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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2014

Copper Nanowire Production for Interconnect Applications

A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

Han, Jin-Woo↗
NASA NTRS1981

Office of Space Terrestrial Applications (OSTA)/Applications Data Service (ADS) data systems standards

Standards needed to interconnect applications data service pilots for data sharing were identified. Current pilot methodologies are assessed. Recommendations for future work are made. A preliminary set of requirements for guidelines and standards for catalogues, directories, and dictionaries was identified. The user was considered to be a scientist at a terminal. Existing and emerging national and international telecommunication standards were adopted where possible in view of new and unproven standards.

Walton, B. A.↗
NASA NTRS1991

Emerging polyheterocyclic films, coatings and resins - Thermoplastic polyquinolines

The processing and performance characteristics of a soluble, thermoplastic polyquinoline suggest its utility in a variety of high performance applications. The polymer is characterized by excellent thermal and oxidative stability, very low moisture absorption, good mechanical properties, very low dielectric constant, and an unusually low thermal expansion coefficient. This polymer, designated PQ-100 (TM), can be cast into strong, transparent, free standing films from common solvents. Coatings of variable thickness can be spin-coated on to silicon and other surfaces. After processing into films, PQ-100 (TM) can be rendered insoluble in a wide range of solvents using a proprietary process. The low CTE contributes to very low residual stress when the polymer is spin-coated onto silicon wafers. PQ-100 (TM) is currently under evaluation for use as an interlayer dielectric substrate in high-density interconnect applications, including multichip modules. Many of the characteristics of the polymer also suggest its utility as a high-performance film and as a matrix resin for specialty composite applications.

Hendricks, Neil H.↗
NASA NTRS2005

Phase-Imaging with a Sharpened Multi-Walled Carbon Nanotube AFM Tip: Investigation of Low-k Dielectric Polymer Hybrids

Phase shift tapping mode scanning force microscopy (TMSFM) has evolved into a very powerful technique for the nanoscale surface characterization of compositional variations in heterogeneous samples. Phase shift signal measures the difference between the phase angle of the excitation signal and the phase angle of the cantilever response. The signal correlates to the tip-sample inelastic interactions, identifying the different chemical and/or physical property of surfaces. In general, the resolution and quality of scanning probe microscopic images are highly dependent on the size of the scanning probe tip. In improving AFM tip technology, we recently developed a technique for sharpening the tip of a multi-walled carbon nanotube (CNT) AFM tip, reducing the radius of curvature of the CNT tip to less than 5 nm while still maintaining the inherent stability of multi-walled CNT tips. Herein we report the use of sharpened (CNT) AFM tips for phase-imaging of polymer hybrids, a precursor for generating nanoporous low-k dielectrics for on-chip interconnect applications. Using sharpened CNT tips, we obtained phase-contrast images having domains less than 10 nm. In contrast, conventional Si tips and unsharpened CNT tips (radius greater than 15 nm) were not able to resolve the nanoscale domains in the polymer hybrid films. C1early, the size of the CNT tip contributes significantly to the resolution of phase-contrast imaging. In addition, a study on the nonlinear tapping dynamics of the multi-walled CNT tip indicates that the multi-walled CNT tip is immune to conventional imaging instabilities related to the coexistence of attractive and repulsive tapping regimes. This factor may also contribute to the phase-contrast image quality of multi-walled CNT AFM tips. This presentation will also offer data in support of the stability of the CNT tip for phase shift TMSFM.

Nguyen, Cattien V.↗
NASA NTRS1999

Novel Three-Dimensional Vertical Interconnect Technology for Microwave and RF Applications

In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,

Goverdhanam, Kavita↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS1973

Flat conductor cable design, manufacture, and installation

Pertinent information for hardware selection, design, manufacture, and quality control necessary for flat conductor cable interconnecting harness application is presented. Comparisons are made between round wire cable and flat conductor cable. The flat conductor cable interconnecting harness systems show major cost, weight, and space savings, plus increased system performance and reliability. The design application section includes electrical characteristics, harness design and development, and a full treatise on EMC considerations. Manufacturing and quality control sections pertain primarily to the developed conductor-contact connector system and special flat conductor cable to round wire cable transitions.

Angele, W.↗
NASA NTRS2004

InGaAs/InP Monolithic Interconnected Modules (MIM) for Thermophotovoltaic Applications

There has been a traditional trade-off in thermophotovoltaic (TPV) energy conversion development between systems efficiency and power density. This trade-off originates from the use of front surface spectral controls such as selective emitters and various types of filters. A monolithic interconnected module (MIM) structure has been developed which allows for both high power densities and high system efficiencies. The MIM device consists of many individual indium gallium arsenide (InGaAs) devices series -connected on a single semi-insulating indium phosphide (InP) substrate. The MIMs are exposed to the entire emitter output, thereby maximizing output power density. An infrared (IR) reflector placed on the rear surface of the substrate returns the unused portion of the emitter output spectrum back to the emitter for recycling, thereby providing for high system efficiencies. Initial MIM development has focused on a 1 sq cm device consisting of eight series interconnected cells. MIM devices, produced from 0,74 eV InGAAs, have demonstrated V(sub infinity) = 3.23 volts, J(sub sc) = 70 mA/sq cm and a fill factor of 66% under flashlamp testing. Infrared (IR) reflectance measurement (less than 2 microns) of these devices indicate a reflectivity of less than 82%. MIM devices produced from 0.55 eV InGaAs have also been den=monstrated. In addition, conventional p/n InGaAs devices with record efficiencies (11.7% AM1) have been demonstrated.

Wilt, David M.↗
NASA NTRS1983

Manipulator interactive design with interconnected flexible elements

This paper describes the development of an analysis tool for the interactive design of control systems for manipulators and similar electro-mechanical systems amenable to representation as structures in a topological chain. The chain consists of a series of elastic bodies subject to small deformations and arbitrary displacements. The bodies are connected by hinges which permit kinematic constraints, control, or relative motion with six degrees of freedom. The equations of motion for the chain configuration are derived via Kane's method, extended for application to interconnected flexible bodies with time-varying boundary conditions. A corresponding set of modal coordinates has been selected. The motion equations are imbedded within a simulation that transforms the vector-dyadic equations into scalar form for numerical integration. The simulation also includes a linear, time-invariant controler specified in transfer function format and a set of sensors and actuators that interface between the structure and controller. The simulation is driven by an interactive set-up program resulting in an easy-to-use analysis tool.

Singh, R. P.↗
NASA NTRS1971

Beam lead technology

Beam lead technology for microcircuit interconnections with applications to metallization, passivation, and bonding

Anderson, K.↗
NASA NTRS1981

Panel C report: Standards needed for the use of ISO Open Systems Interconnection - basic reference model

The use of an International Standards Organization (ISO) Open Systems Interconnection (OSI) Reference Model and its relevance to interconnecting an Applications Data Service (ADS) pilot program for data sharing is discussed. A top level mapping between the conjectured ADS requirements and identified layers within the OSI Reference Model was performed. It was concluded that the OSI model represents an orderly architecture for the ADS networking planning and that the protocols being developed by the National Bureau of Standards offer the best available implementation approach.

Source record↗
NASA NTRS1998

High End Computer Network Testbedding at NASA Goddard Space Flight Center

The Earth & Space Data Computing (ESDC) Division, at the Goddard Space Flight Center, is involved in development and demonstrating various high end computer networking capabilities. The ESDC has several high end super computers. These are used to run: (1) computer simulation of the climate systems; (2) to support the Earth and Space Sciences (ESS) project; (3) to support the Grand Challenge (GC) Science, which is aimed at understanding the turbulent convection and dynamos in stars. GC research occurs in many sites throughout the country, and this research is enabled by, in part, the multiple high performance network interconnections. The application drivers for High End Computer Networking use distributed supercomputing to support virtual reality applications, such as TerraVision, (i.e., three dimensional browser of remotely accessed data), and Cave Automatic Virtual Environments (CAVE). Workstations can access and display data from multiple CAVE's with video servers, which allows for group/project collaborations using a combination of video, data, voice and shared white boarding. The ESDC is also developing and demonstrating the high degree of interoperability between satellite and terrestrial-based networks. To this end, the ESDC is conducting research and evaluations of new computer networking protocols and related technologies which improve the interoperability of satellite and terrestrial networks. The ESDC is also involved in the Security Proof of Concept Keystone (SPOCK) program sponsored by National Security Agency (NSA). The SPOCK activity provides a forum for government users and security technology providers to share information on security requirements, emerging technologies and new product developments. Also, the ESDC is involved in the Trans-Pacific Digital Library Experiment, which aims to demonstrate and evaluate the use of high performance satellite communications and advanced data communications protocols to enable interactive digital library data access between the U. S. Library of Congress, the National Library of Japan and other digital library sites at 155 MegaBytes Per Second. The ESDC participation in this program is the Trans-Pacific access to GLOBE visualizations in real time. ESDC is participating in the Department of Defense's ATDNet with Multiwavelength Optical Network (MONET) a fully switched Wavelength Division Networking testbed. This presentation is in viewgraph format.

Gary, James Patrick↗
NASA NTRS2011

Radiation-Tolerant, SpaceWire-Compatible Switching Fabric

Current and future near-Earth and deep space exploration programs and space defense programs require the development of robust intra-spacecraft serial data transfer electronics that must be reconfigurable, fault-tolerant, and have the ability to operate effectively for long periods of time in harsh environmental conditions. Existing data transfer systems based on state-of-the-art serial data transfer protocols or passive backplanes are slow, power-hungry, and poorly reconfigurable. They provide limited expandability and poor tolerance to radiation effects and total ionizing dose (TID) in particular, which presents harmful threats to modern submicron electronics. This novel approach is based on a standard library of differential cells tolerant to TID, and patented, multi-level serial interface architecture that ensures the reliable operation of serial interconnects without application of a data-strobe or other encoding techniques. This proprietary, high-speed differential interface presents a lowpower solution fully compatible with the SpaceWire (SW) protocol. It replaces a dual data-strobe link with two identical independent data channels, thus improving the system s tolerance to harsh environments through additional double redundancy. Each channel incorporates an automatic line integrity control circuitry that delivers error signals in case of broken or shorted lines.

Katzman, Vladimir↗
NASA NTRS2013

Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

Full-tape-thickness feature; LTCC 9K7 interconnect↗