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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗

Three-dimensional airgap electric machines employing winding embedded liquid cooling

Various examples are provided related to 3D airgap electric machines and winding embedded liquid cooling. In one example, an electric machine includes a stator assembly with stator windings supported by a stator core and an outer rotor assembly includes a radial plate surrounding the stator assembly and an endplate at a first end of the radial plate adjacent to the first end of the stator core. The stator windings can include a first portion extending along an axial length of the stator core and a second portion at a first end of the stator core that extends radially inward towards a shaft of the electric machine. The radial plate can include magnets distributed about the radial plate. In another example, a stator assembly includes stator windings supported by a stator core with a winding support including cooling channels distributed between the stator windings. The winding support can be nonmagnetic.

Islam, Md Sariful↗

Enhanced Surface Spray Cooling with Embedded and Compound Extended Surface Structures

Experiments were conducted to study the effects of enhanced surface structures on heat flux using spray cooling. The surface enhancements consisted of embedded structures (dimples, pores, and tunnels) and compound extended surface enhancements (straight fins, cubic pin fins and dimples) machined on and within the top surface of copper heater blocks. Each copper block had a projected cross-sectional area of 2.0 sq cm. Measurements were also obtained on a heater block with a flat surface for baseline comparison purposes. A 2x2 nozzle array was used with PF-5060 as the working fluid. Thermal performance data was obtained under nominally degassed (chamber pressure of 41.4 kPa) and gassy conditions (chamber with N2 gas at 101 kPa) with a bulk fluid temperature of 20.5 C. Results for both the nominally degassed and gassy cases show that the highest critical heat flux (CHF) was attained using straight fins and porous tunnels. For the nominally degassed case, both had a CHF of approx.: 142 W/sq cm while for the gassy case their CHF values increased to 175 W/sq cm. This gave an enhancement relative to the nominally degassed flat surface case of approx. 77% and 119% respectively.

Silk, Erie A.↗

Comparison of electro-thermal performance of advanced cooling techniques for electric vehicle motors

Permanent magnet synchronous motors are commonly used in the powertrain of electric vehicles because of their high power and torque densities. Attempts to increase power and torque densities beyond the state-of-the-art often suffer from thermal limitations of the adopted winding-wire insulation class. In this paper, overall effectiveness of four different cooling technologies, namely conventional stator jacket cooling, embedded circular and rectangular cooling channels within stator core, and direct winding heat exchangers have been studied numerically. Here, by realizing temperature dependent magnetic and material properties, winding and core losses, a two-way coupling algorithm has been utilized to study the detailed electro-magnetic and thermal performance of BMW i3 motor with aforementioned cooling techniques. The numerical results illustrated that the direct winding heat exchangers approach provides better electro-thermal performance in comparison to the other cooling techniques analyzed. On the contrary, embedded rectangular and circular channel in stator core adversely affect the electro-magnetic performance and overall efficiency of the motor, despite their superior thermal performance compared to the jacket cooling

42 ENGINEERING↗

Wick assisted embedded evaporative cooling of motors

A cooling system for an electric motor that includes a stator having a plurality of slot windings and a rotor, coaxial with the stator, having a plurality of magnets, includes a coolant inlet to the motor and a coolant outlet from the motor. A coolant pathway is in fluid communication with the inlet and the outlet. Heat is transferable from the slot windings to the coolant pathway. A coolant flows through the coolant pathway and is in a liquid phase as it enters the coolant inlet, changing into a gaseous phase as heat is transferred to the coolant from the slot windings. A cooling loop is in fluid communication with the coolant inlet and the coolant outlet. The cooling loop cools the coolant so that substantially all of the coolant is in the liquid phase when it enters the coolant inlet.

Joshi, Yogendra K.↗

Orientation Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies onconduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolersemploy the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models andcorrelations for orientation- and gravity-independent operation has limited the use of two-phase coolers in suchapplications. Previous research has revealed that gravitational acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio microgap channels. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging systems to exploit this thermal management technique and streamline the technology development process.

orientation↗

Gravity Effects in Microgap Flow Boiling

Increasing integration density of electronic components has exacerbated the thermal management challenges facing electronic system developers. The high power, heat flux, and volumetric heat generation of emerging devices are driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which facilitates direct contact between the heat-generating device and coolant flow. Microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel between devices. While two phase microcoolers are used routinely in ground-based systems, the lack of acceptable models and correlations for microgravity operation has limited their use for spacecraft thermal management. Previous research has revealed that gravitational acceleration plays a diminishing role as the channel diameter shrinks, but there is considerable variation among the proposed gravity-insensitive channel dimensions and minimal research on rectangular ducts. Reliable criteria for achieving gravity-insensitive flow boiling performance would enable spaceflight systems to exploit this powerful thermal management technique and reduce development time and costs through reliance on ground-based testing. In the present effort, the authors have studied the effect of evaporator orientation on flow boiling performance of HFE7100 in a 218 m tall by 13.0 mm wide microgap cooler. Similar heat transfer coefficients and critical heat flux were achieved across five evaporator orientations, indicating that the effect of gravity was negligible.

microscale↗

Gravity Effects in Microgap Flow Boiling

Increasing integration density of electronic components has exacerbated the thermal management challenges facing electronic system developers. The high power, heat flux, and volumetric heat generation of emerging devices are driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which facilitates direct contact between the heat-generating device and coolant flow. Microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel between devices. While two phase microcoolers are used routinely in ground-based systems, the lack of acceptable models and correlations for microgravity operation has limited their use for spacecraft thermal management. Previous research has revealed that gravitational acceleration plays a diminishing role as the channel diameter shrinks, but there is considerable variation among the proposed gravity-insensitive channel dimensions and minimal research on rectangular ducts. Reliable criteria for achieving gravity-insensitive flow boiling performance would enable spaceflight systems to exploit this powerful thermal management technique and reduce development time and costs through reliance on ground-based testing. In the present effort, the authors have studied the effect of evaporator orientation on flow boiling performance of HFE7100 in a 218 m tall by 13.0 mm wide microgap cooler. Similar heat transfer coefficients and critical heat flux were achieved across five evaporator orientations, indicating that the effect of gravity was negligible.

microscale↗

Gravity Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for aerospace applications, but the lack of acceptable models and correlations for orientation- and gravity-independent operation has limited their use. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging systems to exploit this thermal management technique and streamline the technology development process. As a first step toward understanding the effect of gravity in two-phase microgap flow and transport, in an earlier effort, the authors studied the effects of evaporator orientation, mass flux, and heat flux on flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across orientations, was achieved for mass fluxes of 400 kg/sq.m-s and greater (corresponding to a Froude number of about 0.8). In the present effort, the authors have studied the effects of gravity, mass flux, and subcooling on flow boiling of HFE7100 in a 0.17 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. The Flow Boiling in Microgap Coolers payload experienced about three minutes of weightlessness and shorter periods of high-g (up to about 5 g) during two recent flights aboard the Blue Origin New Shepard reusable launch vehicle. The results from the flight experiments will be presented and compared with published criteria for achieving gravity-independence.

Robinson, Franklin L.↗

Orientation Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on con-duction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models and correlations for orientation- and gravity-independent operation has limited the use of two-phase coolers in such applications. Previous research has revealed that gravita-tional acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio mi-crogap channels. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging sys-tems to exploit this thermal management technique and streamline the technology development process. As a first step toward understanding the effect of gravity on two-phase microgap flow and transport, in the present effort the authors have studied the effect of evaporator orientation and mass flux on near-saturated flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across evaporator orientations, was achieved for mass fluxes of 400 kg/m2-s and greater. The present results are compared to pub-lished criteria for achieving gravity-independence.

orientation↗

High heat flux actively cooled honeycomb sandwich structural panel for a hypersonic aircraft

The results of a program to design and fabricate an unshielded actively cooled structural panel for a hypersonic aircraft are presented. The design is an all-aluminum honeycomb sandwich with embedded cooling passages soldered to the inside of the outer moldline skin. The overall finding is that an actively cooled structure appears feasible for application on a hypersonic aircraft, but the fabrication process is complex and some material and manufacturing technology developments are required. Results from the program are summarized and supporting details are presented.

Koch, L. C.↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

NS 1987A in SN 1987A

The possible detection of a compact object in the remnant of SN 1987A presents an unprecedented opportunity to follow its early evolution. The suspected detection stems from an excess of infrared emission from a dust blob near the compact object’s predicted position. The infrared excess could be due to the decay of isotopes like 44 Ti, accretion luminosity from a neutron star or black hole, magnetospheric emission or a wind originating from the spin down of a pulsar, or to thermal emission from an embedded, cooling neutron star. In this work it is shown that the last possibility is the most plausible as the other explanations are disfavored by other observations and/or require fine-tuning of parameters. Not only are there indications that the dust blob overlaps the predicted location of a kicked compact remnant, but its excess luminosity also matches the expected thermal power of a 30 yr old neutron star. Furthermore, models of cooling neutron stars within the minimal cooling paradigm readily fit both NS 1987A and Cas A, the next-youngest known neutron star. If correct, a long heat transport timescale in the crust and a large effective stellar temperature are favored, implying relatively limited crustal n- 1 S 0 superfluidity and an envelope with a thick layer of light elements, respectively. If the locations do not overlap, then pulsar spin down or accretion might be more likely, but the pulsar’s period and magnetic field or the accretion rate must be rather finely tuned. In this case, NS 1987A may have enhanced cooling and/or a heavy-element envelope.

79 ASTRONOMY AND ASTROPHYSICS↗

A mission executor for an autonomous underwater vehicle

The Naval Postgraduate School has been conducting research into the design and testing of an Autonomous Underwater Vehicle (AUV). One facet of this research is to incrementally design a software architecture and implement it in an advanced testbed, the AUV II. As part of the high level architecture, a Mission Executor is being constructed using CLIPS (C Language Integrated Production System) version 5.0. The Mission Executor is an expert system designed to oversee progress from the AUV launch point to a goal area and back to the origin. It is expected that the executor will make informed decisions about the mission, taking into account the navigational path, the vehicle subsystem health, and the sea environment, as well as the specific mission profile which is downloaded from an offboard mission planner. Heuristics for maneuvering, avoidance of uncharted obstacles, waypoint navigation, and reaction to emergencies (essentially the expert knowledge of a submarine captain) are required. Many of the vehicle subsystems are modeled as objects using the CLIPS Object Oriented Language (COOL) embedded in CLIPS 5.0. Also, truth maintenance is applied to the knowledge base to keep configurations updated.

Lee, Yuh-Jeng↗

Development and Application of Weld Track Thermal Analysis for the Exploration Extravehicular Mobility Unit

NASA is studying the next generation of space suit for safe operations in space, from the International Space Station to the lunar surface as part of the Exploration Extravehicular Mobility Unit project. The backplate structure of the portable life support system (PLSS) serves as the attachment point for assembly of the PLSS and contains embedded cooling channels. The thermal loop plumbing assembly and backplate are combined into a single component such that the fluid lines run through the midplane of the backplate. The manufacturing of the Ti-6Al-4V backplate consists of machining channels into a plate, welding cover plates on each channel using an electron beam, and additional machining for excess material removal and final detail. Careful control of the electron beam weld process is necessary to completely seal cover plates, produce consistent weld tracks, and produce channels with uniform cross sections free of debris and defects. The backplate contains multiple weld channels with unique geometries. The weld process parameters include choosing the beam current and focus, accelerating voltage, travel speed, pause times between weld tracks, and sequence of weld tracks. A transient finite element thermal analysis was developed to provide support for choosing and controlling the weld process parameters to maintain a consistent melt pool along each of the weld tracks. A moving distributed heat source is modeled to represent the heat input generated by the electron beam. The heat source model is a critical input to the analysis for accurate temperature predictions during the weld process. A modified conical heat source was developed to account for the change in working distance between the backplate and cover plates. The geometry of the material being welded must be accounted for by the heat source model to define the correct energy input. The weld process control is designed according to the predicted thermal history and melt pool dimensions for each of the weld channels. The analysis model, modified heat source, temperature and melt pool predictions, application of the thermal data to the weld parameters, and comparison with micrograph cross-sections from weld trials will be discussed in this presentation.

Electron Beam Welding↗

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, it is not used in commercial electric vehicles (EVs) because of the associated pressure drop and reliability concerns. Here, in this paper, we present a modular thermal management system designed for automotive power electronics. The system achieves superior thermal performance to benchmarked EVs, while adhering to reliability standards and with low pumping power. The system utilizes a low-cost and lightweight plastic manifold to generate jets over an optimized heat sink, which is embedded in the direct-bonded-copper (DBC) substrate. The embedded heat sink concept leverages additive manufacturing to add elliptical pin fins to the DBC substrate. The heat sink geometry is optimized for submerged jet impingement using a unit-cell model and an exhaustive search algorithm. The model predictions are validated using unit-cell experiments. A full-scale power module model is then used to compare the DBC-embedded heat sink against direct DBC cooling and baseplate-integrated heat sinks for single-sided (SS) and double-sided (DS) cooling concepts. Using the SS and DS DBC-embedded cooling concepts, the models predict a thermal resistance that represents a reduction of 75% and 85% compared to the 2015 BMW i3, respectively, for the same water-ethylene glycol inverter flow rate. We have shown that an inverter with a 100-kilo-Watt-per-liter power density is achievable with the proposed design.

33 ADVANCED PROPULSION SYSTEMS↗