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Results for “electronic detector readout concepts (solid state)”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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13 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Low power on-chip data transmission for wafer-scale monolithic active pixel sensors

Here, this paper details the implementation of the digital pulse shaping subsystem within the Backbone Transmission Line Encoding (BTLE) driver, a low-power, long-distance on-chip data transmission solution designed in a 65 nm CMOS process. Digital pulse shaping is critical for minimizing inter-symbol interference (ISI) caused by bandwidth limitations of on-chip interconnects, especially in wafer-scale monolithic active pixel sensors (MAPS). A duobinary encoder coupled with a parallelized polyphase finite impulse response (FIR) filter is used for efficient shaping of the transmitted signal spectrum. This reconfigurable architecture achieves reliable 160 Mb/s data transfer over a 10 cm on-chip link, as validated by simulations demonstrating low power consumption (FoM 37.3 fJ/bit/mm of transmission line length) and effective ISI mitigation.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Characterization of a gigabit transceiver for the ATLAS inner tracker pixel detector readout upgrade

We present a gigabit transceiver prototype Application Specific Integrated Circuit (ASIC), GBCR, for the ATLAS Inner Tracker (ITk) Pixel detector readout upgrade. GBCR is designed in a 65-nm CMOS technology and consists of four upstream receiver channels, a downstream transmitter channel, and an Inter-Integrated Circuit (I2C) slave. The upstream channels receive the data at 5.12 Gbps passing through 5-meter 34-American Wire Gauge (AWG) Twin-axial (Twinax) cables, equalize and retime them with a recovered clock, and then drive an optical transmitter. The downstream channel receives the data at 2.56 Gbps from an optical receiver and drives the cable as same as the upstream channels. The jitter of the upstream channel output is measured to be 35 ps (peak-peak) when the Clock-Data Recovery (CDR) module is turned on and the jitter of the downstream channel output after the cable is 138 ps (peak-peak). The power consumption of each upstream channel is 72 mW when the CDR module is turned on and the downstream channel consumes 27 mW. GBCR survives the total ionizing dose of 200 kGy.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Characterization of an architecture for front-end pixel binning in an integrating pixel array detector

Optimization of an area detector involves compromises between various parameters like frame rate, read noise, dynamic range and pixel size. We have implemented and tested a novel front-end binning design in a photon-integrating hybrid pixel array detector using the MM-PAD- 2.0 pixel architecture. In this architecture, the pixels can be optionally binned in a 2 x 2 pixel configuration using a network of switches to selectively direct the output of 4 sensor pixels to a single amplifier input. Doing this allows a trade-off between frame rate and spatial resolution. Tests show that the binned pixels perform well, but with some degradation on performance as compared to an un-binned pixel. The increased parasitic input capacitance does reduce the signal collected per x-ray as well as increases the noise of the pixel. Here, the increase in noise is, however, less than the factor of 2 increase one would observe for binning in post-processing. Spatial scans across the binned pixels show that no measured signal intensity is lost at the inner binning unit boundaries. In the high flux regime, at a 2 x 2 pixel wide beam spot (FWHM) size, binned mode responds linearly up to a photon flux of 10 7 x-rays/s, and performs comparably with un-binned mode up to a photon flux of 10 8 x-rays/s. While this study demonstrates a proof of concept for front-end binning in integrating detectors, we also identify changes to this early-stage prototype which can further improve the performance of binning pixel structures.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Characterization of 128 × 128 MM-PAD-2.1 ASIC: a fast framing hard x-ray detector with high dynamic range

Here, we characterize a new x-ray Mixed-Mode Pixel Array Detector (MM-PAD-2.1) Application Specific Integrated Circuit (ASIC). Using an integrating pixel front-end with dynamic charge removal architecture, the MM-PAD-2.1 ASIC extends the maximum measurable x-ray signal (in 20 keV photon units) to > 10 7 x-rays/pixel/frame while maintaining a low read noise across the full dynamic range, all while imaging continuously at a frame rate of up to 10 kHz. The in-pixel dynamic charge removal mechanism prevents saturation of the input amplifier and proceeds in parallel with signal integration to achieve deadtime-less measurements with incident x-ray rates of > 10 10 x-rays/pixel/s. The ASIC format consists of 128 × 128 square pixels each 150 μm on a side and is designed to be 3-side buttable so large arrays can be effectively tiled. Here we use both laboratory x-ray sources and the Cornell High Energy Synchrotron Source (CHESS) to characterize two single ASIC prototype detectors for both low (single x-ray) and high incident flux detection. In the first detector the ASIC was solder bump-bonded to a 500 μm thick Si sensor for efficient detection of x-rays below 20 keV, whereas the second detector used a 750 μm thick CdTe sensor for x-rays above ~20 keV.

36 MATERIALS SCIENCE↗
DOE OSTI2022

The Majorana Demonstrator readout electronics system

The M AJORANA D EMONSTRATOR comprises two arrays of high-purity germanium detectors constructed to search for neutrinoless double-beta decay in 76 Ge and other physics beyond the Standard Model. Its readout electronics were designed to have low electronic noise, and radioactive backgrounds were minimized by using low-mass components and low-radioactivity materials near the detectors. This paper provides a description of all components of the M AJORANA D EMONSTRATOR readout electronics, spanning the front-end electronics and internal cabling, back-end electronics, digitizer, and power supplies, along with the grounding scheme. The spectroscopic performance achieved with these readout electronics is also demonstrated.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
DOE OSTI2023

Electrical performances of pre-production staves for the ATLAS ITk Strip Detector Upgrade

The ATLAS experiment is currently preparing for an upgrade of the inner tracking detector for the High-Luminosity LHC. The new tracker, ITk, employs an all-silicon detector with outer strip layers. The building block of the ITk strip barrel is the stave which consists of a low-mass support structure hosting the common electrical, optical and cooling services as well as 28 silicon modules. In this contribution, we outline the challenging aspects of the stave pre-production testing phase at Brookhaven National Laboratory. Here, the electrical characterization of these staves, hosting the final design of all ASICs, will be discussed in detail.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2023

High spatial resolution direct conversion amorphous selenium X-ray detectors with monolithically integrated CMOS readout

Recent progress in the field of micron-scale spatial resolution direct conversion X-ray detectors for high-energy synchrotron light sources serve applications ranging from nondestructive and noninvasive microscopy techniques which provide insight into the structure and morphology of crystals, to medical diagnostic measurement devices. Amorphous selenium ( a -Se) as a wide-bandgap thermally evaporated photoconductor exhibits ultra-low thermal generation rates for dark carriers and has been extensively used in X-ray medical imaging. Being an amorphous material, it can further be deposited over large areas at room temperatures and at substantially lower costs as compared to crystalline semiconductors. Here, to address the demands for a high-energy and high spatial resolution X-ray detector for synchrotron light source applications, we have thermally evaporated a -Se on a Mixed-Mode Pixel Array Detector (MM-PAD) Application Specific Integrated Circuit (ASIC). The ASIC format consists of 128 × 128 square pixels each 150 μm on a side. A 200 μm a -Se layer was directly deposited on the ASIC followed by a metal top electrode. The completed detector assembly was tested with 45 kV Ag and 23 kV Cu X-ray tube sources. The detector fabrication, performances, Modulation Transfer Function (MTF) measurements, and simulations are reported.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Event driven readout architecture with non-priority arbitration for radiation detectors

A novel event driven readout architecture, EDWARD (Event Driven with Access and 8 Reset Decoder) architecture, for highly granular pixel detectors is presented. It incorporates, inter alia, an asynchronous arbitration tree based on Seitz' arbiters, removing the need for an imposed prioritization scheme. It also provides protection against glitches during readout. The system allows not only reading pixel activities, but also retrieving additional data, both analog and digital, from the pixels. A novel in-channel logic allows the entire readout process to be split into consecutive phases for additional flexibility. All operations are controlled by only one edge of the clock signal, seen as an acknowledge token, so there is no dead time between readouts.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Event-driven readout development: testing of the EDWARD65P1 chip with integrated event generators

Building on a prototype readout integrated circuit for segmented silicon sensors with the EDWARD event-driven readout architecture, the front-end in each pixel was replaced by a hardware generator to verify readout performance, ensuring no data loss, consistent priority handling, and speed verification. Here, this generator produces Poisson-distributed readout requests with individually tunable rates per pixel via a digitally controlled oscillator. The resulting EDWARD65P1 test ASIC is a 32×32 pixel matrix with a 100 μm pitch, equipped with digital event generators simulating radiation hits at user-defined rates. Test results for this new design are presented.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

A novel silicon photomultiplier readout architecture for low-light applications

In this article we describe the photon detection readout electronics for the nEDM@SNS experiment. The chosen "photon counting" architecture, which utilizes high-efficiency silicon photomultipliers (SiPMs) and is appropriate for low-light applications, allows the use of a relatively high SiPM operating voltage. This maximizes photon detection efficiency and minimizes gain/efficiency voltage-dependence while eliminating direct optical cross-talk.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Integration of EDWARD readout architecture in full-field fluorescence imaging detector

Data bandwidth, timing resolution and resource utilization in readouts of radiation detectors are a constant challenge. Event driven solutions are pushing against well-trenched framed solutions. The idea for an asynchronous readout architecture called EDWARD ( E vent- D riven W ith A ccess and R eset D ecoder) was presented at the TWEPP 2021 conference. Here we show the progress of our work which resulted in two chip prototypes. The first one, named 3FI65P1, is a full device with the analog pixel circuitry suited for full-field fluorescence imaging. It is already manufactured, and preliminary results are presented. Finally, the second chip, named EDWARD65P1, contains digital pulse generators with Poisson-exponential distribution in each pixel for extraction of the performance matrix of the EDWARD architecture alone.

47 OTHER INSTRUMENTATION↗
DOE OSTI2024

Beam test performance studies of CMS Phase-2 Outer Tracker module prototypes

A new tracking detector will be installed as part of thePhase-2 upgrade of the CMS detector for the high-luminosity LHC era.This tracking detector includes the Inner Tracker, equipped withsilicon pixel sensor modules, and the Outer Tracker, consisting ofmodules with two parallel stacked silicon sensors. The Outer Trackerfront-end ASICs will be able to correlate hits from chargedparticles in these two sensors to perform on-module discriminationof transverse momenta (p$_{T}$). The p$_{T}$information is generated at a frequency of 40 MHz and will be usedin the Level-1 trigger decision of CMS. Prototypes of theso-called 2S modules were tested at the Test Beam Facility at DESYHamburg between 2019 and 2020. These modules use the finalfront-end ASIC, the CMS Binary Chip (CBC), and for the firsttime the Concentrator Integrated Circuit (CIC), optical readoutand on-module power conversion. In total, seven modules were tested,one of which was assembled with sensors irradiated with protons. Animportant aspect was to show that it is possible to read out modulessynchronously. A cluster hit efficiency of about 99.75 % wasachieved for all modules. The CBC p$_{T}$ discriminationmechanism has been verified to work together with the CIC andoptical readout. The measured module performance meets therequirements for operation in the upgraded CMS tracking detector.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2023

First results from a multiplexed and massive instrument with sub-electron noise Skipper-CCDs

Here, we present a new instrument composed of a large number of sub-electron noise Skipper-CCDs operated with a two stage analog multiplexed readout scheme suitable for scaling to thousands of channels. New, thick, 1.35 Mpix sensors, from a new foundry, are glued into a Multi-Chip Module (MCM) printed circuit board on a ceramic substrate which has 16 sensors each. The instrument, that can hold up-to 16 MCMs, a total of 256 Skipper-CCD sensors (called a Super-Module with ≈ 130 grams of active mass and 346 Mpix), is part of the R&D effort of the OSCURA experiment which will have ≈ 94 super-modules. Experimental results with 10 MCMs and 160 Skipper-CCDs sensors are presented in this paper. This is already the largest ever built instrument with single electron sensitivity CCDs using nondestructive readout, both, in terms of active mass and number of channels.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗