Interface thermal conductance in a vacuum.
Interface thermal contact conductance between metals in vacuum studied for data on heat transfer mechanism
CONTACT RESISTANCE↗
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High conductance thermal interface concept for space applications
An interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System.
Poulin, Elizabeth C.↗
Interface thermal conductance of twenty-seven riveted aircraft joints
Explore the source record for details and available documents.
Barzelay, Martin E↗
The thermal conductance of bolted joints
Interface thermal conductance of bolted joints
Fontenot, J. E., Jr.↗
Thermal grease replacement for the modular power subsystem
A comparative thermal conductance test was conducted to evaluate thermal interface materials for use on the Modular Power Subsystem. Materials tested included three thermal pads, four RTV adhesives, bare metal, and one thermal grease. The tests were conducted in a bell jar at vacuum conditions using a 1400 square centimeter footprint and two relatively low contact pressures, 207 kPa and 620 kPa. Power inputs ranged from 100 to 500 watts, and the thermal interface conductance values ranged from 100 to 1700 W/m2 C for the interstitial materials tested. In general, the thermal pads performed a little better than bare metal, while the RTV adhesives performed significantly better than the bare metal and comparable to the thermal grease.
Lapinski, John R., Jr.↗
Thermal conductance of interfaces between titanium nitride and group IV semiconductors at high temperatures
Measuring the temperature dependence of material properties is a standard method for better understanding the microscopic origins for that property. Surprisingly, only a few experimental studies of thermal boundary conductance at high temperatures exist. This lack of high temperature data makes it difficult to evaluate competing theories for how inelastic processes contribute to thermal conductance. To address this, we report time domain thermoreflectance measurements of the thermal boundary conductance for TiN on diamond, silicon-carbide, silicon, and germanium between 120 and 1000 K. In all systems, the interface conductance increases monotonically without stagnating at higher temperatures. For TiN/SiC interfaces, G ranges from 330 to 1000 MW/m2-K, with a room temperature conductance of 750 MW/m2-K. The interface conductance for TiN/diamond ranges from 140 to 950 MW/m2-K. Notably, for all four interfacial systems, the conductance continues to increase with temperature even after all phonon modes in the vibrationally soft material are thermally excited. This observation suggests that inelastic processes are significant contributors to the thermal conductance in all four interfacial systems, regardless of whether the materials forming the interface are vibrationally similar or dissimilar. Our study fills a notable gap in the literature for how interfacial conductance evolves at high temperatures and tests burgeoning theories for the role of inelastic processes in interfacial thermal transport.
Physics↗
Measurements of thermal contact conductance in a vacuum
Thermal interface conductance measurements on small metallic joints in vacuum environment
MEASURING APPARATUS↗
Heat Transfer Analysis in Wire Bundles for Aerospace Vehicles
Design of wiring for aerospace vehicles relies on an understanding of "ampacity" which refers to the current carrying capacity of wires, either, individually or in wire bundles. Designers rely on standards to derate allowable current flow to prevent exceedance of wire temperature limits due to resistive heat dissipation within the wires or wire bundles. These standards often add considerable margin and are based on empirical data. Commercial providers are taking an aggressive approach to wire sizing which challenges the conventional wisdom of the established standards. Thermal modelling of wire bundles may offer significant mass reduction in a system if the technique can be generalized to produce reliable temperature predictions for arbitrary bundle configurations. Thermal analysis has been applied to the problem of wire bundles wherein any or all of the wires within the bundle may carry current. Wire bundles present analytical challenges because the heat transfer path from conductors internal to the bundle is tortuous, relying on internal radiation and thermal interface conductance to move the heat from within the bundle to the external jacket where it can be carried away by convective and radiative heat transfer. The problem is further complicated by the dependence of wire electrical resistivity on temperature. Reduced heat transfer out of the bundle leads to higher conductor temperatures and, hence, increased resistive heat dissipation. Development of a generalized wire bundle thermal model is presented and compared with test data. The steady state heat balance for a single wire is derived and extended to the bundle configuration. The generalized model includes the effects of temperature varying resistance, internal radiation and thermal interface conductance, external radiation and temperature varying convective relief from the free surface. The sensitivity of the response to uncertainties in key model parameters is explored using Monte Carlo analysis.
S L Rickman↗
Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials
Thermal Interface Materials (TIMs) are critical components in spacecraft thermal management systems, where thermal performance is strongly influenced by vacuum conditions, interface contact resistance, and layered metallic joint behavior. However, manufacturer-reported thermal conductivity values are often derived under idealized conditions and may not accurately represent performance within operational aerospace applications. To address this limitation, the Testbed for Advanced Interface Materials in Vacuum (TAIMV) was developed as a modular vacuum-compatible thermal conductivity characterization platform capable of evaluating aerospace-relevant TIM configurations under both ambient and high-vacuum environments. The testbed was derived from the ASTM C1044-16 guarded hot plate methodology and incorporates interchangeable layers of stainless steel coupon geometries, independently controlled main and guard heaters, embedded resistance temperature detectors (RTDs), thermocouples, multi-layer insulation (MLI), and a temperature-controlled cold plate to characterize through-thickness thermal gradients across layered interfaces. In the current configuration, interface compression is limited to the nominal contact pressure generated by the experimental stack assembly. Initial experimental campaigns were conducted at ambient pressure and below 1×10-5 torr for vacuum cases using multiple interface materials including Braycote 601EF and Krytox-based greases across a range of thermal operating conditions. In parallel, a coupled numerical Python thermal model was developed to predict temperature distribution throughout the stack while accounting for conduction, radiation, and parasitic heat transfer pathways and effective interface resistance effects. Experimental measurements and numerical predictions showed consistent thermal trends across multiple operating conditions and environmental states. Results also revealed measurable differences between ambient and vacuum thermal behavior, demonstrating the importance of interface resistance, parasitic heat transfer mechanisms, and stack geometry in determining effective thermal performance within layered thermal interfaces. The presented work establishes a foundation for future thermal model correlation efforts and expanded characterization of aerospace thermal interface materials under representative environmental conditions. Future work will focus on the integration of a load cell system to enable controlled pressure-dependent characterization of thermal interface materials under compressive loading. This capability will allow investigation of the influence of contact pressure on effective thermal conductivity, interface resistance, and thermal performance within layered aerospace thermal interfaces under representative operational conditions.
Thermal Development Testing↗
Modulating thermal conductance at ligand/nanocrystal interfaces via oxygen-coordinated ligands
Here, the interfacial thermal conductance (h lig–NC ) between a cadmium selenide (CdSe) nanocrystal (NC) and three related organic ligands—olealdehyde, oleyl alcohol, and oleic acid—was investigated computationally. These ligands have the same carbon backbone but differ in the number and type of oxygen-coordinated headgroups (carbonyl and/or hydroxyl), leading to distinct bonding geometries involving monodentate and bidentate bonds. For a fully encapsulated NC, h lig–NC increases in the order of olealdehyde, oleic acid, and oleyl alcohol ligands. To isolate the contributions of h lig–NC from each headgroup type, the distinct bonding geometries were analyzed. Aldehyde and alcohol ligands, each featuring a single oxygen headgroup (carbonyl or hydroxyl), exhibit similar O–Cd separations and nearly identical h lig–NC per ligand at full surface coverage. However, the hydroxyl group in the alcohol ligand enables a higher ligand grafting density on the NC surface, resulting in a greater overall h lig–NC than the aldehyde-grafted NCs. In contrast, the oleic acid ligand forms multidentate bonds with the NC, leading to a shorter average O–Cd separation and a higher h lig–NC per ligand compared to monodentate bonds. Nevertheless, steric hindrance from the acid ligand's larger headgroup reduces its grafting density relative to alcohol ligands, ultimately resulting in a lower overall h lig–NC .
Wong, Kae-Lin [Zhejiang Univ., Hangzhou (China)] (↗
Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials
Spacecraft thermal margins depend on the temperature penalty of installed interfaces, yet catalog conductivity omits bondline thickness, mating surfaces, preload, and environment. The Testbed for Advanced Interface Materials in Vacuum (TAIMV) addresses this engineering-data gap by converting ambient/vacuum temperature fields from a four-coupon stack into quantities usable in spacecraft thermal models. Its 17-node steady-state model resolves axial conduction, parasitic fixture paths, grease-filled contact, radiation, and ambient convection. Four monolithic checks gave axial heat-rate ratios of 0.90–1.02, and Braycote calibration self-recovery gave 2.20% casewise mean absolute percentage error (MAPE) and 2.85% maximum difference. With transferable fixture terms frozen, Krytox LVP tested cross-material transfer against a manufacturer-derived external relation. The six Krytox cases gave 2.28% MAPE, 5.10% maximum difference, and full-field residual root-mean-square values of 0.553 °C ambient and 1.306 °C vacuum. Installed-joint resistance spanned 6.39–7.15 × 10⁻⁴ m²·K/W for Braycote and 4.09–4.49 × 10⁻⁴ m²·K/W for Krytox, corresponding to 2.33–6.66 K per modeled interface over the tested heat-flux range. TAIMV therefore supplies directly usable installed-joint resistance and conductance, plus apparent installed conductivity and explicitly model-conditioned grease conductivity/contact terms.
heat transfer↗
Carbon-Fiber Brush Heat Exchangers
Velvetlike and brushlike pads of carbon fibers have been proposed for use as mechanically compliant, highly thermally conductive interfaces for transferring heat. A pad of this type would be formed by attaching short carbon fibers to either or both of two objects that one desires to place in thermal contact with each other. The purpose of using a thermal-contact pad of this or any other type is to reduce the thermal resistance of an interface between a heat source and a heat sink.
Knowles, Timothy R.↗
The Cryogenic Test Bed experiments: Cryogenic heat pipe flight experiment CRYOHP (STS-53). Cryogenic two phase flight experiment CRYOTP (STS-62). Cryogenic flexible diode flight experiment CRYOFD
This paper presents an overview of the Cryogenic Test Bed (CTB) experiments including experiment results, integration techniques used, and lessons learned during integration, test and flight phases of the Cryogenic Heat Pipe Flight Experiment (STS-53) and the Cryogenic Two Phase Flight Experiment (OAST-2, STS-62). We will also discuss the Cryogenic Flexible Diode Heat Pipe (CRYOFD) experiment which will fly in the 1996/97 time frame and the fourth flight of the CTB which will fly in the 1997/98 time frame. The two missions tested two oxygen axially grooved heat pipes, a nitrogen fibrous wick heat pipe and a 2-methylpentane phase change material thermal storage unit. Techniques were found for solving problems with vibration from the cryo-collers transmitted through the compressors and the cold heads, and mounting the heat pipe without introducing parasitic heat leaks. A thermally conductive interface material was selected that would meet the requirements and perform over the temperature range of 55 to 300 K. Problems are discussed with the bi-metallic thermostats used for heater circuit protection and the S-Glass suspension straps originally used to secure the BETSU PCM in the CRYOTP mission. Flight results will be compared to 1-g test results and differences will be discussed.
Thienel, Lee↗
Thermal conductance of two interface materials and their applications in space systems
The temperature control of spacecraft and instrument systems and subsystems requires heat transfer interface materials that possess good thermal and structural characteristics, among other properties, to respond to the vacuum environment of space. These materials must be easy to apply to, and remove from, the surfaces where they are applied, and must be able to withstand power dissipation extremes, and be used for different clamping configurations and pressures. Silicone based greases, used in the past, tend to migrate and to contaminate nearby surfaces. Bare metal to metal contact offers low thermal conductance and difficulties in estimating the actual heat transfer. Several polymeric materials containing different thermal conductive compounds and structural reinforcements were prepared to overcome grease and metal problems. Two polymeric materials were evaluated: Cho-Therm 1671 elastomer; and the CV-2946, a conductive RTV silicone. Tests were done to learn more about these products. Results indicate that the tightly bolted, torqued fixtures did not buckle or distort, and provided optimum thermal conductance. Fixtures simulating actual spacecraft configuration suffered bowing and separating.
Scialdone, J. J.↗
Thermal conductance of two interface materials and their applications in space systems
Two polymeric materials, the Cho-Therm 1671 elastomer and the CV-2946 conductive RTV silicone, have been evaluated. Tests were conducted in vacuum and in air, for many clamping pressures, power densities, and as a function of time. Results obtained show that the CV-2946 thermal conductance after 24 hour in vacuum is 0.62 W/sq cm C(4W/sq in C) when clamped with an average pressure of about 350 psi. The maximum conductance of Cho-Therm 1671 is 4.3 W/sq in C at the clamping pressure about 200 psi. After 72 h in vacuum, the conductance reaches a steady 3.4 W/sq in C, independent of clamping pressure. It is concluded that the tightly bolted, torqued fixtures do not buckle or distort and provide an optimum thermal conductance. The fixtures simulating an actual spacecraft configuration suffered severe bowing and separating, which caused considerable degradation of conductance values.
Scialdone, J. J.↗
Conducting the Heat
Heat conduction plays an important role in the efficiency and life span of electronic components. To keep electronic components running efficiently and at a proper temperature, thermal management systems transfer heat generated from the components to thermal surfaces such as heat sinks, heat pipes, radiators, or heat spreaders. Thermal surfaces absorb the heat from the electrical components and dissipate it into the environment, preventing overheating. To ensure the best contact between electrical components and thermal surfaces, thermal interface materials are applied. In addition to having high conductivity, ideal thermal interface materials should be compliant to conform to the components, increasing the surface contact. While many different types of interface materials exist for varying purposes, Energy Science Laboratories, Inc. (ESLI), of San Diego, California, proposed using carbon velvets as thermal interface materials for general aerospace and electronics applications. NASA s Johnson Space Center granted ESLI a Small Business Innovation Research (SBIR) contract to develop thermal interface materials that are lightweight and compliant, and demonstrate high thermal conductance even for nonflat surfaces. Through Phase II SBIR work, ESLI created Vel-Therm for the commercial market. Vel-Therm is a soft, carbon fiber velvet consisting of numerous high thermal conductivity carbon fibers anchored in a thin layer of adhesive. The velvets are fabricated by precision cutting continuous carbon fiber tows and electrostatically flocking the fibers into uncured adhesive, using proprietary techniques.
Source record↗
Site-Projected Thermal Conductivity: Application to Defects, Interfaces, and Homogeneously Disordered Materials
With the rapid advance of high-performance computing and electronic technologies, understanding thermal conductivity in materials has become increasingly important. This study presents a novel method: the site-projected thermal conductivity that quantitatively estimates the local (atomic) contribution to heat transport, leveraging the Green–Kubo thermal transport equations. The effectiveness of this approach on disordered and amorphous graphene, amorphous silicon, and grain boundaries in silicon–germanium alloys is demonstrated. Amorphous graphene reveals a percolation behavior for thermal transport. The results highlight the potential of the method to provide new insights into the thermal behavior of materials, offering a promising avenue for materials design and performance optimization.
36 MATERIALS SCIENCE↗
Thermally Conductive Tape Based on Carbon Nanotube Arrays
To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.
Kashani, Ali↗