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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2009

Improving the Visible and Infrared Contrast Ratio of Microshutter Arrays

Three device improvements have been developed that dramatically enhance the contrast ratio of microshutters. The goal of a microshutter is to allow as much light through as possible when the shutters are in the open configuration, and preventing any light from passing through when they are in the closed position. The ratio of the transmitted light that is blocked is defined here as the contrast ratio. Three major components contribute to the improved performance of these microshutters: 1. The precise implementation of light shields, which protect the gap around the shutters so no light can leak through. It has been ascertained that without the light shield there would be a gap on the order of 1 percent of the shutter area, limiting the contrast to a maximum of 100. 2. The precise coating of the interior wall of each microshutter was improved with an insulator and metal using an angle deposition technique. The coating prevents any infrared light that finds an entrance on the surface of the microshutter cell from being emitted from a sidewall. Since silicon is in effect transparent to any light with a wavelength longer than .1 micrometer, these coatings are essential to blocking any stray signals when the shutters are closed. 3. A thin film of molybdenum nitride (MoN) was integrated onto the surface of the microshutter blade. This film provides the majority of light blockage over the microshutter and also ensures that the shutter can be operated over a wide temperature range by maintaining its flatness. These improvements were motivated by the requirements dictated by the James Webb Space Telescope NIRSpec instrument. The science goals of the NIRSpec require observing some of the very faintest objects in a given field of view that also may contain some very bright objects. To observe the faint objects, the light from the bright objects - which could be thousands of times brighter - must be completely blocked. If a closed microshutter is even slightly transmissive, a very bright object will still transmit a small signal, which can be larger than a signal from a very faint object transmitted through an open shutter. Since this situation can completely corrupt the results, it was necessary that the closed shutters be able to attenuate light by at least a factor of 2,000. There currently exist four flight-quality microshutter arrays that have been fully or are currently undergoing testing and the results support that the three improvements described above have successfully led to contrast levels greater than 50,000 in over 99 percent of the microshutters at an operating temperature of 35 K. Applications for these high-contrast microshutters are in the photomask generation and stepper equipment used to make integrated circuits and microelectromechanical (MEMS) devices. Since microshutters are a reconfigurable optical element, their versatility in these industries provides an improvement over printed masks and fixed projection alignment systems.

Jhabvala, Murzy↗
NASA NTRS2012

Next-Generation Microshutter Arrays for Large-Format Imaging and Spectroscopy

A next-generation microshutter array, LArge Microshutter Array (LAMA), was developed as a multi-object field selector. LAMA consists of small-scaled microshutter arrays that can be combined to form large-scale microshutter array mosaics. Microshutter actuation is accomplished via electrostatic attraction between the shutter and a counter electrode, and 2D addressing can be accomplished by applying an electrostatic potential between a row of shutters and a column, orthogonal to the row, of counter electrodes. Microelectromechanical system (MEMS) technology is used to fabricate the microshutter arrays. The main feature of the microshutter device is to use a set of standard surface micromachining processes for device fabrication. Electrostatic actuation is used to eliminate the need for macromechanical magnet actuating components. A simplified electrostatic actuation with no macro components (e.g. moving magnets) required for actuation and latching of the shutters will make the microshutter arrays robust and less prone to mechanical failure. Smaller-size individual arrays will help to increase the yield and thus reduce the cost and improve robustness of the fabrication process. Reducing the size of the individual shutter array to about one square inch and building the large-scale mosaics by tiling these smaller-size arrays would further help to reduce the cost of the device due to the higher yield of smaller devices. The LAMA development is based on prior experience acquired while developing microshutter arrays for the James Webb Space Telescope (JWST), but it will have different features. The LAMA modular design permits large-format mosaicking to cover a field of view at least 50 times larger than JWST MSA. The LAMA electrostatic, instead of magnetic, actuation enables operation cycles at least 100 times faster and a mass significantly smaller compared to JWST MSA. Also, standard surface micromachining technology will simplify the fabrication process, increasing yield and reducing cost.

Moseley, Samuel↗
NASA NTRS2017

Design and Fabrication of Electrostatically Actuated Silicon Microshutters Arrays

We have developed a new fabrication process to actuate microshutter arrays (MSA) electrostatically at NASA Goddard Space Flight Center. The microshutters are fabricated on silicon with thin silicon nitride membranes. A pixel size of each microshutter is 100 x 200 micrometers 2. The microshutters rotate 90 degrees on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The atomic layer deposition (ALD) of aluminum oxide was used to insulate electrodes on the back side of walls; the insulation can withstand over 100 V. The ALD aluminum oxide is dry etched, and then the microshutters are released in vapor HF.

microshutter arrays↗
NASA NTRS2018

Fabrication and Sub-Assembly of Electrostatically Actuated Silicon Nitride Microshutter Arrays

We have developed a new microshutter array (MSA) subassembly. The MSA and a silicon substrate are flip-bonded together. The MSA has a new back side fabrication process to actuate the microshutters electrostatically, and the new silicon substrate has light shields. The microshutters with a pixel size of 100 x 200 sq micrometers are fabricated on silicon with thin silicon nitride membranes. The microshutters rotate 90 deg on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The substrate has the light shield to block lights around the microshutters. Also, electrical connections are made from the MSA to a controller board via the substrate.

microshutter array (MSA) sub-assembly↗
NASA NTRS2008

Development and Operation of the Microshutter Array System

The microshutter array (MSA) is a key component in the James Webb Space Telescope Near Infrared Spectrometer (NIRSpec) instrument. The James Webb Space Telescope is the next generation of a space-borne astronomy platform that is scheduled to be launched in 2013. However, in order to effectively operate the array and meet the severe operational requirements associated with a space flight mission has placed enormous constraints on the microshutter array subsystem. This paper will present an overview and description of the entire microshutter subsystem including the microshutter array, the hybridized array assembly, the integrated CMOS electronics, mechanical mounting module and the test methodology and performance of the fully assembled microshutter subsystem. The NIRSpec is a European Space Agency (ESA) instrument requiring four fully assembled microshutter arrays, or quads, which are independently addressed to allow for the imaging of selected celestial objects onto the two 4 mega pixel IR detectors. Each microshutter array must have no more than approx.8 shutters which are failed in the open mode (depending on how many are failed closed) out of the 62,415 (365x171) total number of shutters per array. The driving science requirement is to be able to select up to 100 objects at a time to be spectrally imaged at the focal plane. The spectrum is dispersed in the direction of the 171 shutters so if there is an unwanted open shutter in that row the light from an object passing through that failed open shutter will corrupt the spectrum from the intended object.

Jhabvala, M. D.↗
NASA NTRS2016

Fabrication of Electrostatically Actuated Microshutters Arrays

A new fabrication process has been developed to actuate microshutter arrays (MSA) electrostatically at NASA Goddard Space Flight Center. The microshutters, made with silicon nitride membranes with a pixel size of 100 x 200 sq microns, rotate on torsion bars. The microshutters are actuated, latched, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The atomic layer deposition (ALD) of aluminum oxide was used to insulate electrodes on the back side of walls; the insulation can withstand over 100 V. The ALD aluminum oxide is dry etched, and then the microshutters are released in vapor HF.

microshutter arrays (MSA)↗
NASA NTRS2008

Contrast Measurements of the Microshutter Arrays for the NIRspec

We have been developing programmable microshutter arrays for the Near Infrared Spectrometer (NIRSpec) on the James Webb Space telescope (JWST). These arrays are an enabling technology that allows to turn NIRSpec into a powerful multi-object spectrometer and tremendously increase its efficiency. The arrays are essentially 2D programmable masks that are designed to operate at cryogenic temperatures of JWST. The primary optical characteristic of the microshutter array is a contrast, that is defined as a ratio of the transmitted light intensity through open shutters to the intensity of the transmitted light through the closed shutters. To eliminate the noise and confusion from other sources in the field of view and therefore to improve the detection limit, the contrast provided by the microshutter array should be very high, with the goal of 10,000. The test system that we have developed specifically for the purpose of the high contrast characterization of the microshutter array devices has been used to test several microshutter arrays. It is capable of measuring contrast values of up to 10^5 and therefore can reliably measure contrast values of the arrays that satisfy the requirements. The arrays have been characterized for the contrast ratio and its behavior with temperature and other array operating parameters. The arrays that we have tested meet or exceed the NiRSpec requirements.

Kutyrev, Alexander↗
NASA NTRS2009

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

Jhabvala, Murzy↗
NASA NTRS2015

2D Electrostatic Actuation of Microshutter Arrays

An electrostatically actuated microshutter array consisting of rotational microshutters (shutters that rotate about a torsion bar) were designed and fabricated through the use of models and experiments. Design iterations focused on minimizing the torsional stiffness of the microshutters, while maintaining their structural integrity. Mechanical and electromechanical test systems were constructed to measure the static and dynamic behavior of the microshutters. The torsional stiffness was reduced by a factor of four over initial designs without sacrificing durability. Analysis of the resonant behavior of the microshutter arrays demonstrates that the first resonant mode is a torsional mode occurring around 3000 Hz. At low vacuum pressures, this resonant mode can be used to significantly reduce the drive voltage necessary for actuation requiring as little as 25V. 2D electrostatic latching and addressing was demonstrated using both a resonant and pulsed addressing scheme.

Multiobject Imaging↗
NASA NTRS2015

2D Electrostatic Actuation of Microshutter Arrays

Electrostatically actuated microshutter arrays consisting of rotational microshutters (shutters that rotate about a torsion bar) were designed and fabricated through the use of models and experiments. Design iterations focused on minimizing the torsional stiffness of the microshutters, while maintaining their structural integrity. Mechanical and electromechanical test systems were constructed to measure the static and dynamic behavior of the microshutters. The torsional stiffness was reduced by a factor of four over initial designs without sacrificing durability. Analysis of the resonant behavior of the microshutters demonstrates that the first resonant mode is a torsional mode occurring around 3000 Hz. At low vacuum pressures, this resonant mode can be used to significantly reduce the drive voltage necessary for actuation requiring as little as 25V. 2D electrostatic latching and addressing was demonstrated using both a resonant and pulsed addressing scheme.

Multiobject Imaging↗
NASA NTRS2014

Mechanical Behavior of Microelectromechanical Microshutters

A custom micro-mechanical test system was constructed using off-the-shelf components to characterize the mechanical properties of microshutters. Microshutters are rectangular microelectromechanical apertures which open and close about a narrow torsion bar hinge. Displacement measurements were verified using both capacitive and digital image correlation techniques. Repeatable experiments on Si3N4 cantilever beams verified that the test system operates consistently. Using beam theory, the modulus of elasticity of the low stress Si3N4 was approximately 150 GPa, though significant uncertainty exists for this measurement due primarily to imprecise knowledge of the cantilever thickness. Tests conducted on microshutter arrays concluded that reducing the Si3N4 thickness from 250 nm to 500 nm reduces the torsional stiffness by a factor of approximately four. This is in good agreement with analytical and finite element models of the microshutters.

silicon nitride↗
NASA NTRS2001

Microshutter Arrays for the NGST NIRSpec

We are developing a programmable multiobject field selector for the NGST NIRSpec. This device is a microshutter array, a close-packed 2000 x 2000 array of 100 micrometer x 100 micrometer shutters fabricated with Micro-ElectroMechanical Systems (MEMS) technologies. The shutters are opened using a magnet scanned over the array. The shutters are held open by electrostatic potentials on adjacent vertical electrodes. Modeling of the magnetic actuation of the microshutters allowed optimization of the magnetic field configuration, the distance between magnet and shutters, and the force and torque produced by the magnet. The results of laboratory tests are consistent with our modeling. We have demonstrated actuation, latching and addressing. We are able to rotate shutters out of the plane up to 90 degree and more, to latch them electrostatically to the walls and release them selectively. During the last six month all critical elements of the array have been demonstrated. Fabrication processes were developed to deposit vertical electrodes on support grid side walls and insulated light-shields that block the gaps between shutters and the support grid. Physical optics analysis was performed to assess the expected optical performance of the microshutters. A preliminary Fourier optics analysis on the microshutter array performance has been carried out. More detailed analysis of wave propagation through 3D structures is a next step. An optical test station for verifying optical parameters of the shutter array at room temperature has been developed. It allows to measure parameters, such as transmission, scattering, contrast ratio, and diffraction of the array structure. Initial data have been acquired and are being analyzed and compared to theoretical predictions.

Moseley, Harvey↗
NASA NTRS2004

Microshutter Arrays for James Webb Space Telescope

Two-dimensional MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use in the near-infrared region on the James Webb Space Telescope (JWST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The JWST environment requires cryogenic operation at 35K. Microshutter arrays are fabricated out of silicon-oxide-insulated (SOI) silicon wafers. Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 p. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi- layer metal deposition and patterning of shutter electrodes and magnetic pads, reactive ion etching (NE) of the front side to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form W e s and relieve shutters from the silicon substrate. An additional metal deposition and patterning is used to form back electrodes. Shutters are actuated using a magnetic force and latched using an electrostatic force. . . . KEYWORDS: microshutter, MEMS, RIE, DRIE, micro-optics, near inbred, space telescope

Li, Mary J.↗
NASA NTRS2008

Elastic Distribution of Microshutters, Measurements Obtainable on James Web Space Telescope

Spectrographic astronomy measurements in the near-infrared region will be done by functional two-dimensional microshutter arrays that are being fabricated at the NASA Goddard Space Flight Center for the James Webb Space Telescope (JWST). These micro-shutter arrays will represent the first mission-critical MEMS devices to be flown in space. JWST will use microshutter arrays to select focal plane object. 2-D programmable aperture masks of more than 200,000 elements select such space object. The use of silicon wafer material promises high efficiency and high contrast. Microshutter operation temperature is around 35K. Microshutter arrays are fabricated as close-packed silicon nitride membranes with a unit cell size of 105 x 204 micrometers. A layer of magnetic material is deposited onto each shutter. Individual shutters are equipped with a torsion flexure. Reactive ion etching (RIE) releases the shutters so they can open up to 90 degrees using the torsion flexure. Shutter rotation is initiated into a silicon support structure via an external magnetic field. Two electrically independent aluminum electrodes are deposited, one onto each shutter and another onto the support structure side-wall, permitting electrostatic latching and 2-D addressing to hold specific shutters open via external electronics.

Kletetschka, Gunther↗
NASA NTRS2012

Graphene Transparent Conductive Electrodes for Next- Generation Microshutter Arrays

Graphene is a single atomic layer of graphite. It is optically transparent and has high electron mobility, and thus has great potential to make transparent conductive electrodes. This invention contributes towards the development of graphene transparent conductive electrodes for next-generation microshutter arrays. The original design for the electrodes of the next generation of microshutters uses indium-tin-oxide (ITO) as the electrode material. ITO is widely used in NASA flight missions. The optical transparency of ITO is limited, and the material is brittle. Also, ITO has been getting more expensive in recent years. The objective of the invention is to develop a graphene transparent conductive electrode that will replace ITO. An exfoliation procedure was developed to make graphene out of graphite crystals. In addition, large areas of single-layer graphene were produced using low-pressure chemical vapor deposition (LPCVD) with high optical transparency. A special graphene transport procedure was developed for transferring graphene from copper substrates to arbitrary substrates. The concept is to grow large-size graphene sheets using the LPCVD system through chemical reaction, transfer the graphene film to a substrate, dope graphene to reduce the sheet resistance, and pattern the film to the dimension of the electrodes in the microshutter array. Graphene transparent conductive electrodes are expected to have a transparency of 97.7%. This covers the electromagnetic spectrum from UV to IR. In comparison, ITO electrodes currently used in microshutter arrays have 85% transparency in mid-IR, and suffer from dramatic transparency drop at a wavelength of near-IR or shorter. Thus, graphene also has potential application as transparent conductive electrodes for Schottky photodiodes in the UV region.

Li, Mary↗
NASA NTRS2017

Electrostatic Microshutter Arrays

Based on the Microshutter Array (MSA) subsystems developed at NASA Goddard Space Flight Center (GSFC) for the James Webb Space Telescope (JWST), Next Generation Microshutter Array (NGMSA) has been developed to be used as multi-object selectors for future telescopes in space applications. Microshutter arrays function as transmission devices. Selected shutters fully open at 90 degrees permitting income light going through, while the rest of shutters keep closed. The programmable microshutter open and close make the device perform as a multi object selector that can be used on space telescopes. Utilizing a multi object selector, the telescope efficiency can be increased to 100 times or more. Like JWST MSAs, NGMSA features torsion hinges, light shields, front and back electrodes for shutter actuation, latch, and closing. The difference is that JWST MSA utilized the magnetic actuation while NGMSA the electrostatic actuation.

Micro-electro-mechanical-system (MEMS)↗
NASA NTRSDate not supplied

Characterizations of Optimized Microshutter Arrays for Space Borne Observatory Applications

We report the latest design, fabrication, and characterization result of the Next-Generation Microshutter Arrays (NGMSA) for space borne observatory applications. Our improved blade design aims to reduce the counter torque induced by the potential on the opposing wall to eliminate the torque bump, and thus enables pure electrostatic actuation for more reliable and stable microshutter operations. This paper presents the experimental performances of micro-fabricated microshutter arrays with varying design parameters and compares the results with simulation predictions.

Electrostatic↗
NASA NTRS2004

Fabrication of Microshutter Arrays for James Webb Space Telescope

Two-dimensional MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use in the near-infrared region on the Next Generation Space Telescope (NGST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The NGST environment requires cryogenic operation at 45K. Microshutter arrays are fabricated out of silicon-oxide-insulated (SOI) silicon wafers. Arrays are close-packed silicon nitride membranes with a pixel size of 100x100 microns. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi-layer metal deposition and patterning of shutter electrodes and magnetic pads, reactive ion etching (RE) of the front side to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form frames and relieve shutters from the silicon substrate. An additional metal deposition and patterning is used to form back electrodes. Shutters are actuated using a magnetic force and latched using an electrostatic force.

Li, Mary J.↗