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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2014

Flexible Electronics Development Supported by NASA

The commercial electronics industry is leading development in most areas of electronics for NASA applications; however, working in partnership with industry and the academic community, results from NASA research could lead to better understanding and utilization of electronic materials by the flexible electronics industry. Innovative ideas explored by our partners in industry and the broader U.S. research community help NASA execute our missions and bring new American products and services to the global technology marketplace. [Mike Gazarik, associate administrator for Space Technology, NASA Headquarters, Washington DC] This presentation provides information on NASA needs in electronics looking towards the future, some of the work being supported by NASA in flexible electronics, and the capabilities of the Glenn Research Center supporting the development of flexible electronics.

antenna↗
NASA NTRS2003

Zipper Connectors for Flexible Electronic Circuits

Devices that look and function much like conventional zippers on clothing have been proposed as connectors for flexible electronic circuits. Heretofore, flexible electronic circuits have commonly included rigid connectors like those of conventional rigid electronic circuits. The proposed zipper connectors would make it possible to connect and disconnect flexible circuits quickly and easily. Moreover, the flexibility of zipper connectors would make them more (relative to rigid connectors) compatible with flexible circuits, so that the advantages of flexible circuitry could be realized more fully. Like a conventional zipper, a zipper according to the proposal would include teeth anchored on flexible tapes, a slider with a loosely attached clasp, a box at one end of the rows of mating teeth, and stops at the opposite ends. The tapes would be made of a plastic or other dielectric material. On each of the two mating sides of the zipper, metal teeth would alternate with dielectric (plastic) teeth, there being two metal teeth for each plastic one. When the zipper was closed, each metal tooth from one side would be in mechanical and electrical contact with a designated metal tooth from the other side, and these mating metal teeth would be electrically insulated from the next pair of mating metal teeth by an intervening plastic tooth. The metal teeth would be soldered or crimped to copper tabs. Wires or other conductors connected to electronic circuits would be soldered or crimped to the ends of the tabs opposite the teeth.

Barnes, Kevin N.↗
NASA NTRS2008

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗
NASA NTRS2014

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft?

Materials↗
NASA NTRS2012

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Atmospheric confetti. Inchworm crawlers. Blankets of ground penetrating radar. These are some of the unique mission concepts which could be enabled by a printable spacecraft. Printed electronics technology offers enormous potential to transform the way NASA builds spacecraft. A printed spacecraft's low mass, volume and cost offer dramatic potential impacts to many missions. Network missions could increase from a few discrete measurements to tens of thousands of platforms improving areal density and system reliability. Printed platforms could be added to any prime mission as a low-cost, minimum resource secondary payload to augment the science return. For a small fraction of the mass and cost of a traditional lander, a Europa flagship mission might carry experimental printed surface platforms. An Enceladus Explorer could carry feather-light printed platforms to release into volcanic plumes to measure composition and impact energies. The ability to print circuits directly onto a variety of surfaces, opens the possibility of multi-functional structures and membranes such as "smart" solar sails and balloons. The inherent flexibility of a printed platform allows for in-situ re-configurability for aerodynamic control or mobility. Engineering telemetry of wheel/soil interactions are possible with a conformal printed sensor tape fit around a rover wheel. Environmental time history within a sample return canister could be recorded with a printed sensor array that fits flush to the interior of the canister. Phase One of the NIAC task entitled "Printable Spacecraft" investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. This final report captures the results and conclusions of the Phase One study. First, the report presents the approach taken in conducting the study and a mapping of results against the proposed Phase One objectives. Then an overview of the general field of printed electronics is provided, including manufacturing approaches, commercial drivers, and the current state of integrated systems. The bulk of the report contains the results and findings of Phase One organized into four sections: a survey of components required for a printable spacecraft, technology roadmaps considerations, science mission and engineering applications, and potential risks and challenges of the technology.

Spacecraft↗
NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗
NASA NTRS2016

Atmospheric Pressure Plasma Jet as a Dry Alternative to Inkjet Printing in Flexible Electronics

We have developed an atmospheric pressure plasma jet printing system that works at room temperature to 50 deg C unlike conventional aerosol assisted techniques which require a high temperature sintering step to obtain desired thin films. Multiple jets can be configured to increase throughput or to deposit multiple materials, and the jet(s) can be moved across large areas using a x-y stage. The plasma jet has been used to deposit carbon nanotubes, graphene, silver nanowires, copper nanoparticles and other materials on substrates such as paper, cotton, plastic and thin metal foils.

Printable electronics↗
NASA NTRS2004

Flexible electronics for space applications

NASA is currently developing a host of deployable structures for the exploration of space. These include balloons, solar sails, space-borne telescopes and membrane-based synthetic aperture radar.

Crawford, Robert↗
NASA NTRS2013

Flexible Microstrip Circuits for Superconducting Electronics

Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.

Chervenak, James↗
NASA NTRSDate not supplied

A Multifunctional Bistable Ultrathin Composite Boom for In-Space Monitoring of Deployment Dynamics

A novel concept of a multifunctional deployable ultrathin composite boom with flexible electronics and circuits integrated in a highly compact configuration, which can monitor its deployment dynamics in space, is presented in this paper. This concept is particularly suitable for CubeSats with extremely limited payload volume. The multifunctional deployable boom will be flight hardware installed in a 3U CubeSat that is scheduled to be launched to the International Space Station (ISS) in 2023 as an in-space technology demonstration. The multifunctional boom consists of a bistable self-deployable ultrathin composite boom, flexible electronics and circuitry for dynamics monitoring, and embedded flexible thin wires for power delivery and data transmission. The design, materials, and fabrication methods for the multifunctional boom are presented. Tests in simulated space environments showed the survivability and stability of the flexible electronics within a temperature range of 7 °C to 50 °C and under a high vacuum level of approximately 1 × 10−6 Torr. Ground-based vibration and deployment tests demonstrated the overall design of the multifunctional boom, data acquisition system, and deployment mechanism. Analyses of the data obtained from the integrated flexible electronics successfully captured the deployment dynamics and identified the natural frequencies of the boom in the range of 0–100 Hz. These results demonstrate that the concept is a promising approach to future multifunctional ultrathin deployable space structures.

Yao Yao↗
NASA NTRSDate not supplied

A Multifunctional Bistable Ultrathin Composite Boom for In-Space Monitoring of Deployment Dynamics

A novel concept of a multifunctional deployable ultrathin composite boom with flexible electronics and circuits integrated in a highly compact configuration, which can monitor its deployment dynamics in space, is presented in this paper. This concept is particularly suitable for CubeSats with extremely limited payload volume. The multifunctional deployable boom will be flight hardware installed in a 3U CubeSat that is scheduled to be launched to the International Space Station (ISS) in 2023 as an in-space technology demonstration. The multifunctional boom consists of a bistable self-deployable ultrathin composite boom, flexible electronics and circuitry for dynamics monitoring, and embedded flexible thin wires for power delivery and data transmission. The design, materials, and fabrication methods for the multifunctional boom are presented. Tests in simulated space environments showed the survivability and stability of the flexible electronics within a temperature range of 7 °C to 50 °C and under a high vacuum level of approximately 1 × 10−6 Torr. Ground-based vibration and deployment tests demonstrated the overall design of the multifunctional boom, data acquisition system, and deployment mechanism. Analyses of the data obtained from the integrated flexible electronics successfully captured the deployment dynamics and identified the natural frequencies of the boom in the range of 0–100 Hz. These results demonstrate that the concept is a promising approach to future multifunctional ultrathin deployable space structures.

Yao Yao↗
NASA NTRS2015

Flexible Electronics-Based Transformers for Extreme Environments

This paper provides a survey of the use of modular multifunctional systems, called Flexible Transformers, to facilitate the exploration of extreme and previously inaccessible environments. A novel dynamics and control model of a modular algorithm for assembly, folding, and unfolding of these innovative structural systems is also described, together with the control model and the simulation results.

dynamics↗
NASA NTRS2010

Fully Printed High-Frequency Phased-Array Antenna on Flexible Substrate

To address the issues of flexible electronics needed for surface-to-surface, surface-to-orbit, and back-to-Earth communications necessary for manned exploration of the Moon, Mars, and beyond, a room-temperature printing process has been developed to create active, phased-array antennas (PAAs) on a flexible Kapton substrate. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proven feasible for phased-array antenna systems. The carrier mobility of an individual CNT is estimated to be at least 100,000 sq cm/V(dot)s. The CNT network in solution has carrier mobility as high as 46,770 sq cm/V(dot)s, and has a large current-density carrying capacity of approx. 1,000 mA/sq cm , which corresponds to a high carrying power of over 2,000 mW/ sq cm. Such high carrier mobility, and large current carrying capacity, allows the achievement of high-speed (>100 GHz), high-power, flexible electronic circuits that can be monolithically integrated on NASA s active phasedarray antennas for various applications, such as pressurized rovers, pressurized habitats, and spacesuits, as well as for locating beacon towers for lunar surface navigation, which will likely be performed at S-band and attached to a mobile astronaut. A fully printed 2-bit 2-element phasedarray antenna (PAA) working at 5.6 GHz, incorporating the CNT FETs as phase shifters, is demonstrated. The PAA is printed out at room temperature on 100-mm thick Kapton substrate. Four CNT FETs are printed together with microstrip time delay lines to function as a 2-bit phase shifter. The FET switch exhibits a switching speed of 0.2 ns, and works well for a 5.6-GHz RF signal. The operating frequency is measured to be 5.6 GHz, versus the state-of-the-art flexible FET operating frequency of 52 MHz. The source-drain current density is measured to be over 1,000 mA/sq cm, while the conventional organic FETs, and single carbon nanotube-based FETs, are typically in the mA to mA/sq cm range. The switching voltage used is 1.8 V, while the state-of-the-art flexible FET has a gate voltage around 50 V. The gate voltage can effectively control the source-drain current with an ON-OFF ratio of over 1,000 obtained at a low Vds bias of 1.8 V. The azimuth steering angles of PAA are measured at 0deg, -14.5deg, -30deg, and 48.6deg. The measured far-field patterns agree well with simulation results. The efficiency of the 2-bit 2-element PAA is measured to be 39 percent, including the loss of transmission line, FET switch, and coupling loss of RF probes. With further optimization, the efficiency is expected to be around 50-60 percent.

Chen, Yihong↗
NASA NTRS2000

The Low Temperature Microgravity Physics Experiments Project

The Low Temperature Microgravity Physics Facility (LTMPF) is being developed by NASA to provide long duration low temperature and microgravity environment on the International Space Station (ISS) for performing fundamental physics investigations. Currently, six experiments have been selected for flight definition studies. More will be selected in a two-year cycle, through NASA Research Announcement. This program is managed under the Low Temperature Microgravity Physics Experiments Project Office at the Jet Propulsion Laboratory. The facility is being designed to launch and returned to earth on a variety of vehicles including the HII-A and the space shuttle. On orbit, the facility will be connected to the Exposed Facility on the Japanese Experiment Module, Kibo. Features of the facility include a cryostat capable of maintaining super-fluid helium at a temperature of 1.4 K for 5 months, resistance thermometer bridges, multi-stage thermal isolation system, thermometers capable of pico-Kelvin resolution, DC SQUID magnetometers, passive vibration isolation, and magnetic shields with a shielding factor of 80dB. The electronics and software architecture incorporates two VME buses run using the VxWorks operating system. Technically challenging areas in the design effort include the following: 1) A long cryogen life that survives several launch and test cycles without the need to replace support straps for the helium tank. 2) The minimization of heat generation in the sample stage caused by launch vibration 3) The design of compact and lightweight DC SQUID electronics. 4) The minimization of RF interference for the measurement of heat at pico-Watt level. 5) Light weighting of the magnetic shields. 6) Implementation of a modular and flexible electronics and software architecture. The first launch is scheduled for mid-2003, on an H-IIA Rocket Transfer Vehicle, out of the Tanegashima Space Center of Japan. Two identical facilities will be built. While one facility is onboard the ISS, the other is re-integrated on the ground with new experiments. When the cryogen of the facility in space are exhausted, it will be swapped with the other facility with the new experiment. A total of 20 science missions are envisioned over the next 20 years.

Holmes, Warren↗