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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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17 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Fiber attach enabled wafer level fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Ardalan, Shahab↗
DOE OSTI2023

Fiber attach enabled wafer level fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Ardalan, Shahab↗
DOE OSTI2023

Event Fanout/Receiver (evfr) v1.0

The event fanout-receiver is an event-based timing system implementation capable of synchronizing (with respect to clock, events and triggers) to an upstream event generator. This can be used in 2 modes: fanout or receiver. the first one receives 1 upstream timing streams and fanouts it to 36. The second one receives and decodes the stream. This has been in use by ALS for many years and this is a similar implementation, but providing a more flexible configuration

Russo, Lucas↗
NASA NTRS1994

MANN: A program to transfer designs for diffractive optical elements to a MANN photolithographic mask generator

There are two basic areas of interest for diffractive optics. In the first, the property of wavefront division is exploited for achieving optical fanout, analogous to the more familiar electrical fanout of electronic circuitry. The basic problem here is that when using a simple uniform diffraction grating the energy input is divided unevenly among the output beams. The other area of interest is the use of diffractive elements to replace or supplement standard refractive elements such as lenses. Again, local grating variations can be used to control the amount of bending imparted to optical rays, and the efficiency of the diffractive element will depend on how closely the element can be matched to the design requirements. In general, production restrictions limit how closely the element approaches the design, and for the common case of photolithographic production, a series of binary masks is required to achieve high efficiency. The actual design process is much more involved than in the case of elements for optical fanout, as the desired phase of the optical wavefront over some reference plane must be specified and the phase alteration to be introduced at each point by the diffraction element must be known. This generally requires the utilization of a standard optical design program. Two approaches are possible. In the first approach, the diffractive element is treated as a special type of lens and the ordinary optical design equations are used. Optical design programs tend to follow a second approach, namely, using the equations of optical interference derived from holographic theory and then allowing the introduction of phase front corrections in the form of polynomial equations. By using either of these two methods, diffractive elements can be used not only to compensate for distortions such as chromatic or spherical aberration, but also to perform the work of a variety of other optical elements such as null correctors, beam shapers, etc. The main focus of the project described in this report is how the design information from the lens design program is incorporated into the photolithographic process. It is shown that the MANN program, a photolithographic mask generator, fills the need for a link between lens design programs and mask generation controllers.The generated masks can be used to expose a resist-coated substrate which is etched and then must be re-coated, re-exposed, and re-etched for making copies, just as in the electronics industry.

Matthys, Donald R.↗
NASA NTRS2003

Binary-Phase Fourier Gratings for Nonuniform Array Generation

We describe a design method for a binary-phase Fourier grating that generates an array of spots with nonuniform, user-defined intensities symmetric about the zeroth order. Like the Dammann fanout grating approach, the binary-phase Fourier grating uses only two phase levels in its grating surface profile to generate the final spot array. Unlike the Dammann fanout grating approach, this method allows for the generation of nonuniform, user-defined intensities within the final fanout pattern. Restrictions governing the specification and realization of the array's individual spot intensities are discussed. Design methods used to realize the grating employ both simulated annealing and nonlinear optimization approaches to locate optimal solutions to the grating design problem. The end-use application driving this development operates in the near- to mid-infrared spectrum - allowing for higher resolution in grating specification and fabrication with respect to wavelength than may be available in visible spectrum applications. Fabrication of a grating generating a user-defined nine spot pattern is accomplished in GaAs for the near-infrared. Characterization of the grating is provided through the measurement of individual spot intensities, array uniformity, and overall efficiency. Final measurements are compared to calculated values with a discussion of the results.

Keys, Andrew S.↗
DOE OSTI2018

High Density Chip Interconnect Technology Using High Density Glass Interposers

Demands for high density and high speed interconnect solutions are not satisfied by current technology offerings. Platforms such as printed circuit boards (PCBs), ceramic substrates and silicon interposers don’t provide the small form factor nor the I/O density to support 5G or 1Tbps gigabit ethernet solutions. Current solutions also don’t support die to die assembly with integrated tiled solutions for wide area and fanout solutions for lager data and signal processing. A solution with through vias provides an order of magnitude or smaller density supporting much higher density attach and assembly By fabricating a very fine pitch metal filled through glass via solution it’s possible to deliver the necessary improvements in performance, reliability, even higher data speed rates with smaller area and much denser geometries. There are a number of opportunities across a wide variety of industries for through glass interposers as they become the replacement for printed circuit boards (PCBs) and ceramic substrates. The broad array of opportunities include renewable energy, medical electronics (ME), defense electronics (DE)/space and consumer electronics (CE), but likely will impact every industry and market segment. Compared to PCBs, through glass via (TGV) solutions provide the next generation platform for semiconductor assembly improvements. The ability to generate lines, spaces, trenches and vias similar to wafer level geometries delivers wired solutions one to two orders of magnitude smaller than traditional organic PCB and ceramic substrate offerings. Higher density connections also include the thru vias that connect multiple metal layers, fanout. It’s possible to deliver filled metal vias that are 20um diameter with much tighter pitch than can be offered with PCB. Our goal is to provide 20um diameter and smaller via, 50um and smaller pitch, and aspect ratios at 25:1 and greater with hermetically metal filled vias. The goal of CVI is to replace or eliminate PCBs, ceramic substrate and through silicon vias (TSV) providing a glass interposer with metal filled, fiber plugged and/or optional wireless interconnectivity. The end plan is to deliver a glass substrate platform that provides improved electrical performance, versatility, inertness, and much improved cost and cycle time (development, drawing, and delivery) to performance in the form of small millimeter sized substrates or full 8” wafer substrates. Glass delivers an improvement over silicon thru vias (TSV) in the number of processing steps, cost, reliability and cycle time. In addition to metal plugged vias, our glass interposers are capable of fiber and antennae solutions providing two additional very high density and ultra-high speed data transfer capabilities.

36 MATERIALS SCIENCE↗
NASA NTRS1993

Asymmetric three-beam binary optic grating

Binary and diffractive optical components are finding many applications in optical systems and integrated optical devices. A recent application required the development of a two-dimensional diffraction grating to perform an asymmetric, three-beam fanout. In this paper, techniques are presented for the design of arbitrary fanout grating devices. Modeling and optimization processes are demonstrated for the three-beam grating. The counter-intuitive results of the initial design are discussed, and experimental data verifying performance are presented.

Kathman, Alan D.↗
NASA NTRS2004

Fabrication and Testing of Binary-Phase Fourier Gratings for Nonuniform Array Generation

This effort describes the fabrication and testing of binary-phase Fourier gratings designed to generate an incoherent array of output source points with nonuniform user-defined intensities, symmetric about the zeroth order. Like Dammann fanout gratings, these binary-phase Fourier gratings employ only two phase levels to generate a defined output array. Unlike Dammann fanout gratings, these gratings generate an array of nonuniform, user-defined intensities when projected into the far-field regime. The paper describes the process of design, fabrication, and testing for two different version of the binary-phase grating; one designed for a 12 micron wavelength, referred to as the Long-Wavelength Infrared (LWIR) grating, and one designed for a 5 micron wavelength, referred to as the Mid-Wavelength Infrared Grating (MWIR).

Keys, Andrew S.↗
NASA NTRS2011

Impact of Improved Heat Sinking of an X-Ray Calorimeter Array on Crosstalk, Noise, and Background Events

The x-ray calorimeter array of the Soft X-ray Spectrometer (SXS) of the Astro-H satellite will incorporate a silicon thermistor array produced during the development of the X-Ray Spectrometer (XRS) of the Suzaku satellite. On XRS, inadequate heat sinking of the array led to several non-ideal effects. The thermal crosstalk, while too small to be confused with x-ray signals, nonetheless contributed a noise term that could be seen as a degradation in energy resolution at high flux. When energy was deposited in the silicon frame around the active elements of the array, such as by a cosmic ray, the resulting pulse in the temperature of the frame resulted in coincident signal pulses on most of the pixels. In orbit, the resolution was found to depend on the particle background rate. In order to minimize these effects on SXS, heat-sinking gold was applied to areas on the front and back of the array die, which was thermally anchored to the gold of its fanout board via gold wire bonds. The thermal conductance from the silicon chip to the fanout board was improved over that of XRS by an order of magnitude. This change was sufficient for essentially eliminating frame events and allowing high-resolution to be attained at much higher counting rates. We will present the improved performance, the measured crosstalk, and the results of the thermal characterization of such arrays.

Kilbourne, C. A.↗
DOE OSTI2012

Controlled reversal of Co/Pt Dots for nanomagnetic logic applications

Domain reversal in perpendicular multilayer films is governed by an intrinsic distribution of anisotropy. However, control of the switching field distribution (SFD) of field-coupled, single domain Co/Pt dots is the key to building large integrated systems for nanomagnetic logic applications. In this work, partial Ga{sup +} focused ion beam (FIB) irradiation of single-domain Co/Pt dots is employed which locally reduces the anisotropy and renders the film-inherent SFD ineffective. Controlled reduction in the switching field compared to non-irradiated dots is achieved, depending on size and dose of irradiation. TEM images of an as-grown and irradiated Co/Pt stack show a change in morphology from distinct Co/Pt interfaces to intermixed and randomly oriented grains due to the Ga{sup +} ion impact. The presented method is highly suitable to control the switching behavior in field-coupled logic devices. Experimental results are used to demonstrate a nanomagnetic fanout operation.

36 MATERIALS SCIENCE↗
DOE OSTI2020

A Generic High Bandwidth Data Acquisition Card for Physics Experiments

In high energy physics and nuclear physics experiments particularly the ones based on particle accelerator, the data rate from the detector is usually in the order of Terabytes per second. This high throughput data from detector front-end electronics need to be transmitted to the back-end computing farm for high level event selection and building. A Data Acquisition (DAQ) system with features of high-density, scalable, easily upgradeable is crucial to simplify the readout architecture of whole experiment. This paper will introduce the design of a generic high bandwidth PCIe card which can be used as the important input output card in a scalable DAQ system. It can factorize front-end electronics from data handling, and reduce amount of custom hardware in favor of scalable detectorindependent commercial hardware and software. Besides the 48 channels of bidirectional high speed fiber optical links with frontends, it also supports to synchronize with the experiment timing system, and to fanout the clock and trigger information with a fixed latency to the front-end electronics.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2020

Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors

In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.

Jewell, April D.↗
NASA NTRS1993

Scalar limitations of diffractive optical elements

In this paper, scalar limitations of diffractive optic components are investigated using coupled wave analyses. Results are presented for linear phase gratings and fanout devices. In addition, a parametric curve is given which correlates feature size with scalar performance.

Johnson, Eric G.↗
NASA NTRS1992

Bit-systolic arithmetic arrays using dynamic differential gallium arsenide circuits

A new family of gallium arsenide circuits for fine grained bit-systolic arithmetic arrays is introduced. This scheme combines features of two recent techniques of dynamic gallium arsenide FET logic and differential dynamic single-clock CMOS logic. The resulting circuits are fast and compact, with tightly constrained series FET propagation paths, low fanout, no dc power dissipation, and depletion FET implementation without level shifting diodes.

Beagles, Grant↗
NASA NTRS2020

Proton Radiation Effects on HgCdTe Avalanche Photodiode Detectors

Space radiation damage and proton induced transient effects were evaluated on 4.4 μm cutoff HgCdTe avalanche photodiode (APD) arrays developed by Leonardo DRS. Device performances as a function of total dose up to 100 krad (Si) were measured with ~60 MeV protons on 3 types of APD samples: 4x4 pixel APD fanout arrays with and without connection to a read-out integrated circuit (ROIC), and a 2x8 pixel photon counting APD focal plane array (FPA). A gamma-ray test was also conducted to study ionization effects. Both APD arrays exhibited a small decrease in the quantum efficiency and a linear increase in the dark current with the proton fluence. The 2x8 pixel photon counting FPA also exhibited an increase in the dark count rate with proton dose. After the proton irradiation and an overnight room temperature warm-up, the APD dark currents at 80 K increased significantly in both types of APD arrays. All radiation damage to these HgCdTe APD arrays annealed out after baking them at >85 °C for several hours. Transient protons through the devices were found to cause large pulses at the detector output but recover within 1 μs.

Xiaoli Sun↗
DOE OSTI2025

Advancing \textit{otsdaq}: Enhancements for Usability, Accuracy, and Robustness

High-energy physics (HEP) experiments require data acquisition (DAQ) systems that can orchestrate complex detector operations, high data throughput, and responsive, real-time feedback to operators. Traditional DAQ stacks, which are often bespoke, command-line driven and highly specific, impose large learning curves on users. The Off-The-Shelf Data Acquisition (\textit{otsdaq}) framework was created to address these issues by offering a highly customizable and scalable browser-based ’desktop’ environment, in which experiment-specific control and monitoring applications can be easily deployed and integrated. Although the initial development of the \textit{otsdaq} software was aimed at the Fermilab Test Beam Facility, \textit{otsdaq} is now being leveraged for broader deployment, including the upcoming Mu2e experiment, where real-time monitoring of field-programmable gate array (FPGA)-based Data Transfer Controllers (DTCs), Clock and Fanout (CFO) boards, and several other subsystems are critical. We contribute a set of targeted improvements to \textit{otsdaq}: bitmap visualization functionality for configured data, improved and corrected delta-based DTC throughput metrics, version control (VC)-backed source navigation for console messages, custom navigation hooks to eliminate disruptive user interface glitches, and copy-to-clipboard support for macro execution history. These changes improve usability, reduce debugging time, and increase accuracy in performance data as Mu2e moves toward commissioning.

Mohammed, A. [Unlisted, US]↗