American National Aeronautics and Space Administration (NASA) research in high density packaging reliability
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microelectronics reliability COTS PBGA HEMT MSFET ↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Microelectronics packaging research directions for aerospace applications
The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
microelectronics reliability COTS PBGA HEMT MSFET ↗