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NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology
Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.
Transferable Output ASCII Data (TOAD) gateway: Version 1.0 user's guide
The Transferable Output ASCII Data (TOAD) Gateway, release 1.0 is described. This is a software tool for converting tabular data from one format into another via the TOAD format. This initial release of the Gateway allows free data interchange among the following file formats: TOAD; Standard Interface File (SIF); Program to Optimize Simulated Trajectories (POST) input; Comma Separated Value (TSV); and a general free-form file format. As required, additional formats can be accommodated quickly and easily.
The GPS Space Service Volume
Prior to the advent of artificial satellites, the concept of navigating in space and the desire to understand and validate the laws of planetary and satellite motion dates back centuries. At the initiation of orbital flight in 1957, space navigation was dominated by inertial and groundbased tracking methods, underpinned by the laws of planetary motion. It was early in the 1980s that GPS was first explored as a system useful for refining the position, velocity, and timing (PVT) of other spacecraft equipped with GPS receivers. As a result, an entirely new GPS utility was developed beyond its original purpose of providing PVT services for land, maritime, and air applications. Spacecraft both above and below the GPS constellation now receive the GPS signals, including the signals that spill over the limb of the Earth. The use of radionavigation satellite services for space navigation in High Earth Orbits is in fact a capability unique to GPS. Support to GPS space applications is being studied and planned as an important improvement to GPS. This paper discusses the formalization of PVT services in space as part of an overall GPS improvement effort. It describes the GPS Space Service Volume (SSV) and compares it to the Terrestrial Service Volume (TSV). It also discusses SSV coverage with the current GPS constellation, coverage characteristics as a function of altitude, expected power levels, and coverage figures of merit.
Navigation Performance of Global Navigation Satellite Systems in the Space Service Volume
This paper extends the results I reported at this year's ION International Technical Meeting on multi-constellation GNSS coverage by showing how the use of multi-constellation GNSS improves Geometric Dilution of Precision (GDOP). Originally developed to provide position, navigation, and timing for terrestrial users, GPS has found increasing use for in space for precision orbit determination, precise time synchronization, real-time spacecraft navigation, and three-axis attitude control of Earth orbiting satellites. With additional Global Navigation Satellite Systems (GNSS) coming into service (GLONASS, Galileo, and Beidou) and the development of Satellite Based Augmentation Services, it is possible to obtain improved precision by using evolving multi-constellation receiver. The Space Service Volume formally defined as the volume of space between three thousand kilometers altitude and geosynchronous altitude ((is) approximately 36,500 km), with the volume below three thousand kilometers defined as the Terrestrial Service Volume (TSV). The USA has established signal requirements for the Space Service Volume (SSV) as part of the GPS Capability Development Documentation (CDD). Diplomatic efforts are underway to extend Space service Volume commitments to the other Position, Navigation, and Timing (PNT) service providers in an effort to assure that all space users will benefit from the enhanced capabilities of interoperating GNSS services in the space domain.
Volumetrically-Derived Global Navigation Satellite System Performance Assessment from the Earths Surface through the Terrestrial Service Volume and the Space Service Volume
NASA is participating in the International Committee on Global Navigation Satellite Systems (GNSS) (ICG)'s efforts towards demonstrating the benefits to the space user from the Earth's surface through the Terrestrial Service Volume (TSV) to the edge of the Space Service Volume (SSV), when a multi-GNSS solution space approach is utilized. The ICG Working Group: Enhancement of GNSS Performance, New Services and Capabilities has started a three phase analysis initiative as an outcome of recommendations at the ICG-10 meeting, in preparation for the ICG-11 meeting. The first phase of that increasing complexity and fidelity analysis initiative was recently expanded to compare nadir-facing and zenith-facing user hemispherical antenna coverage with omnidirectional antenna coverage at different distances of 8,000 km altitude and 36,000 km altitude. This report summarizes the performance using these antenna coverage techniques at distances ranging from 100 km altitude to 36,000 km to be all encompassing, as well as the volumetrically-derived system availability metrics.
2.5/3D Daisy Chain Reliability Evaluation
The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.