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At least 19 records

Advanced Technology Development: Solid-Liquid Interface Characterization Hardware

Characterizing the solid-liquid interface during directional solidification is key to understanding and improving material properties. The goal of this Advanced Technology Development (ATD) has been to develop hardware, which will enable real-time characterization of practical materials, such as aluminum (Al) alloys, to unprecedented levels. Required measurements include furnace and sample temperature gradients, undercooling at the growing interface, interface shape, or morphology, and furnace translation and sample growth rates (related). These and other parameters are correlated with each other and time. A major challenge was to design and develop all of the necessary hardware to measure the characteristics, nearly simultaneously, in a smaller integral furnace compatible with existing X-ray Transmission Microscopes, XTMs. Most of the desired goals have been accomplished through three generations of Seebeck furnace brassboards, several varieties of film thermocouple arrays, heaters, thermal modeling of the furnaces, and data acquisition and control (DAC) software. Presentations and publications have resulted from these activities, and proposals to use this hardware for further materials studies have been submitted as sequels to this last year of the ATD.

Source record

Solid-Liquid Interface Characterization Hardware

The objective is to develop enabling technology to characterize the solid-liquid interface during directional solidification to unprecedented levels with real-time measurement hardware. Existing x-ray imaging hardware is combined with compact Seebeck furnaces and thermal profiling hardware, under development, to accomplish the measurements. Furnace thermal profiles are continuously measured in addition to the sample characteristics.

Peters, Palmer N.

Solid-Liquid Interface Characterization Hardware: Advanced Technology Development (ATD)

This ATD has the goal of enabling the integration of three separate measurement techniques to characterize the solid-liquid interface of directionally solidified materials in real-time. Arrays of film-based metal thermocouple elements are under development along with compact Seebeck furnaces suitable for interfacing with separately developed X-ray Transmission Microscopes. Results of applying film arrays to furnace profiling are shown, demonstrating their ability to identify a previously undetected hardware flaw in the development of a second-generation compact furnace. Results of real-time furnace profiling also confirmed that the compact furnace design effectively isolates the temperature profiles in two halves of the furnace, a necessary feature. This isolation had only been inferred previously from the characteristics of Seebeck data reported. Results from a 24-thermocouple array successfully monitoring heating and isothermal cooling of a tin sample are shown. The importance of non-intrusion by the arrays, as well as furnace design, on the profiling of temperature gradients is illustrated with example measurements. Further developments underway for effectively combining all three measurements are assessed in terms of improved x-ray transmission, increased magnification, integral arrays with minimum intrusion, integral scales for velocity measurements and other features being incorporated into the third generation Seebeck furnace under construction.

Peters, Palmer N.

Techniques for improving the Si-SiO2 interface characterization

The two techniques which have provided most of the information on interface states in MIS-C (metal-insulator-semiconductor-capacitor) structures are the 'quasi-static method' and the 'conductance method'. Sher et al. (1979) and Su et al. (1980) have suggested a number of improvements concerning these methods. The present investigation has the objective to extend the earlier results and to offer a new tentative interpretation of the data. A critical review is conducted of the data collection and reduction techniques for the quasi-static method, taking into account the sample, the quasi-static capacitance, and the surface potential. In connection with a discussion of the conductance method, attention is given to parallel conductance and capacitance measurements, interface-state densities, time constants, and measurements on a (110) surface orientation.

Sher, A.

Mechanisms of Interfacial Mixing in the Blown Powder Deposition of Inconel 625 to Copper Alloy for Liquid Rocket Engine Applications

There is an increasing need for functional materials to support high heat flux applications and optimize weight by using bimetallic additive manufacturing (AM). While one promising fabrication technology is the use of blown powder directed energy deposition (DED) AM, challenges remain with bi-metallic combinations. Prominent among these challenges is the need to understand mixing of materials at the bimetallic interface for forming stronger, more durable and reliable joints to extend the versatility of AM into critical applications. One application is the manufacturing of combustion chambers with copper-alloy liners and Superalloy structural jackets. In this application, material combinations are selected for effective heat dissipation, using copper, and retention of strength at high temperatures using Inconel 625. Currently, the dominant problem with this configuration is the highly variable strength of the interface and its correlation with deposition parameters. In this study, samples were fabricated at several vendors with Inconel 625 deposited onto wrought C-18150 (Cu-Cr-Zr) to form a bimetallic interface. Characterization of the interfaces were achieved through optical and electron microscopy, mechanical testing of mini tensile specimens, and electron dispersion spectroscopy to understand diffusion and bulk mixing behaviors at the joint. A theoretical framework was constructed in the context of solidification and mixing mechanisms to explain the resulting differences in the interface. This qualitative approach utilized a fluid dynamics perspective to sum the order of magnitudes of the various acting forces on the weld pool during deposition to predict convection trends based off known parameters. The predicted trends for each vendor are compared to obtain a better understanding of how mixing in the molten pool varied based on deposition parameters.

Additive Manufacturing

Pulsed-echo interface wave characterization of bolted plates

Ultrasonic waves which propagate along the plane boundary separating two solid substrates were used to characterize aluminum and titanium plates adhesively bonded and bolted together. Wave pulses were used to produce interface waves between the aluminum and a Ti-6Al-4V titanium alloy bar by normal mode conversion. Interface wave reflections from bolt holes drilled through the interface were reconverted to surface wave pulses and detected by the same wedge by standard pulse-echo techniques. Time of flight measurements indicate that the reflected waves are a supersonic of longitudinal modes and circularly symmetric waves that propagate around the bolt hole.

Turner, T. M.

Surface fluctuation spectroscopy - A novel technique for characterizing liquid interfaces

Surface fluctuation spectroscopy is a dynamic light scattering technique which involves the detection of thermal fluctuations (capillary waves) that cover every liquid interface. The advantages of this technique over conventional mechanical methods are discussed. The signal resolution and precision are improved by using a grating heterodyne technique coupled with a digital correlator. Detailed calculations showed that, for the measured power spectrum (the Fourier transform of the correlation function) to take the Lorentzian shape, it is necessary that certain optical conditions be met. These conditions are demonstrated with experimental data collected for ethanol at the ambient temperature as a function of the wave number. Once the optical parameters are adjusted correctly, the experimental results show excellent agreement with the literature values. It is also demonstrated that, using microcomputer technology, the entire system can be automated.

Shih, L. B.

Ballistic-Electron-Emission Microscopy Techniques for Nanometer-scale Characterization of Interfaces

Semiconductor interface properties are among the most important phenomena in materials science and technology. The study of metal/semiconductor Schottky barrier interfaces has been the primary focus of a large research and development community for decades. Throughout the long history of interface investigation, the study of interface defect electronic properties have been seriously hindered by the fundamental experimental difficulty of probing subsurface structures. A new method, Ballistic-Electron-Emission Microscopy (BEEM), has been developed which not only enables spectroscopic probing of subsurface interface properties, but also, provides nanometer-resolution imaging capabilities. BEEM employs Scanning Tunneling Microscopy (STM) and a unique spatially localized ballistic electron spectroscopy method...

Bell, L. D.

Ultrasonic Characterization of Interfaces in Composite Bonds

The inverse determination of imperfect interfaces from reflection spectra of normal and oblique incident ultrasonic waves in adhesive bonds of multidirectional composites is investigated. The oblique measurements are complicated by the highly dispersed nature of oblique wave spectra at frequencies above 3MHz. Different strategies for bond property reconstruction, including a modulation method, are discussed. The relation of measured interfacial spring density to the physico-chemical model of a composite interface described by polymer molecular bonds to emulate loss of molecular strength on an adhesive composite interface is discussed. This potentially relates the interfacial (adhesion) strength (number of bonds at the adhesive substrate interface) to the spring constant (stiffness) area density (flux), which is an ultrasonically measurable parameter.

Wang, N.

Experimental and Numerical Analysis of Skin-Stiffener Separation Using a Seven-Point Bend Configuration

Skin-stiffener separation in stiffened composite panels consists of a complex interaction between multiple scales of progressive damage and failure mechanisms. This work used a superposed cohesive element method of modeling resistance curve effects that represents the structural interface of a unidirectional tape skin and a fabric stiffener. Finite element models using cohesive elements with input properties obtained from tape-to-fabric interface characterization tests were compared to experimental results of a stable skin-stiffener separation characterization test using a seven-point bend fixture. This fixture deformed the stiffened panel specimens into a buckled configuration which induced mixed-mode interlaminar stress states at the skin-stiffener interface. The advantage of this fixture was the potential for more stable damage initiation and delamination growth compared to a stringer-stiffened panel under axial compression. Use of the superposed cohesive elements showed promise, but the characterization of interface material properties as input to the cohesive elements remains a crucial component to be investigated to ensure accurate prediction of skin-stiffener separation.

Kosztowny, Cyrus J. R.

Studies of the Si/SiO2 interface using synchrotron radiation

Synchrotron radiation photoemission spectroscopy (SRPS) in the 1-4 KeV photon energy range is a useful tool for interface characterization. Results are presented of a series of studies of the near-interface region of Si/SiO2 which confirm that a bond strain gradient exists in the oxide as a result of lattice mismatch. These experiments include measurement of photoemission lineshape changes as a function of photon energy, corresponding changes in the electron escape depth near the interface, and surface extended X-ray absorption fine structure (SEXAFS) measurements directly indicating the shortening of the Si-Si second nearest neighbor distance in the near-interface region of the oxide.

Hecht, M. H.

Experimental study of the minority-carrier transport at the polysilicon-monosilicon interface

This paper presents the results of an experimental study designed to explore both qualitatively and quantitatively the mechanism of the improved current gain in bipolar transistors with polysilicon emitter contacts. Polysilicon contacts were deposited and heat treated at different conditions. The electrical properties were measured using p-n junction test structures that are much more sensitive to the contact properties than are bipolar transistors. A simple phenomenological model was used to correlate the structural properties with electrical measurements. Possible transport mechanisms are examined and estimates are made about upper bounds on transport parameters in the principal regions of the devices. The main conclusion of this study is that the minority-carrier transport in the polycrystalline silicon is dominated by a highly disordered layer at the polysilicon-monosilicon interface characterized by very low minority-carrier mobility. The effective recombination velocity at the n(+) polysilicon-n(+) monosilicon interface was found to be a strong function of fabrication conditions. The results indicate that the recombination velocity can be much smaller than 10,000 cm/s.

Neugroschel, A.

Determination of stress intensity factors for interface cracks under mixed-mode loading

A simple technique was developed using conventional finite element analysis to determine stress intensity factors, K1 and K2, for interface cracks under mixed-mode loading. This technique involves the calculation of crack tip stresses using non-singular finite elements. These stresses are then combined and used in a linear regression procedure to calculate K1 and K2. The technique was demonstrated by calculating three different bimaterial combinations. For the normal loading case, the K's were within 2.6 percent of an exact solution. The normalized K's under shear loading were shown to be related to the normalized K's under normal loading. Based on these relations, a simple equation was derived for calculating K1 and K2 for mixed-mode loading from knowledge of the K's under normal loading. The equation was verified by computing the K's for a mixed-mode case with equal and normal shear loading. The correlation between exact and finite element solutions is within 3.7 percent. This study provides a simple procedure to compute K2/K1 ratio which has been used to characterize the stress state at the crack tip for various combinations of materials and loadings. Tests conducted over a range of K2/K1 ratios could be used to fully characterize interface fracture toughness.

Naik, Rajiv A.

Network-Capable Application Process and Wireless Intelligent Sensors for ISHM

Intelligent sensor technology and systems are increasingly becoming attractive means to serve as frameworks for intelligent rocket test facilities with embedded intelligent sensor elements, distributed data acquisition elements, and onboard data acquisition elements. Networked intelligent processors enable users and systems integrators to automatically configure their measurement automation systems for analog sensors. NASA and leading sensor vendors are working together to apply the IEEE 1451 standard for adding plug-and-play capabilities for wireless analog transducers through the use of a Transducer Electronic Data Sheet (TEDS) in order to simplify sensor setup, use, and maintenance, to automatically obtain calibration data, and to eliminate manual data entry and error. A TEDS contains the critical information needed by an instrument or measurement system to identify, characterize, interface, and properly use the signal from an analog sensor. A TEDS is deployed for a sensor in one of two ways. First, the TEDS can reside in embedded, nonvolatile memory (typically flash memory) within the intelligent processor. Second, a virtual TEDS can exist as a separate file, downloadable from the Internet. This concept of virtual TEDS extends the benefits of the standardized TEDS to legacy sensors and applications where the embedded memory is not available. An HTML-based user interface provides a visual tool to interface with those distributed sensors that a TEDS is associated with, to automate the sensor management process. Implementing and deploying the IEEE 1451.1-based Network-Capable Application Process (NCAP) can achieve support for intelligent process in Integrated Systems Health Management (ISHM) for the purpose of monitoring, detection of anomalies, diagnosis of causes of anomalies, prediction of future anomalies, mitigation to maintain operability, and integrated awareness of system health by the operator. It can also support local data collection and storage. This invention enables wide-area sensing and employs numerous globally distributed sensing devices that observe the physical world through the existing sensor network. This innovation enables distributed storage, distributed processing, distributed intelligence, and the availability of DiaK (Data, Information, and Knowledge) to any element as needed. It also enables the simultaneous execution of multiple processes, and represents models that contribute to the determination of the condition and health of each element in the system. The NCAP (intelligent process) can configure data-collection and filtering processes in reaction to sensed data, allowing it to decide when and how to adapt collection and processing with regard to sophisticated analysis of data derived from multiple sensors. The user will be able to view the sensing device network as a single unit that supports a high-level query language. Each query would be able to operate over data collected from across the global sensor network just as a search query encompasses millions of Web pages. The sensor web can preserve ubiquitous information access between the querier and the queried data. Pervasive monitoring of the physical world raises significant data and privacy concerns. This innovation enables different authorities to control portions of the sensing infrastructure, and sensor service authors may wish to compose services across authority boundaries.

Figueroa, Fernando

Radioisotope Heater Unit-Based Stirling Power Convertor Development at NASA Glenn Research Center

Stirling Radioisotope Power Systems (RPS) are being developed as an option to provide power on future space science missions where robotic spacecraft will orbit, flyby, land or rove. A variety of mission concepts have been studied by NASA and the U. S. Department of Energy that would utilize RPS for landers, probes, and rovers and only require milliwatts to tens of watts of power. These missions would contain science measuring instruments that could be distributed across planetary surfaces or near objects of interest in space solar flux insufficient for using solar cells. A low power Stirling convertor is being developed to provide an RPS option for future low power applications. Initial concepts convert heat available from several Radioisotope Heater Units to electrical power for spacecraft instruments and communication. Initial development activity includes defining and evaluating a variety of Stirling configurations and selecting one for detailed design, research of advanced manufacturing methods that could simplify fabrication, evaluating thermal interfaces, characterizing components and subassemblies to validate design codes, and preparing for an upcoming demonstration of proof of concept in a laboratory environment.

Wilson, Scott D.

Radioisotope Heater Unit-Based Stirling Power Convertor Development at NASA Glenn Research Center

Stirling Radioisotope Power Systems (RPS) are being developed as an option to provide power on future space science missions where robotic spacecraft will orbit, flyby, land or rove. A variety of mission concepts have been studied by NASA and the U. S. Department of Energy that would utilize RPS for landers, probes, and rovers and only require milliwatts to tens of watts of power. These missions would contain science measuring instruments that could be distributed across planetary surfaces or near objects of interest in space solar flux insufficient for using solar cells. A low power Stirling convertor is being developed to provide an RPS option for future low power applications. Initial concepts convert heat available from several Radioisotope Heater Units to electrical power for spacecraft instruments and communication. Initial development activity includes defining and evaluating a variety of Stirling configurations and selecting one for detailed design, research of advanced manufacturing methods that could simplify fabrication, evaluating thermal interfaces, characterizing components and subassemblies to validate design codes, and preparing for an upcoming demonstration of proof of concept in a laboratory environment.

Wilson, Scott D.

Real Time Characterization of Solid/Liquid Interfaces During Directional Solidification

A X-Ray Transmission Microscope (XTM) has been developed to observe in real time and in-situ solidification phenomenon at the solid/liquid interface. Recent improvements in the horizontal Bridgman furnace design provides real-time magnification (during solidification) up to 12OX. The increased magnification has enabled for the first time the XTM imaging of real-time growth of fibers and particles with diameters of 3-6 micrometers. Further, morphological transitions from planar to cellular interfaces have also been imaged. Results from recent XTM studies on Al-Bi monotectic system, Al-Au eutectic system and interaction of insoluble particles with s/I interfaces in composite materials will be presented. An important parameter during directional solidification of molten metal is the interfacial undercooling. This parameter controls the morphology and composition at the s/I interface. Conventional probes such as thermocouples, due to their large bead size, do not have sufficient resolution for measuring undercooling at the s/I interface. Further, the intrusive nature of the thermocouples also distorts the thermal field at the s/I interface. To overcome these inherent problems we have recently developed a compact furnace which utilizes a non-intrusive technique (Seebeck) to measure undercooling at the S/I interface. Recent interfacial undercooling measurements obtained for the Pb-Sn system will be presented. The Seebeck measurement furnace in the future will be integrated with the XTM to provide the most comprehensive tool for real time characterization of s/I interfaces during solidification.

Sen, S.

Characterization of graded interface In(x)Ga(1-x)As/In(0.52)Al(0.48)As (x between 0.53 and 0.70) structures grown by molecular-beam epitaxy

Modulation-doped In(x)Ga(1-x)As/In(0.52)Al(0.48)As/InP structures were grown by molecular-beam epitaxy with x values between 53 and 70 percent. For pseudomorphic cases, graded instead of abrupt interfaces were used. Hall mobility and persistent photoconductivity measurements as a function of temperature were used to characterize samples with different structural parameters. Consistent trends in the variation of mobilities and two-dimensional carrier concentration, n(2D), under light and dark conditions have been observed and discussed in terms of applicable scattering mechanisms. The Hall mobilities are comparable to the best results obtained to date but with significantly higher n(2D) concentration.

Peng, C. K.