by a pair of tubular shape memory composite hinges that enable the required deployment kinematics with controlled dynamics. A secondary mechanism closes the interpanel gap. The focus of the paper is on the development of the sub-reflector elements, namely the tubular hinges that use embedded heaters and sensors for triggering and control, the actuation mechanisms, and the lightweight sandwich construction reflector panels. A parametric study using finite element analyses was conducted to assess how design features of the hinge affect its stowage and deployment dynamics. The preliminary component fabrication and testing results for the two-panel assembly breadboard model are outlined. Finally, the results of the test campaign with the brassboard reflector model are presented. A comparison of deployed reflector surface deviation between the measured surface after the stowage and deployment process and the pre-test scans and the nominal surface revealed root mean square errors of less than 1 mm, as required by X-band radiofrequency transmission.

gravity offloading methods↗

Segmented Hexagonal Antenna Reflector Concentrically Stacked Using Shape Memory Composite Tubular Hinges

A new architecture for solid surface reflector antennas scalable to sizes greater than 10 m is presented. The design combines the compact, lightness and simplicity characteristics of advanced deployable structures to create sub-reflectors that can be assembled in space into larger units using a robotic arm and operations under development by a related parallel project. The seven-panel hexagonal sub-reflector is divided into hexagonal panels of that efficiently stack concentrically and vertically. The central panel is connected to each side panel on the back side by a pair of tubular shape memory composite hinges that enable the required deployment kinematics. A secondary mechanism ultimately closes the interpanel gap. The focus of the paper is on the development of the sub-reflector elements, namely the tubular hinges that use embedded heaters and sensors for actuation, the actuation mechanisms, and the lightweight sandwich construction panels. A finite element analysis parametric study assessed how design features of the hinge affect its stowage and deployment dynamics. The component fabrication and testing plans for the two-panel assembly breadboard model are outlined.

deployable reflectors↗

Segmented Hexagonal Antenna Reflector Concentrically Stacked Using Shape Memory Composite Tubular Hinges

A new architecture for solid surface reflector antennas scalable to sizes greater than 10 m is presented. The design combines the compact, lightness and simplicity characteristics of advanced deployable structures to create sub-reflectors that can be assembled in space into larger units using a robotic arm and operations under development by a related parallel project. The seven-panel hexagonal sub-reflector is divided into hexagonal panels of that efficiently stack concentrically and vertically. The central panel is connected to each side panel on the back side by a pair of tubular shape memory composite hinges that enable the required deployment kinematics. A secondary mechanism ultimately closes the interpanel gap. The focus of the paper is on the development of the sub-reflector elements, namely the tubular hinges that use embedded heaters and sensors for actuation, the actuation mechanisms, and the lightweight sandwich construction panels. A finite element analysis parametric study assessed how design features of the hinge affect its stowage and deployment dynamics. The component fabrication and testing plans for the two-panel assembly breadboard model are outlined.

deployable reflectors↗

Segmented Solid Surface Reflector Concentrically Stacked With Tubular Shape Memory Composite Hinges

A new architecture for solid surface reflector antennas scalable to sizes greater than 10 m is presented. The design uses compact, light, and simple advanced deployable structures to create sub-reflectors that can be assembled in space into larger units using a robotic arm. The seven-panel hexagonal sub-reflector is divided into hexagonal panels that stack concentrically and vertically. The central panel is connected to each side panel on the back side by a pair of tubular shape memory composite hinges that enable the required deployment kinematics with controlled dynamics. A secondary mechanism closes the interpanel gap. The focus of the paper is on the development of the sub-reflector elements, namely the tubular hinges that use embedded heaters and sensors for triggering and control, the actuation mechanisms, and the lightweight sandwich construction reflector panels. A parametric study using finite element analyses was conducted to assess how design features of the hinge affect its stowage and deployment dynamics. The preliminary component fabrication and testing results for the two-panel assembly breadboard model are outlined. Finally, the results of the test campaign with the brassboard reflector model are presented. A comparison of deployed reflector surface deviation between the measured surface after the stowage and deployment process and the pre-test scans and the nominal surface revealed root mean square errors of less than 1 mm, as required by X-band radiofrequency transmission.

gravity offloading↗

Stacked-Gate FET's For Analog Memory Elements

Three-terminal, double-stacked-gate field-effect transistor (FET), developed as analog memory element. Particularly suited for use as synapse with variable connection strength in electronic neural network. Provides programmable, nonvolatile resistive connection, somewhat in manner of porous-gate FET described in "Porous-Floating-Gate Field-Effect Transistor" (NPO-17532). Resembles commercial erasable programmable read-only memory (EPROM) device, except for thickness of layers of silicon dioxide electrically isolating gates. Either p-channel or n-channel device.

Thakoor, Anilkumar P.↗

A Novel 3D DRAM Memory Cube Architecture for Space Applications

The first mainstream products in 3D IC design are memory devices where multiple memory tiers are horizontally integrated to offer manifold improvements compared with their 2D counterparts. Unfortunately, none of these existing 3D memory cubes are ready for harsh space environments. This paper presents a new memory cube architecture for space, based on vertical integration of Commercial Off-The-Shelf (COTS), 3D stacked, DRAM memory devices with a custom Radiation-Hardened-By-Design (RHBD) controller offering high memory capacity, robust reliability and low latency.Validation and evaluation of the ASIC controller will be conducted prior to tape-out on a custom FPGA-based emulator platform integrating the 3D-stack.

Yang-Scharlotta, Jean↗