An update on the NEPP lead-free solder project
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printed wiring assembly PWA fabrication lead-free ↗
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Results for “lead-free process”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Reliability and paste process optimization of eutectic and lead-free for mixed packaging
This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.
reliability AAR SMT↗
Issues concering the replacement of lead in Hi-Rel electronic applications
This paper examines some of these alternative solders for their suitability in replacing tin/lead solder in high-reliability applications.
technologies↗
Choosing the right lead-free solder for hi-rel printed wiring assemblies
This paper presents data collected from a recent NASA project that focuses specifically on finding suitable altematives to eutectic tin-lead solders, especially in solder paste applications.
technologies↗
Lead free 0201 assembly and thermal cycle/aging reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.
isothermal aging↗
Processing-structure-property relationships in BiFeO3-BaTiO3 lead-free ferroelectrics
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Bishop, Sean Robert↗
Facilitating NASA's Use of GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder
GEIA-STD-0005-1 defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that AHP electronic systems containing lead-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certify-ability throughout the specified life of performance. It communicates requirements for a Lead-Free Control Plan (LFCP) to assist suppliers in the development of their own Plans. The Plan documents the Plan Owner's (supplier's) processes, that assure their customer, and all other stakeholders that the Plan owner's products will continue to meet their requirements. The presentation reviews quality assurance requirements traceability and LFCP template instructions.
Plante, Jeannete↗
Ultrafast Carrier Self-Trapping Driven by Strong Exciton–Phonon Coupling in 2D MA 3 Bi 2 I 6 Cl 3 Perovskite
Two-dimensional (2D) hybrid bismuth halide perovskites have emerged as promising lead-free materials for optoelectronic applications due to their solution processability and tunable structures. Here, in this study, we investigate 2D layered hybrid perovskite MA 3 Bi 2 I 6 Cl 3 using temperature-dependent photoluminescence (PL) and femtosecond transient absorption spectroscopy. Our results reveal strong coupling between excitons and phonons, evidenced by giant Huang–Rhys factors, coherent phonon oscillations, and ultrafast carrier self-trapping into small-polaron and self-trapped exciton (STE) states. These processes appear as time-dependent ground-state bleach and photoinduced absorption features, highlighting the influence of the lattice in carrier dynamics. Wavelength- and time-resolved measurements reveal that PL emission is dominated by STEs, while free exciton emission is weak and short-lived. By comparing 2D MA 3 Bi 2 I 6 Cl 3 with 0D MA 3 Bi 2 I 9 , which contains molecularly isolated [BiI 6 ] 3− octahedra and 2D MA 3 Bi 2 Br 9 perovskites, we demonstrate how halide composition and structural dimensionality influence the balance between free exciton populations and carrier localization. These insights uncover the intrinsic kinetic landscape of photoexcited states in MA 3 Bi 2 I 6 Cl 3 . Overall, our study contributes to a mechanistic understanding of exciton–phonon interactions in lead-free 2D perovskites.
Pradeep, Kodimana Ramakrishnan [Northwestern Univ.↗
Properties of Electronic Materials
This final technical report summarizes the research conducted under DOE Grant DE-SC0002623, "Properties of Electronic Materials," led by Principal Investigator Shengbai Zhang at Rensselaer Polytechnic Institute. Over the 16-year period, the project employed first-principles computational methods to investigate the structural, electronic, and dynamic properties of a wide range of electronic materials, with applications in energy technologies, optoelectronics, and data storage. Key areas included topological insulators, phase-change materials, graphene and two-dimensional systems, perovskites for photovoltaics, defect engineering in semiconductors, kagome lattices, and ultrafast carrier dynamics. The research resulted in 115 peer-reviewed publications, advancing fundamental understanding of material behaviors at the atomic scale and contributing to innovations in renewable energy, memory devices, and quantum materials. Findings have implications for improving energy efficiency, developing lead-free solar cells, and enabling high-speed data processing. The work has trained numerous graduate students and postdocs, fostering the next generation of computational materials scientists. The original goals were to develop theoretical models and computational tools to predict and optimize electronic properties of materials for energy applications. All objectives were accomplished, with no major departures from planned methodologies. Challenges in computational scaling were addressed through access to high-performance computing resources.
36 MATERIALS SCIENCE↗
Tunable broadband luminescence in lead-free hybrid copper halides
Metal halides are an important class of optoelectronic materials combining exceptional optical and electronic properties. An inherent advantage of metal halides is their solution synthesis and processability, which render them as low-cost and environmentally friendly materials for a range of applications from photovoltaics and photodetection to solid-state lighting (SSL). Here, in this study, we synthesized three previously unreported lead-free organic–inorganic hybrid copper halides: (OA) 4 CuX 5 (X = Br, I; OA + = C 8 H 17 NH 3+ , n-octylammonium cation) and (HA) 2 CuI 3 (HA + = C 6 H 13 NH 3 + , n-hexylammonium cation), all of which exhibit broadband emissions arising from self-trapped excitons (STEs). Among these compounds, (OA) 4 CuI 5 demonstrates tunable dual-band white-light emission with a high color rendering index value of 91 at room temperature. Temperature-dependent photoluminescence measurements and first-principles calculations reveal distinct behaviors between the two emission states in (OA) 4 CuI 5 . These findings highlight the potential of copper halide compounds for optoelectronic applications, particularly in the development of environmentally friendly solid-state lighting technologies.
36 MATERIALS SCIENCE↗
Two-step spin-coating of vacancy-ordered double perovskites enables growth of thin films for electronic devices
Vacancy-ordered double perovskites (VODPs), such as Cs 2 TeX 6 (X = Cl, Br, I), are lead-free alternatives to conventional metal-halide perovskites (MHPs). One limitation of VODPs is the lack of processes to form thin films relevant for physical characterization and electronic devices. A two-step spin-coating method was developed for synthesizing high-quality films of Cs 2 TeBr 6 . Independently depositing CsBr and TeBr 4 enables high precursor concentrations and control over crystallization kinetics. By optimizing the spin-coating parameters, conversion of precursors to phase pure films was observed using structural and surface characterization methods. The growth of mixed-halide systems was investigated using alternative salts including CsCl and CsI. The formation of halide alloys was found to depend on the existence of routes to byproducts. Lastly, single carrier diodes of Cs2TeBr6 were designed following valence band characterization with photoelectron spectroscopy. Temperature-dependent space-charge-limited current measurements revealed that transport occurs by hopping and the hole mobility is 3.2 × 10 −5 cm 2 V −1 s −1 near room temperature. As a result, the insights from the 2-step procedure provide a pathway towards making semiconducting devices from VODPs.
Kuklinski, Owen [University of California, Santa B↗
Lead-Free Double-Base Propellant for the 2.75 Inch Rocket Motor
The current MK 66 2.75 inch Rocket Motor double-base propellant contains the lead-based ballistic modifier LC-12-15 to achieve the desired plateau and mesa burning rate characteristics. The use of lead compounds poses a concern for the environment and for personal safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacture, rocket motor firing, and disposal. Copper beta-resorcylate (copper 2,4-di-hydroxy-benzoate) was successfully used in propellant as a simple modifier in the mid 1970's. This and other compounds have also been mixed with lead salts to obtain more beneficial ballistic results. Synthesized complexes of lead and copper compounds soon replaced the mixtures. The complexes incorporate the lead, copper lack of organic liquids, which allows for easier propellant processing. About ten years ago, the Indian Head Division, Naval Surface Warfare Center (NSWC), initiated an effort to develop a lead-free propellant for use in missile systems. Several lead-free propellant candidate formulations were developed. About five years ago, NSWC, in conjunction with Alliant Techsystems, Radford Army Ammunition Plant, continued ballistic modifier investigations. A four component ballistic modifier system without lead for double-base propellants that provide adequate plateau and mesa burn rate characteristics was developed and patented. The ballistic modifier's system contains bismuth subsalicylate, 1.5 percent; copper salicylate, 1.0 percent, copper stannate, 0.77 percent; and carbon black, 0.1 percent. Action time and impulse data obtained through multiple static firings indicate that the new lead-free double-base propellant, while not a match for NOSIH-AA-2, will be a very suitable replacement in the 2.75 inch Rocket Motor. Accelerated aging of the double-base propellant containing the lead-free ballistic modifier showed that it had a much higher rate of stabilizer depletion than the AA-2. A comprehensive study showed that an increased rate of stabilizer depletion occurred in propellants containing monobasic copper salicylate. The study also showed that propellants containing a mixture of bismuth subsalicylate and copper salicylate, had only about one-half the stabilizer depletion rate than those with copper salicylate alone. The copper salicylate catalyzes the decomposition of nitroglycerin, which triggers a chain of events leading to the increased rate of stabilizer depletion. A program has been initiated to coat the ballistic modifier, thus isolating it from the nitroglycerin.
Magill, B. T.↗
Integrated Electrode Arrays for Neuro-Prosthetic Implants
Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.
Brandon, Erik↗
Environmental Regulations as Drivers of Materials Obsolescence
This slide presentation reviews the operations of the Principal Center for Regulatory Risk Analysis and Communication (RRAC-PC) and the impact of environmental regulations in making some materials obsolete. The center is NASA's resource for identifying and managing risks associated with changing environmental regulations. To this end the center acts as an regulatory early warning system, to review track and analyze emerging regulations, collaborate with the technical community on regulatory risk analysis and interpretation and to represent NASA's interests to the regulatory agencies. Regulations frequently result in making some materials unavailable forcing a change to another material. Processes may also be changed due to environmental regulations. For example some items that were sprayed with a chemical may now have to be painted or dipped with the chemical. Sometimes a regulation changes the use of a certain product, which does not affect the usage on Earth, but has significant implications in space. An example of this is the use of lead-free solders of basically tin, which don't appear to have any problem on Earth, but in space applications tin whiskers have resulted in several confirmed satellite failures.
Scroggins, Sharon↗
NASA-DoD Lead-Free Electronics Project
Original Equipment Manufacturers (OEMs), depots, and support contract ors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the r eliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or cir cuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-f ree processes and parameters (including higher melting points of lead -free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reli ability As the transition to lead-free becomes a certain reality for military and aerospace applications, it will be critical to fully un derstand the implications of reworking lead-free assemblies.
Kessel, Kurt↗
Ink-based laser powder bed fusion of barium titanate
Barium titanate (BTO) is a lead-free functional ceramic that is widely used in sensors, transducers, and actuators. The increasing demand for complex geometries and quick design iterations motivates the use of additive manufacturing techniques. Laser powder bed fusion (L-PBF) additive manufacturing technique enables the net-shape or near-net-shape fabrication of metals and alloys. Ceramic L-PBF remains challenging due to their high melting temperature. Here, to address this challenge, a nanoparticle ink feedstock was incorporated into the L-PBF process to allow low power melting of BTO. Key print parameters (i.e. laser power, scanning speed, and hatching spacing) were optimized to fabricate millimeter-scale BTO parts. The printed BTO samples possessed an inhomogeneous equiaxed-columnar-cellular microstructure. Semiconducting current-voltage behavior was observed in as-printed samples, which was attributed to the creation of oxygen vacancies. The piezoelectric d 33 coefficient was measured to be 4.6 pC/N.
Dielectrics↗
Lead-Free Propellant for Propellant Actuated Devices
Naval Surface Warfare Center, Indian Head Division's CAD/PAD Department has been working to remove toxic compounds from our products for about a decade. In 1992, we embarked on an effort to develop a lead-free double base propellant to replace that of a foreign sole source. At the time there were availability concerns. In 1995, the department developed a strategic proposal to include a wider range of products. Efforts included such efforts as removing lead sheathing from linear explosives and replacing lead azide and lead styphnate compounds. This paper will discuss efforts specifically related to developing non-leaded double base propellant for use in various Propellant Actuated Devices (PADs) for aircrew escape systems. The propellants can replace their leaded counterparts, mitigating lead handling, processing, or toxic exposure to the environment and personnel. This work eliminates the use of leaded compounds, replacing them with a more environmentally benign metal-organic salt. Historically double-base propellants have held an advantage over other families of energetic materials through their relative insensitivity of the burning rate to changes in temperature and pressure. This desirable ballistic effect has been obtained with the use of a lead-organic salt alone or in a physical mixture with a copper-organic salt, or more recently with a lead-copper complex. These ballistic modifiers are typically added to the double-base 'paste' prior to gelatinization on heated calendars or one type or another. The effect of constant burning rate over a pressure range is called a 'plateau' while an even more beneficial effect of decreasing burning rate with increasing pressure is termed a 'mesa.' The latter effect results in very low temperature sensitivity of the propellant burning rate. Propellants with such effects are ideal tactical rocket motor propellants. The use of lead compounds poses a concern for the environment and personnel safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacturing, rocket firings, and disposal. Two separate programs are underway at Indian Head to replace the leaded ballistic modifiers in NOSIH-AA-2 and KU propellants. Although the system requirements were very different, the programs gained valuable information from one another throughout their course.
Goodwin, John L.↗
Hi-rel lead-free printed wiring assemblies
The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage. This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assemblies printed wiring boards.
lead tin-lead wiring-boards solder pastes↗