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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Accelerated Aging of Lead-Free Propellant

Following higher than expected 2-NDPA depletion rates in a lead-free doublebase formulation (RPD-422), an accelerated aging study was conducted to verify the depletion rates. A test plan was prepared to compare the aging characteristics of lead-free propellant and NOSIH-AA2. The study was also designed to determine which lead-free ballistic modifiers accelerated 2-NDPA depletion. The increased depletion rate occurred in propellants containing monobasic copper salicylate. Four lead-free propellants were then formulated to improved aging characteristics over previous lead-free propellant formulations. The new formulations reduced or replaced the monobasic copper salicylate. The new formulations had improved aging characteristics. Their burn rates, however, were unacceptable for use in a 2.75 inch rocket. To compare aging characteristics, stabilizer depletion rates of RPD-422, AA2, M28, and RLC 470/6A were measured or taken from the literature. The data were fit to a kinetic model. The model contained first and zero order terms which allowed the stabilizer concentration to go to zero. In the model, only the concentration of the primary stabilizer was considered. Derivatives beyond the first nitrated or nitroso derivative of 2-NPDA were not considered. The rate constants were fit to the Arrhenius equation and extrapolated to lower temperatures. The time to complete stabilizer depletion was estimated using the kinetic model. The four propellants were compared and the RPD-422 depleted faster at 45 C than both A22 and M28. These types of predictions depend on the validity of the model and on confidence in the Arrhenius relationship holding at lower temperatures. At 45 C, the zero order portion of the model dominates the depletion rate.

Furrow, Keith W.↗
NASA NTRS2004

Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

Brown, Christina↗
NASA NTRS2000

Lead-Free Double-Base Propellant for the 2.75 Inch Rocket Motor

The current MK 66 2.75 inch Rocket Motor double-base propellant contains the lead-based ballistic modifier LC-12-15 to achieve the desired plateau and mesa burning rate characteristics. The use of lead compounds poses a concern for the environment and for personal safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacture, rocket motor firing, and disposal. Copper beta-resorcylate (copper 2,4-di-hydroxy-benzoate) was successfully used in propellant as a simple modifier in the mid 1970's. This and other compounds have also been mixed with lead salts to obtain more beneficial ballistic results. Synthesized complexes of lead and copper compounds soon replaced the mixtures. The complexes incorporate the lead, copper lack of organic liquids, which allows for easier propellant processing. About ten years ago, the Indian Head Division, Naval Surface Warfare Center (NSWC), initiated an effort to develop a lead-free propellant for use in missile systems. Several lead-free propellant candidate formulations were developed. About five years ago, NSWC, in conjunction with Alliant Techsystems, Radford Army Ammunition Plant, continued ballistic modifier investigations. A four component ballistic modifier system without lead for double-base propellants that provide adequate plateau and mesa burn rate characteristics was developed and patented. The ballistic modifier's system contains bismuth subsalicylate, 1.5 percent; copper salicylate, 1.0 percent, copper stannate, 0.77 percent; and carbon black, 0.1 percent. Action time and impulse data obtained through multiple static firings indicate that the new lead-free double-base propellant, while not a match for NOSIH-AA-2, will be a very suitable replacement in the 2.75 inch Rocket Motor. Accelerated aging of the double-base propellant containing the lead-free ballistic modifier showed that it had a much higher rate of stabilizer depletion than the AA-2. A comprehensive study showed that an increased rate of stabilizer depletion occurred in propellants containing monobasic copper salicylate. The study also showed that propellants containing a mixture of bismuth subsalicylate and copper salicylate, had only about one-half the stabilizer depletion rate than those with copper salicylate alone. The copper salicylate catalyzes the decomposition of nitroglycerin, which triggers a chain of events leading to the increased rate of stabilizer depletion. A program has been initiated to coat the ballistic modifier, thus isolating it from the nitroglycerin.

Magill, B. T.↗
NASA NTRS2005

Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies

This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support.

assembly reliability↗
NASA NTRS2003

Lead-free solders: issues of toxicity, availability and impacts of extraction

This project set out to evaluate the critical issues of toxicity and public health effects, material availability, and the environmental impacts of raw material extraction and metal finishing, with the goal of using environmental impact as a factor in selecting feasible lead-free alloys.

toxicity lead-free solder packaging↗
NASA NTRS1985

Coupling functions for lead and lead-free neutron monitors from the latitudinal measurements performed in 1982 in the research station Academician Kurchatov

The latitudinal behavior of intensities and multiplicities was registered by the neutron monitor 2 NM and the lead-free neutron monitor 3 SND (slow-neuron detector) in the equator-Kaliningrad line in the Atlantic Ocean. Coupling coefficients for 3 SND show the sensitivity of this detector to primary particles of cosmic rays of energies on the average lower than for 2 NM. As multiplicities increase, the coupling coefficients shift towards higher energies.

Alekanyan, T. M.↗
NASA NTRS2000

Lead-Free Propellant for Propellant Actuated Devices

Naval Surface Warfare Center, Indian Head Division's CAD/PAD Department has been working to remove toxic compounds from our products for about a decade. In 1992, we embarked on an effort to develop a lead-free double base propellant to replace that of a foreign sole source. At the time there were availability concerns. In 1995, the department developed a strategic proposal to include a wider range of products. Efforts included such efforts as removing lead sheathing from linear explosives and replacing lead azide and lead styphnate compounds. This paper will discuss efforts specifically related to developing non-leaded double base propellant for use in various Propellant Actuated Devices (PADs) for aircrew escape systems. The propellants can replace their leaded counterparts, mitigating lead handling, processing, or toxic exposure to the environment and personnel. This work eliminates the use of leaded compounds, replacing them with a more environmentally benign metal-organic salt. Historically double-base propellants have held an advantage over other families of energetic materials through their relative insensitivity of the burning rate to changes in temperature and pressure. This desirable ballistic effect has been obtained with the use of a lead-organic salt alone or in a physical mixture with a copper-organic salt, or more recently with a lead-copper complex. These ballistic modifiers are typically added to the double-base 'paste' prior to gelatinization on heated calendars or one type or another. The effect of constant burning rate over a pressure range is called a 'plateau' while an even more beneficial effect of decreasing burning rate with increasing pressure is termed a 'mesa.' The latter effect results in very low temperature sensitivity of the propellant burning rate. Propellants with such effects are ideal tactical rocket motor propellants. The use of lead compounds poses a concern for the environment and personnel safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacturing, rocket firings, and disposal. Two separate programs are underway at Indian Head to replace the leaded ballistic modifiers in NOSIH-AA-2 and KU propellants. Although the system requirements were very different, the programs gained valuable information from one another throughout their course.

Goodwin, John L.↗
NASA NTRS2008

Developing a NASA Lead-Free Policy for Electronics - Lessons Learned

The National Aeronautics and Space Administration (NASA) is not required by United States or international law to use lead-free (Pb-free) electronic systems but international pressure in the world market is making it increasingly important that NASA have a Pb-free policy. In fact, given the international nature of the electronics market, all organizations need a Pb-free policy. This paper describes the factors which must be taken into account in formulating the policy, the tools to aid in structuring the policy and the unanticipated and difficult challenges encountered. NASA is participating in a number of forums and teams trying to develop effective approaches to controlling Pb-free adoption in high reliability systems. The activities and status of the work being done by these teams will be described. NASA also continues to gather information on metal whiskers, particularly tin based, and some recent examples will be shared. The current lack of a policy is resulting in "surprises" and the need to disposition undesirable conditions on a case-by-case basis. This is inefficient, costly and can result in sub-optimum outcomes.

Sampson, Michael J.↗
NASA NTRS2007

NASA-DoD Lead-Free Electronics Project

The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt↗
NASA NTRS1985

Sensitivity of single and multiple cosmic ray neutrons to the surrounding medium in a lead-free monitor

In 1981-1985 the neutron component of cosmic rays was recorded, the effect of cosmic ray multiplication in lead being disregarded. The recording device consisted of neutron counters placed in a polyethylene retarder (polyethylene tubes with wall thickness of 2 cm). The device registered neutrons formed directly on the surface or not deep underground; the intensity of neutrons depended on the chemical composition of the substance. The neutron component was also measured in the Moscow Canal, Belomor-Baltic Canal, and in the Atlantic Ocean. The time variation of 5 minute data of the intensity obtained in the Belomor-Baltic Canal and in the Atlantic Ocean relative to the mean value in the open sea (in %) is presented.

Dorman, I. V.↗
NASA NTRS2002

Hi-rel lead-free printed wiring assemblies

The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage. This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assemblies printed wiring boards.

lead tin-lead wiring-boards solder pastes↗
NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗
NASA NTRS2005

Lead free 0201 assembly and thermal cycle/aging reliability

The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.

isothermal aging↗