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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Single-Step Shear-Based Deformation Processing of Electrical Conductor Wires

Commercial electrical conductor wires are currently produced from aluminum alloys by multi-step deformation processing involving rolling and drawing. These processes typically require 10 to 20 steps of deformation, since the plastic strain or reduction that can be imposed in a single step is limited by material workability and process mechanics. Here, we demonstrate a fundamentally different, single-step approach to produce flat wire aluminum products using machining-based deformation that also ensures adequate material workability in the formed product. Two process routes are proposed: (1) chip formation by free-machining (FM), with a post-machining, light drawing reduction (<20%) to achieve desired finish and (2) constrained chip formation by large strain extrusion machining (LSEM). Using commercially pure aluminum conductor alloys (Al 1100 and EC1350) as representative material systems, we demonstrate key features of the machining-based processing, including (a) single-step processing to achieve flat wire geometries, (b) surface finish (Ra = 0.2 to 1.0 μm) comparable to that of commercial wire products made by drawing/rolling, (c) deformation control independent of wire size, and (d) hardness increases of 50–150% over that of annealed wires, while retaining high electrical conductivity (>56% IACS). Here, the wire microstructure, which can also be varied via the large-strain deformation parameters, is correlated with mechanical and electrical properties. Implications for commercial manufacture of flat wire products are discussed.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Platinum nanometal interconnection of copper–carbon nanotube hybrid electrical conductors

This study demonstrates the versatility of Joule heating driven chemical vapor deposition to deposit nanometal interconnections into porous CNT roving with application in the production of high electrical conductivity copper-carbon nanotube (Cu-CNT) hybrids. Modifications of vapor deposition parameters allow for deposited nanometal masses from less than 5% w/w to over 85% w/w and distributions that can be controlled towards either hot-spot site-specificity or overall uniformity. Here, depositions of copper, platinum, nickel, palladium, ruthenium, rhodium, and iridium are demonstrated from acetylacetonate precursors. In particular, platinum acetylacetonate [Pt(acac) 2 ] deposits nanometal seeds that adhere tightly to the CNT roving, producing improvements in resistance and specific conductivity. The properties of the platinum deposition compared to the copper deposition motivate an investigation into its use as an interfacial layer for Cu-CNT hybrids. CNT conductors with ~30% w/w platinum are electroplated with copper, densified, and annealed to produce Cu-CNT hybrid conductors with specific conductivities as high as 5772 S m 2 /kg and TCR (from 300 to 600 K) as low as 3.12 × 10 –3 K –1 , indicating good interconnection of the metal and CNT portions. Room temperature conductivities of 29.8 MS/m are achieved, comparable to metallic conductors. Thus, Pt(acac) 2 seeded Cu-CNT hybrids offer abundant promise in high conductivity applications.

42 ENGINEERING↗
DOE OSTI2021

Eddy Current Model of a Coil Over An Infinite Perfectly Electrical Conductor (PEC) Half-Plane

Eddy current sensors measure the lift-off or distance between the sensor and a conducting surface. They operate on the principle of an alternating current in a conduction coil inducing a magnetic field within the surface. An eddy current is set up in the surface to counter the incident magnetic field which, in turn, sets up a magnetic field which counters that of the coil. This changes the coil impedance which is a function of the lift-off. As the lift-off increases, the effect of the eddy current magnetic field on the coil magnetic field weakens, resulting in a higher inductance and lower resistance. Thus, the lift-off may be derived from an impedance measurement. Dodd and Deeds developed an analytic model for an eddy current sensor coil impedance with an air core which has been implemented in MATLAB. LLNL assembled an eddy current sensor with a mu-metal core for which there is no analytic model. Rather than derive an analytic model which includes the mu-metal core, analytic empirically based functions are derived to map the Dodd and Deeds model to measured inductance and resistance.

42 ENGINEERING↗
DOE OSTI2022

Partial discharge sensor

An approach to detecting partial discharge events involves retrofitting an electrical system to include a capacitive sensor configured to capacitively sense partial discharge events of a component of the electrical system. The capacitive sensor has a first electrical conductor that forms a first terminal of the capacitive sensor, a second electrical conductor that forms a second terminal of the capacitive sensor, and a dielectric that separates the first electrical conductor and the second electrical conductor. The capacitive sensor generates an electrical sensor signal at an output of the capacitive sensor in response to the partial discharge event. The electrical sensor signal is converted to an optical signal and the optical signal is processed to detect an occurrence of the partial discharge event.

Karin, Todd↗
DOE OSTI2021

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗
DOE OSTI2022

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗
DOE OSTI2022

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗
DOE OSTI2023

Electrostatic charge buildup and electrostatic discharge monitoring system and method

A system for monitoring electrostatic charge buildup and electrostatic discharge (ESD) remotely comprises a plurality of electrostatic charge measurement units and a data acquisition device. Each electrostatic charge measurement unit includes a primary charge plate, a static sensor device, a secondary charge plate, and a shielded cable. The primary charge plate is positioned proximal to an object. The static sensor device includes an input sensor at which an electric voltage is measured and outputs an electronic signal whose level varies according to the measured electric voltage. The secondary charge plate is positioned in proximity to the input sensor of the static sensor device. The shielded cable includes an inner conductor electrically connected to the primary charge plate and the secondary charge plate and an outer conductor electrically connected to electrical ground. The data acquisition device receives the electronic signal from the static sensor device of each electrostatic charge measurement unit.

Schantz, Eric T.↗
DOE OSTI2020

Semiconductor power device including wire or ribbon bonds over device active region

A semiconductor power device including a base plate; an input lead; an output lead; a field effect transistor (FET) power die disposed over the base plate, wherein the FET power die includes a set of source fingers, a set of drain fingers, and a set of gate fingers disposed directly over an active region, wherein the gate fingers are configured to receive an input signal from the input lead, and wherein the FET power die is configured to process the input signal to generate an output signal at the drain fingers for routing to the output lead; and electrical conductors (wirebonds or ribbons) bonded to the source and/or drain directly over the active region of the FET power die. The electrical conductors produce additional thermal paths between the active region and the base plate for thermal management of the FET power die.

42 ENGINEERING↗
DOE OSTI2023

Hierarchical thermal-conductive polymer nanocomposites for thermal management

Managing heat in electrical conductors is a major challenge to meet the demands for sustainable energy use and electrical reliability, most notably power electronics and energy-critical electrical machines. Achieving such disparate functionalities, such as high temperature thermal and electrical reliability, require rational design and manufacturing of thermal conductor material and its hierarchical structures. Here we present hierarchical thermal-conductive nanocomposites, consisting of nanostructured ceramic conformal coating and aligned ultrahigh molecular weight polyethylene fiber, to tailor heat dissipation in electric conductors. The hybrid aligned thermal interface exhibits a highly desirable temperature dependent anisotropic high thermal conductivity with 0.98W m –1 K –1 and dielectric strength with 3.4. In addition, electrically insulating thermal interfaces demonstrate high-performing and reliable electrical systems under the dynamic load conditions. The surface temperature of heterogeneous ceramic-polymer encapsulated conductor is 17.8 °C lower than that of polymer-encapsulated conductor at the same electrical load. Consequently, the findings shown here hold great promises for directing heat extraction in electrical machine systems, advancing thermal management for emerging electronic applications.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Statistical Profiles of E1 EMP Coupling to Single Conductors

An electro-magnetic pulse (EMP) event can induce large currents and voltages on electrical conductors such as electrical power transmission lines which span many kilometers and the shorter lines typically tens of meters in length used to monitor equipment controlling the power grid. The exact current and voltage induced on a conductor depends on many factors, such as line height, diameter and length as well as ground conductivity and the location of the EMP event relative to the conductor. The current work focus on the line location and orientation relative to the EMP source. A statistical, Monte-Carlo approach is used in sampling the line configuration and then calculating the induced current and voltage. Thousands of EMP events are simulated on the region of the Earth where the EMP event can couple to a given above-ground conductor and the resulting current and voltage is then calculated on that conductor. Through the many simulations, one can assemble statistics on the insult including the peak value, rise time and pulse width.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2023

Strength-conductivity synergy via lean alloy design: A study on novel solid stir extrusion of an Al-2Cu-0.1 Nb-0.15Zr (~wt.%) alloy

Aluminum alloys find wide applications in power and transmission cables, and electrical conductors due to their advantageous properties of high electrical conductivity, and lower cost per unit. However, the lower tensile strength compared to copper poses a challenge for the mechanical stability of aluminum-based cables. In this study, we addressed this issue by adopting a process-based alloy design approach, creating a lean alloy with a dilute composition of Al-2Cu-0.1 Nb-0.15Zr (~wt.%). Here, the alloy was processed using a friction stir based novel SolidStir® (SSE) technique, followed by low-temperature aging. The resulting aluminum wire exhibited improved strength (240 MPa) while simultaneously enhancing electrical conductivity (64%IACS). The study employed computational simulations (Thermocalc) and experimental techniques (differential scanning calorimetry and transmission electron microscopy) to thoroughly investigate the microstructure. Microstructural examinations revealed that the precipitation kinetics in SSE and SSE+aged conditions played a significant role in enhancing strength and electrical conductivity. These findings demonstrate the successful achievement of high strength and high electrical conductivity in aluminum wire through a lean alloy design approach.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Insulating Nanofluids and Solids to Upgrade our Large Aging Transformer Equipment (Advanced Research Projects Agency – Energy Research Final Report)

This project developed a highly promising, minimally invasive pathway for transformers with up to double the thermal life that is achieved today. Thermal life is important because it is occasionally necessary to overload transformers in service and this overload raises the internal temperature, accelerating aging2. A seminal initial finding in the research was that a likely achievable increase in the thermal conductivity of the transformer paper could double the thermal life. Oil-impregnated paper is used to wrap the electrical conductors in a transformer to provide a good balance of electrical insulation and thermal conductivity. The novel approach to increase the thermal conductivity was to add micrometer boron nitride particles to the paper during manufacturing. This is encouraging because it provides benefits with minimal impact on the manufacturing processes of the paper or of a transformer.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2025

Implementation of Johnson Noise Thermometry into Radiation Hardened Electronics

The random motion of charge carriers in an electrical conductor is a function of its temperature. This phenomenon generates an electrical signal, referred to as Johnson noise, that is present in all analog signals. Conversely, the temperature dependence of the Johnson noise spectrum also enables a direct measurement of absolute temperature, which can provide a secondary measurement of temperature when quantified using sensors such as resistive temperature devices (RTDs) in a process called Johnson noise thermometry (JNT). For nuclear environments, this is of particular interest in correcting for RTDs signal drift caused by accumulation, transmutation, and displacement damage caused by neutron and gamma irradiation.

42 ENGINEERING↗
DOE OSTI2023

Effect of surface roughness on phase transition timing in megaampere pulsed-power–driven exploding conductors

An understanding of material phase transitions in megaampere pulsed-power–driven exploding conductors is important for predicting the growth of hydrodynamic instabilities in magneto-inertial fusion concepts. Here, this study analyzes phase transitions in electrical conductor explosions using 1D Lagrangian and 2D arbitrary Lagrangian–Eulerian resistive magnetohydrodynamic simulations to show that micrometer-scale surface roughness can lead to the electrothermal instability (ETI), a feedback effect that concentrates resistive heating and leads to early melting and ablation. Simulations of the Mykonos electrothermal instability II (METI-II) experiment show melting begins 19% sooner for machined rods with micrometer-scale surface roughness than for rods without these features. The surface magnetic field is 41 T around the initial region of melt, representing a lower magnitude than both the 86 T from 1D simulations and the 85 T threshold reported elsewhere. In 2D simulations with micrometer-scale surface roughness, temperature measurements indicate the critical point temperature of aluminum is reached 17% faster in comparison with 1D simulations. Values from 2D simulations with surface roughness align with predictions from ETI theory, and the observed temperature redistribution further supports the ETI as an underlying mechanism. Simulation results are validated against experimental photonic Doppler velocimetry data. This study shows 1D simulations are adequate to model conductors with sub-micrometer-scale surface roughness in this high-energy-density regime; however, 2D or 3D simulations are required to capture the full range of physics for accurately describing phase transitions in conductors with micrometer-scale or larger surface roughness.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2023

Semiconductor Thermal and Electrical Properties Decoupled by Localized Phonon Resonances

Abstract Thermoelectric materials convert heat into electricity through thermally driven charge transport in solids or vice versa for cooling. To compete with conventional energy‐conversion technologies, a thermoelectric material must possess the properties of both an electrical conductor and a thermal insulator. However, these properties are normally mutually exclusive because of the interconnection between scattering mechanisms for charge carriers and phonons. Recent theoretical investigations on sub‐device scales have revealed that nanopillars attached to a membrane exhibit a multitude of local phonon resonances, spanning the full spectrum, that couple with the heat‐carrying phonons in the membrane and cause a reduction in the in‐plane thermal conductivity, with no expected change in the electrical properties because the nanopillars are outside the pathway of voltage generation and charge transport. Here this effect is demonstrated experimentally for the first time by investigating device‐scale suspended silicon membranes with GaN nanopillars grown on the surface. The nanopillars cause up to 21% reduction in the thermal conductivity while the power factor remains unaffected, thus demonstrating an unprecedented decoupling in the semiconductor's thermoelectric properties. The measured thermal conductivity behavior for coalesced nanopillars and corresponding lattice‐dynamics calculations provide evidence that the reductions are mechanistically tied to the phonon resonances. This finding paves the way for high‐efficiency solid‐state energy recovery and cooling.

Spann, Bryan T.↗