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Results for “microelectronics supply chain”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Building Blocks for Secure and Prosperous Defense Critical Supply Chains: A Case Study from Microelectronics

Securing defense-critical supply chains, built on resilient and sustainable microelectronics fabrication and deployment, is a national imperative and one that requires an investment in basic and applied research, development, and deployment into industries in (and out of) the Defense Industrial Base (DIB). Critical next steps include the development of pilots for revolutionary concepts in a new formal verification model and the Cyber-Physical Passport (CPP) concept for chain of custody. Critical infrastructure leadership should take action with a sense of urgency. Working in conjunction with the Under Secretary for Acquisition and Sustainment, the Assistant Secretary of Defense for Research and Engineering should establish pilot programs with the Defense Advanced Research Projects Agency and the service labs to build and test both concepts in legacy and new system development.. Additionally, the Pentagon may be aware that an existing Manufacturing Innovation Institute is piloting, with the semiconductor industry, cyber innovations to provide verifiable security properties and guarantees of physical functions to build a more cyber secure, resilient and efficient micro-electronics supply chain.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2022

Microelectronics at the Department of Energy: Capabilities and Opportunities for Driving U.S. Competitiveness

Microelectronics are everywhere—embedded in our consumer products; underlying our power, transportation, and information infrastructure; and fortifying our national security. These and other microelectronics applications are also intricately linked with America’s energy and decarbonization goals. For instance, advanced power electronics are critical to our transition to renewable power and electric transport, and more energy-efficient computing and consumer devices are needed as energy consumption grows rapidly. Meanwhile, global supply chain disruptions beginning in 2020 and the ensuing chip shortage caused by the COVID-19 pandemic highlight the vulnerability of microelectronics supply chains. The globally distributed manufacturing base can be disrupted in unexpected ways, and there is no single solution to these challenges given the range of applications and technologies within the microelectronics industry—from ever-smaller, nanoscale feature sizes to large-scale commodity use cases to specialized functionalities. Rather, solutions will require the private sector, federal agencies, and research and development (R&D) organizations such as labs and universities to act in concert beyond their individual missions.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Contact-Less Integrity Verification of Microelectronics Using Near-Field EM Analysis

Modern microelectronics life-cycle and supply chain ecosystem bring multiple untrusted entities, which can compromise their integrity. A major integrity issue of microelectronics stems from piracy of intellectual properties (IP) and counterfeiting, which causes significant revenue loss to the semiconductor manufacturers. Further, these components often lead to compromised functionality, reliability, security, and safety of an electronic system. This paper presents secure information transmission and probing methods for verifying the integrity of digital integrated circuit (ICs) based on their electromagnetic (EM) near-field emissions and thereby protecting systems against counterfeit components. The proposed method has been tested on both high-level instructions executed by microprocessors or Systems-on-Chip (serving as examples of software), and also logic circuits within FPGA fabrics and ASICs (serving as examples of hardware). The authentication information required by each digital system is generated using a pseudo-random number generator circuit and securely transmitted via near-field magnetic emissions. The authorized party can probe these emissions using a near-field probe, process the acquired signals to improve the signal-to-noise ratio (SNR), and then recover the secure information through matched filtering. Experimental results from commercial SoCs are used to demonstrate the proposed technique. Methods for reducing EM interference during integrity verification of both FPGAs and ASICs are also described.

47 OTHER INSTRUMENTATION↗
NASA NTRS2004

Pb-free microelectronics assembly in aerospace applications

In this paper we provide a snapshot of the commericial industry trends and how they may impact electronics in the aerospace environment. Impacts will be felt in the areas of: reliability, assembly methods, cost drivers, supply chain selection and alternate materials selection.

Schoenung, Julie M.↗
DOE OSTI2025

Are quantum materials economically and environmentally sustainable?

Quantum materials have revolutionized energy, information, and healthcare technologies, yet their development has largely prioritized performance over economic and environmental impacts—key factors for industrial adoption. Using topological materials as a case study, we present a data-driven framework that evaluates over 16,000 materials based on cost, supply chain resilience, energy demand, toxicity, and environmental footprint. By integrating the recently proposed quantum weight – a metric quantifying quantum behavior – we reveal a striking trend: materials with stronger quantum effects often exhibit higher environmental impact, posing challenges for scalability and industrial adoption. To address this, we identify a small set of materials that achieve a balance between quantum functionality and sustainability. Furthermore, our approach enables high-throughput, AI-driven materials discovery that incorporates economic and environmental influences from the outset, guiding the development of quantum materials for next-generation microelectronics and energy harvesting technologies.

AI↗