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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. Here, to increase power density, performance, efficiency, and reliability-as well as to reduce cost-innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental R&D related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics, packaging materials, thermal materials and interfaces, fluid-based thermal management technologies, reliability, condition monitoring, and prognostics. Latest developments in this area are published as a Special Section on Multiphysics Aspects of Power Electronics Packaging. The first part was published in the May 2024 issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume 14, Issue 5). The second part of that Special Section is being published in this issue. A brief summary of the papers included in the second part are given below.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level - Part 1

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. To increase power density, performance, efficiency, and reliability and reduce cost, innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental research and development related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics; packaging materials; thermal materials and interfaces; fluid-based thermal management technologies; reliability; condition monitoring; and prognostics. To address these important aspects, this Special Section on Multiphysics Aspects of Power Electronics Packaging includes several articles to be published in two parts. More details are given below on the articles included in the first part.

condition monitoring↗
DOE OSTI2024

HTESP (High-throughput electronic structure package): A package for high-throughput ab initio calculations

High-throughput ab initio calculations are the indispensable parts of data-driven discovery of new materials with desirable properties, as reflected in the establishment of several online material databases. The accumulation of extensive theoretical data through computations enables data-driven discovery by constructing machine learning and artificial intelligence models to predict novel compounds and forecast their properties. Efficient usage and extraction of data from these existing online material databases can accelerate the next stage materials discovery that targets different and more advanced properties, such as electron–phonon coupling for phonon-mediated superconductivity. However, extracting data from these databases, generating tailored input files for different ab initio calculations, performing such calculations, and analyzing new results can be demanding tasks. Here, in this work, we introduce a software package named “HTESP” (High-Throughput Electronic Structure Package) written in Python and Bash languages, which automates the entire workflow including data extraction, input file generation, calculation submission, result collection and plotting. Our HTESP will help speed up future computational materials discovery processes.

36 MATERIALS SCIENCE↗
DOE OSTI2020

BEEAM (Building Electrical Efficiency Analysis Model) [SWR-20-107]

Modern high-performance buildings exhibit an increasing number of building loads that use direct current (DC) electricity internally, rather than alternating current (AC), due to the advent of low-cost computing and advanced power electronics. Powering DC devices from the AC grid requires AC/DC power conversion, which introduces energy losses and reduces efficiency. As DC loads proliferate, the cumulative wasted energy associated with hundreds of millions of AC/DC converters has become one of the broadest energy savings opportunities in buildings. DC power distribution systems have been proposed as an elegant and transformative solution to the problem of DC devices. In a DC distribution system, the building's wires carry DC electricity, rather than AC; and a few centralized, highly efficient AC/DC converters replace the many smaller, less efficient converters that serve individual DC loads. Unfortunately, the trade-offs associated with DC distribution systems are not well understood. Reported energy savings associated with DC power distribution differ widely and have not been well validated. The Building Electrical Efficiency Analysis Model (BEEAM) is a Modelica library that simulates the efficiency of building electrical distribution systems using harmonic power flow. BEEAM can model a wide variety of building distribution topologies, including three-phase AC, single-phase AC, unipolar DC, bipolar DC, and hybrid networks under both balanced and unbalanced load conditions. BEEAM accurately models power electronic converter losses, provides granular estimates of losses throughout the distribution system, and properly models efficiency at part load conditions. Users can package BEEAM within a functional mockup unit (FMU), enabling co-simulation with other modeling platform, such as EnergyPlus. In summary, BEEAM provides a tool suite for fair and accurate comparison of the efficiency of building electrical distribution systems, including AC, DC, and hybrid systems.

Frank, Stephen↗
DOE OSTI2022

Dynamic Measurements of the Structural Evolution of Material Defects at the Mesoscale

This is a technical report to be published as part of the FY2021 annual overview package. We have designed experiments and developed analytical methods using images from x-ray and electron microscopy in order to quantify the behavior of crystal dislocation defects at their native nanometer-length and micro-length scales. The results of these analyses are used to directly inform theoretical physics models and guide interpretation of dark field x-ray microscopy (DFXM) images that offer spatial resolution surpassing the resolution of beamline optics. Additionally, we developed new analytical methods to automate the alignment of optics hardware used in both synchrotron and x-ray free electron laser beamline facilities. The tools and workflows developed for this project are now being deployed as proof-of-concept in reaction history analysis (RHA) for future programmatic integration.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

Overview of the front-end electronics of CMS HGCal - including readout and powering

The end-cap calorimeters of CMS will be upgraded to a single High Granularity Calorimeter (HG-Cal) for the HL-LHC, including both silicon sensors and scintillator tiles with on-tile SiPMs as active elements. The readout of the active elements is performed by an ASIC (HGCROC in 130 nm CMOS technology) that measures the amplitude and arrival time of the signals. The amplitude is measured over a large dynamic range to allow calibration with single particles and the measurement of TeV showers. The time of arrival of high-energy showers will be measured with a precision of around 30 ps. A second pair of “concentrator” ASICs - ECON-T and ECON-D - takes the data from the HGCROC channels and packages them for transmission via optical links to the off-detector electronics. The ECON-T transmits trigger data at 40 MHz, to form part of the level-1 trigger. The ECON-D transmits concentrated data packets at up to 1 MHz, upon reception of a level-1 trigger signal. In addition to these ASICs, HGCal will use modified versions of common HL-LHC electronics developments, for the power chain and the optical control and readout. The dense nature of the HGCal provides additional challenges for the electronic boards and cabling. In this proceedings the overall HGCal front electronics scheme, including the latest performance of the HGCROC and ECON ASICs is presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2022

Experiments and modelling of adhesive failure initiation of an epoxy underfill: a study of electronic packaging survivability

Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.

42 ENGINEERING↗
DOE OSTI2022

Quantum Chemical Treatment of Strongly Correlated Magnetic Systems Based on Heavy Elements. Final Report

The objective of this project over the years has been to develop novel quantum chemical methods and employ them to study the chemistry of systems containing actinides, and transactinides. We have focused on their electronic and spectroscopic properties, their reactivity and utilization as single molecule magnets. We have developed wave-function based methods that are optimal to treat strongly correlated systems, namely systems with many electronic configurations that are all important and should be treated on an equal foot. Moreover, relativistic effects have to be included in the model, with special focus on spin-orbit coupling. We have derived our theories and developed our codes and made them available to the community as parts of open source packages. We have modelled systems in collaboration with experimentalists in the program, so that we could address some of the questions that are relevant to this community. We have also worked in collaboration with people at Lawrence Livermore National Laboratories on a project on super-heavy atoms. We hope that our theoretical predictions will inspire novel experiments. We have trained about 10 students/postdocs during this period, which are now faculty, researchers at national laboratories and in companies.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2025

Myna: Connecting powder bed fusion build data to simulation tools for digital twin applications

Additive manufacturing (AM), as a digital process, can generate a detailed digital thread linking a part’s design and manufacturing to its operational performance. As AM systems advance, an increasing amount of process data is stored in manufacturing databases. In principle, this data can be utilized by simulation-based digital twin approaches, such as real-time process control and asynchronous post-processing guidance. However, few tools currently exist for systematically integrating digital thread data with computational tools. Here, in this study, we propose a software package, called Myna, for connecting data from powder bed fusion processes to simulation tools. The utility of such a platform is demonstrated using build data from the Oak Ridge National Laboratory Manufacturing Demonstration Facility “Peregrine v2023-10” public dataset to automatically configure and run 54 semi-analytical 3DThesis melt pool simulations, 78 numerical Additive FOAM melt pool simulations, and 3 ExaCA microstructure simulations. The simulated, spatially registered microstructures are then compared directly with electron backscatter diffraction characterization of the corresponding as-built part locations. The resulting simulated microstructure showed variation as a function of process parameters, particularly stripe width; however, the experimental data had little variation between the microstructure texture and grain size resulting from different processing conditions. Analysis of the discrepancies suggest that it is possible a two-phase ferritic-austenitic solidification model is needed to accurately predict grain size and texture for certain stainless steel 316L feedstock compositions under powder bed fusion conditions, providing direction for future research. As illustrated here, due to the number and complexity of the simulations involved in AM process-structure–property predictions, automated methods to connect process data and simulations will remain necessary tools for testing hypotheses and implementing digital twin applications.

Knapp, Gerald L. [Oak Ridge National Laboratory (O↗
DOE OSTI2020

Guest Editorial: Special Issue on InterPACK 2019 - Part 1

This is a collection of papers drawn from the 2019 ASME InterPACK Conference. The content spans the areas of heterogeneous integration, servers, flexible and wearable electronics, photonics, power electronics, energy storage, and autonomous and electric vehicles.

47 OTHER INSTRUMENTATION↗
DOE OSTI2026

A Graphical User Interface for the Deep Underground Neutrino Experiment Robotic Test Stand

In preparation for DUNE, Fermilab along with six other institutions are testing cold electronics for quality control before components placed in the far detector. We test them by using a robotic arm that places these chips into sockets on a computer board that will test their functionality. Up until now, the chips have been tested using a command line script that drives a state machine to conduct tests step-by-step. In order to lower the skill barrier to conduct tests and to speed up the quality control process, I was tasked to create a graphical user interface that would allow users to use buttons, text boxes, and drop-down menus to input information and tell the testing state machine how to operate. I had to learn about the Python package Tkinter to start the process of widget placement. I further developed a pause feature unused in the previous command line script that would allow the user to shut down testing gracefully, bring the robotic arm to go back to ground state, and go forward or backward a step in the testing process. After completing the basic functionality of the GUI, I started testing production chips with the GUI to debug. Some issues were found, which required me to further develop parts of the inherited state machine code. The code for the GUI has now been pushed into the copy the DUNE/FD_CE git repository and will soon be merged with the official DUNE/FD_CE repository so that the other institutions testing DUNE cold electronics can use and expand upon it.

Gutierrez Villanueva, Jaziel [Fermilab]↗
DOE OSTI2024

High power density compact drive integrated motor for electric transportation

This project, initially part of OPEN 2018, and subsequently the ASCEND effort, targeted demonstration of significant enhancements in internal permanent magnet (IPM) motor torque and power density for current and future ground and air electric transportation applications. These were achieved through: (1) embedded two-phase system thermal management, (2) coupled, multi-scale electrical-electromagnetic-thermal-mechanical co-design and optimization, (3) size and weight reduction of motor and drive electronics through elimination of redundant cooling and coupling hardware, and (4) higher efficiency operation of SiC wide bandgap power electronics packaging through high temperature operation (200 oC). The proposed approach utilizes a single dielectric coolant for closed loop two-phase thermal management, and a combined heat rejection unit for the IPM and drive. Wick assisted liquid delivery for evaporative thermal management is utilized for the motor, and the drive electronics utilize the same coolant in flow boiling within the cold plate structures. Through the use of three-dimensional packaging for SiC, and novel drive topologies with reduced switching losses, significant increases in power density and compactness were targeted.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2020

Octopus, a computational framework for exploring light-driven phenomena and quantum dynamics in extended and finite systems

Over the last few years, extraordinary advances in experimental and theoretical tools have allowed us to monitor and control matter at short time and atomic scales with a high degree of precision. An appealing and challenging route toward engineering materials with tailored properties is to find ways to design or selectively manipulate materials, especially at the quantum level. To this end, having a state-of-the-art ab initio computer simulation tool that enables a reliable and accurate simulation of light-induced changes in the physical and chemical properties of complex systems is of utmost importance. The first principles real-space-based Octopus project was born with that idea in mind, i.e., to provide a unique framework that allows us to describe non-equilibrium phenomena in molecular complexes, low dimensional materials, and extended systems by accounting for electronic, ionic, and photon quantum mechanical effects within a generalized time-dependent density functional theory. This article aims to present the new features that have been implemented over the last few years, including technical developments related to performance and massive parallelism. We also describe the major theoretical developments to address ultrafast light-driven processes, such as the new theoretical framework of quantum electrodynamics density-functional formalism for the description of novel light–matter hybrid states. Those advances, and others being released soon as part of the Octopus package, will allow the scientific community to simulate and characterize spatial and time-resolved spectroscopies, ultrafast phenomena in molecules and materials, and new emergent states of matter (quantum electrodynamical-materials).

74 ATOMIC AND MOLECULAR PHYSICS↗
DOE OSTI2022

Characterization of the miniPlanacon XPM85112-S-R2D2 MCP-PMT with custom modified backend electronics

We report the results of the measurements of three pieces of the new Photonis miniPLANACON microchannel-plate photomultipliers (MCP-PMTs) intended for use in the demanding environment of the Large Hadron Collider (LHC) beamline as a part of the AFP Time-of-Flight detector. These photomultipliers were modified in cooperation with the manufacturer by using a custom backend and were subjected to numerous tests, with the focus on the rate capability and crosstalk behaviour. We determined that the two of them with a lower MCP resistance are able to operate without significant saturation at an anode current density of 1 μA/cm 2 . These two are, therefore, suitable for the intended use and are currently installed as part of the AFP detector packages.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

Flexible sensor technology

A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.

Joshi, Pooran Chandra↗
DOE OSTI2022

Smart connected worker edge platform for smart manufacturing: Part 1—Architecture and platform design

Abstract The challenge of sustainably producing goods and services for healthy living on a healthy planet requires simultaneous consideration of economic, societal, and environmental dimensions in manufacturing. Enabling technology for data driven manufacturing paradigms like Smart Manufacturing (a.k.a. Industry 4.0) serve as the technological backbone from which sustainable approaches to manufacturing can be implemented. Unfortunately, these technologies are typically associated with broader and deeper factory automation that is often too expensive and complex for the small and medium sized manufacturers (SMMs) that comprise the majority of manufacturing business in the USA and for whom their most valuable asset are the people whose jobs automation while replace. This paper describes an edge intelligent platform to integrate internet‐of‐things technologies with computing hardware, software, computational workflows for machine learning, and data ingestion, enabling SMMs to transition into smart manufacturing paradigms by leveraging the intelligence of their people. The platform leverages consumer grade electronics and sensors (affordable and portable), customized software with open source software packages (accessible), and existing communication network infrastructures (scalable). The software systems are implemented via Kubernetes orchestration of Docker containerization to ensure scalability and programmability. The platform is adaptive via computational workflow engines that produce information from data by processing with low‐cost edge computing devices while efficiently accessing resources of cloud servers as needed. The proposed edge platform connects workers to technological resources that provide computational intelligence (i.e., silicon‐based sensing and computation for data collection and contextualization) to enable decision making at the edge of advanced manufacturing.

Kim, Yoon G.↗
DOE OSTI2025

BuildingSync® v.2.7.0 (released 9.11.2025) [SWR-18-28]

BuildingSync® is a building data exchange schema to better enable integration between software tools and building data workflows. The schema's original use case was focused on commercial building energy audits; however, several additional use cases have been realized including building energy modeling and more high-level generic building data exchange. Version 2.7.0 adds new elements for file attachment feature and FederalBuilding, and generalizes usage of Optional Elements (e.g. EquipmentCondition, EquipmentID) to all assets/systems. BuildingSync helps streamline the data exchange process, improving the value of the data, minimizing duplication of effort for subsequent building data collection efforts (including audits), and facilitating the achievement of greater energy efficiency. This in done in part by standardizing on (a) reporting audits in an electronic format, (b) tracking proposed, implemented, and discarded energy conservation measures, and (c) storing building characteristics (at multiple levels) for audits, benchmarking, and building energy analysis. BuildingSync has several documents and tools available to help users understand how to best leverage BuildingSync. The list below are only a subset of the resources available. If new resources are discovered, then feel free to create a new pull request with the additions. Generic BuildingSync information is available on the DOE website and the project website. BuildingSync Examples - These examples are kept up to date and show a wide range of implementations. Any new update to BuildingSync is required to pass validation on these example files. BuildingSync Use Case Validator allows for users to determine if their instance complies with a specific use case for BuildingSync by checking if the required elements are implemented in an uploaded instance. An API is also provided for automated integration into other tools. Also, the website contains an easy way to view the entirety of the schema and how elements relate to the Building Exchange Data Exchange Specification. The Validator is open sourced here Use Case TestSuite provides a Python package for easier generation of BuildingSync use cases. BuildingSync use cases depend on the generation of schematron documents, which is time-consuming and difficult to implement well. The TestSuite allows users to define a use case using a more palatable CSV template, which it then turns into a Schematron document. The source code is available here. BuildingSync to OpenStudio/EnergyPlus. The translator is open sourced here. This project will translate a Level 1 (and partial Level 2) ASHRAE Energy Audit to a fully defined OpenStudio and EnergyPlus model. This project is in early Beta testing and any feedback is welcome!

Long, Nicholas [National Renewable Energy Lab. (NR↗
DOE OSTI2024

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits

Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.

42 ENGINEERING↗