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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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16 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Silicon solar cell interconnectors for low temperature applications.

Discussion of the design and techniques of solar cell interconnections meeting the requirements of mission life expectancies of 5 to 10 years in the face of the vibration stresses of launch and the stresses induced (especially between dissimilar materials with different thermal coefficients of expansion) by thermal cycling throughout the mission. Generalized stress equations are developed that give the minimum stress relief loop dimensions for a 'no fatigue' interconnector. Also, the thermal expansion stresses induced at the metal-to-silicon interface were investigated and generalized equations developed for determining the stresses in each of the members. These relationships, as verified by experimental tests, can be used to determine the maximum allowable interconnector thickness for failure prevention in thermal cycling environments.

Ralph, E. L.↗
NASA NTRS1990

Particle-in-cell simulations of sheath formation around biased interconnectors in a low-earth-orbit plasma

The interaction between satellite solar arrays and the LEO plasma is presently studied with particle-in-cell simulations in which an electrical potential was suddenly applied to the solar cell interconnector. The consequent temporal response was followed for the real O(+)-electron mass ratio in the cases of 100- and 250-V solar cells, various solar cell thicknesses, and solar cells with secondary electron emission. Larger applied potentials and thinner solar cells lead to greater initial polarization surface charges, and therefore longer discharging and shielding times. When secondary electron emission from the cover glass is brought to bear, however, the potential structure is nearly planar, allowing constant interaction between plasma electrons and cover glass; a large fraction of the resulting secondary electrons is collected by the interconnector, constituting an order-of-magnitude increase in collected current.

Thiemann, H.↗
NASA NTRS1974

Improved circuit-board interconnectors

One component serves three functions, electrical interconnections, thermal control, and mechanical integrity, at same time. Several versions of design: (1) Insulated support plate contains holes; (2) Alternate support plate configuration uses rivets instead of pins; and (3) Another configuration includes leaf-spring contacts instead of pins or rivets.

Martin, J. H.↗
NASA NTRS1973

Thermoelastic analysis of solar cell arrays and their material properties

A thermoelastic stress analysis procedure is reported for predicting the thermally induced stresses and failures in silicon solar cell arrays. A prerequisite for the analysis is the characterization of the temperature-dependent thermal and mechanical properties of the solar cell materials. Extensive material property testing was carried out in the temperature range -200 to +200 C for the filter glass, P- and N-type silicon, interconnector metals, solder, and several candidate silicone rubber adhesives. The analysis procedure is applied to several solar cell array design configurations. Results of the analysis indicate the optimum design configuration, with respect to compatible materials, effect of the solder coating, and effect of the interconnector geometry. Good agreement was found between results of the analysis and the test program.

Salama, M. A.↗
NASA NTRS1975

Thermoelastic analysis of solar cell arrays and their material properties

Announced report discusses experimental test program in which five different solar cell array designs were evaluated by subjecting them to 60 thermal cycles from minus 190 deg to 0.0 deg. Results indicate that solder-coated cells combined with Kovar n-interconnectors and p-interconnectors are more durable under thermal loading than other configurations.

Salama, M. A.↗
NASA NTRS1974

Thermoelastic analysis of solar cell arrays and their material properties

Description of a thermoelastic stress analysis procedure for predicting the thermally induced stresses and failures in silicon solar cell arrays. A prerequisite for the analysis is the characterization of the temperature-dependent thermal and mechanical properties of the solar cell materials. Extensive material property testing was carried out in the temperature range from -200 to +200 C for the filter glass, P- and N-type silicon, interconnector metals, solder, and several candidate silicone rubber adhesives. The analysis procedure is applied to several solar cell array design configurations, which were tested in the Space Molecular Sink. Results of the analysis indicate the optimum design configuration with respect to materials and geometry, effect of the solder coating, and effect of the interconnector geometry.

Salama, M. A.↗
NASA NTRS1973

Feasibility study of a 110 watt per kilogram lightweight solar array system

The feasibility of a 10,000 watt solar array panel which has a minimum power-to-mass ratio of 110 watt/kg is discussed. The application of this ultralightweight solar array to three possible missions was investigated. With the interplanetary mission as a baseline, the constraining requirements for a geosynchronous mission and for a manned space station mission are presented. A review of existing lightweight solar array system concepts revealed that changes in the system approach are necessary to achieve the specified 110 watt/kg goal. A comprehensive review of existing component technology is presented in the areas of thin solar cells, solar cell covers, welded interconnectors, substrates and deployable booms. Advances in the state-of-the-art of solar cell and deployable boom technology were investigated. System level trade studies required to select the optimum boom bending stiffness, system aspect ratio, bus voltage level, and solar cell circuit arrangement are reported. Design analysis tasks included the thermal analysis of the solar cell blanket, thermal stress analysis of the solar cell interconnectors/substrate, and the thermostructural loading of the deployed boom.

Shepard, N. F.↗
NASA NTRS1978

Development of a shingle-type solar cell module

The development of a solar cell module, which is suitable for use in place of shingles on the sloping roofs of residental or commercial buildings, is reported. The design consists of nineteen series-connected 53 mm diameter solar cells arranged in a closely packed hexagon configuration. The shingle solar cell module consists of two basic functional parts: an exposed rigid portion which contains the solar cell assembly, and a semi-flexible portion which is overlapped by the higher courses of the roof installation. Consideration is given to the semi-flexible substrate configuration and solar cell and module-to-module interconnectors. The results of an electrical performance analysis are given and it is noted that high specific power output can be attributed to the efficient packing of the circular cells within the hexagon shape. The shingle should function for at least 15 years, with a specific power output of 98 W/sq w.

Shepard, N. F., Jr.↗
NASA NTRS1978

Interconnecting conductively coated coverslides

The International Sun Earth Explorer-1 has the requirement that the entire outer surface of the spacecraft be conductive. A transparent coating of indium oxide was deposited for that reason on the satellite's solar cell coverglasses in order to give them a conductive surface, and the surfaces were interconnected to ground. This paper examines the interconnector attachment problem. On the ISEE-1, wires were bonded to the coverglasses by using a conductive epoxy; the resistance of these bonds increased dramatically with time. A program was initiated to find the functional cause of the resistance increase and to flight-qualify an alternative method of bonding. It was found the tests initiated were insufficient to find the cause of resistance increase and that an alternative solution of using indium solder is acceptable for bonding wires directly to indium oxide.

Gaddy, E. M.↗
NASA NTRS1981

SLAM examination of solar cells and solar cell welds

The scanning laser acoustic microscope (SLAM) has been evaluated for non-destructive examination of solar cells and interconnector bonds. Using this technique, it is possible to view through materials in order to reveal regions of discontinuity such as microcracks and voids. Of particular interest is the ability to evaluate, in a unique manner, the bonds produced by parallel gap welding. It is possible to not only determine the area and geometry of the bond between the tab and cell, but also to reveal any microcracks incurred during the welding. By correlating the SLAM results with conventional techniques of weld evaluation a more confident weld parameter optimization can be obtained.

Stella, P. M.↗
NASA NTRS1982

Development of technologies for welding interconnects to fifty-micron thick silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Patterson, R. E.↗
NASA NTRS1983

Welding interconnects to 50-micron silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Patterson, R. E.↗
NASA NTRS1985

NASA welding assessment program

A program was conducted to demonstrate the cycle life capability of welded solar cell modules relative to a soldered solar cell module in a simulated low earth orbit thermal environment. A total of five 18-cell welded (parallel gap resistance welding) modules, three 18-cell soldered modules, and eighteen single cell samples were fabricated using 2 x 4 cm silicon solar cells from ASEC, fused silica cover glass from OCLI, silver plated Invar interconnectors, DC 93-500 adhesive, and Kapton-Kevlar-Kapton flexible substrate material. Zero degree pull strength ranged from 2.4 to 5.7 lbs for front welded contacts (40 samples), and 3.5 to 6.2 lbs for back welded contacts (40 samples). Solar cell cross sections show solid state welding on both front and rear contacts. The 18-cell welded modules have a specific power of 124 W/kg and an area power density of 142 W/sq m (both at 28 C). Three welded and one soldered module were thermal cycle tested in a thermal vacuum chamber simulating a low earth orbit thermal environment.

Patterson, R. E.↗
NASA NTRS1984

Progress in developing ultrathin solar cell blanket technology

A program was conducted to develop technologies for welding interconnects to three types of 50-micron-thick, 2 by 2-cm solar cells. Parallel-gap resistance welding was used for interconnect attachment. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Six 48-cell modules were assembled with 50-micron (nominal) thick cells, frosted fused-silica covers, silver-plated Invar interconnectors, and four different substrate designs. Three modules (one for each cell type) have single-layer Kapton (50-micron-thick) substrates. The other three modules each have a different substrate (Kapton-Kevlar-Kapton, Kapton-graphite-Kapton, and Kapton-graphite-aluminum honeycomb-graphite). All six modules were subjected to 4112 thermal cycles from -175 to 65 C (corresponding to over 40 years of simulated geosynchronous orbit thermal cycling) and experienced only negligible electrical degradation (1.1 percent average of six 48-cell modules).

Patterson, R. E.↗
NASA NTRS2005

High Temperature Performance of a SiC MESFET Based Oscillator

A hybrid, UHF-Band differential oscillator based on 10 w SiC RF Power Metal Semiconductor Field Effect Transistor (MESFET) has been designed, fabricated and characterized through 475 C. Circuit is fabricated on an alumina substrate with thin film spiral inductors, chip capacitors, chip resistors, and wire bonds for all crossovers and interconnectors. The oscillator delivers 15.7 dBm at 515 MHz into a 50 Ohm load at 125 C with a DC to RF conversion efficiency of 2,8%. After tuning the load impedance, the oscillator delivers 18.8 dBm at 610 MHz at 200 C with a DC to RF conversion efficiency of 5.8%. Finally, by tuning the load and bias conditions, the oscillator delivers 4.9 dBm at 453 MHz at 475 C.

Schwartz, Zachary D.↗