Field strength degradation in Si-SiO2-polycrystalline Si structures
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Mattauch, R. J.↗
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A method for polycrystalline silicon delineation applicable to a double-diffused MOS transistor
Method is simple and eliminates requirement for unreliable special etchants. Structure is graded in resistivity to prevent punch-through and has very narrow channel length to increase frequency response. Contacts are on top to permit planar integrated circuit structure. Polycrystalline shield will prevent creation of inversion layer in isolated region.
Halsor, J. L.↗
Effect of crystallographical and geometrical changes of a ferrite head on magnetic signals during the sliding process with magnetic tape
This paper reviews changes in the crystalline structure and geometry of lapped Mn-Zn ferrite heads in sliding contact with magnetic tape and the effects of these changes on magnetic signals. A highly textured, polycrystalline structure was produced on the surface of a single-crystal Mn-Zn ferrite head when it was finished with an aluminum oxide lapping tape. Sliding this lapped surface against a magnetic tape produced a nearly amorphous structure. The sliding process led to a degradation in readback signal of 1 to 2 dB (short-wavelength recording). Furthermore, wear of the magnetic head caused geometrical changes in the head surface. The signal read back with the worn magnetic head was sensitive to operating parameters such as head displacement and tape tension. A change in operating parameters created head-to-tape spacings and, consequently, excessive gains or losses in the readback signal.
Miyoshi, K.↗
Multiscale Modeling of Grain Boundaries in ZrB2: Structure, Energetics, and Thermal Resistance
A combination of ab initio, atomistic and finite element methods (FEM) were used to investigate the structures, energetics and lattice thermal conductance of grain boundaries for the ultra high temperature ceramic ZrB2. Atomic models of idealized boundaries were relaxed using density functional theory. Information about bonding across the interfaces was determined from the electron localization function. The Kapitza conductance of larger scale versions of the boundary models were computed using non-equilibrium molecular dynamics. The interfacial thermal parameters together with single crystal thermal conductivities were used as parameters in microstructural computations. FEM meshes were constructed on top of microstructural images. From these computations, the effective thermal conductivity of the polycrystalline structure was determined.
Lawson, John W.↗
Effect of Nuclear Radiation on Materials at Cryogenic Temperatures
The tensile properties for 33 polycrystalline structural materials including aluminum, titanium, nickel and iron alloys were obtained at -256.5 C (30 deg R) after irradiation exposure at this temperature to 10(exp 17) nvt (E greater than 0.5 Mev), at -256.5 C without previous irradiation, and at approximately 27 C (540 deg R) without previous irradiation. The data were evaluated statistically to permit identification of cryogenic effects and nuclear-cryogenic effects. A number of conclusions were drawn regarding suitability of certain of the materials for use in nuclear-cryogenic applications and regarding the need for further investigation.
NEUTRON BOMBARDMENT↗
Evolution of interstellar dust
The composition, origins, and evolution of interstellar dust (ISD) are examined, reviewing the results of recent observational and theoretical investigations. Topics discussed include amorphous and polycrystalline structures; the relationship between amorphous C, graphite, and polycyclic aromatic hydrocarbons; observational techniques for determining ISD structure and composition; ISD formation in outflows from late-type giants, planetary nebulae, and novae; destruction of ISD by shocks; the formation of ISD in the ISM; and the relationship between ISD and interplanetary dust. IR spectroscopy of molecular ices and icy grain mantles is considered in detail, and it is shown that typical grain mantles consist of a 1/0.6/0.05/0.05 mixture of H2O, CH3OH, CO, and NH3.
Tielens, A. G. G. M.↗
Test load verification through strain data analysis
A traditional binding acceptance criterion on polycrystalline structures is the experimental verification of the ultimate factor of safety. At fracture, the induced strain is inelastic and about an order-of-magnitude greater than designed for maximum expected operational limit. At this extreme strained condition, the structure may rotate and displace at the applied verification load such as to unknowingly distort the load transfer into the static test article. Test may result in erroneously accepting a submarginal design or rejecting a reliable one. A technique was developed to identify, monitor, and assess the load transmission error through two back-to-back surface-measured strain data. The technique is programmed for expediency and convenience. Though the method was developed to support affordable aerostructures, the method is also applicable for most high-performance air and surface transportation structural systems.
Verderaime, V.↗
Estimating the Probability of Electrical Short Circuits from Tin Whiskers
To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish .
Courey, Karim J.↗
An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.
Courey, Karim J.↗
An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers
In this experiment, an empirical model to quantify the probability of occurrence of an electrical short circuit from tin whiskers as a function of voltage was developed. This model can be used to improve existing risk simulation models FIB and TEM images of a tin whisker confirm the rare polycrystalline structure on one of the three whiskers studied. FIB cross-section of the card guides verified that the tin finish was bright tin.
Courey, Karim J.↗
Tin Whisker Electrical Short Circuit Characteristics
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish.
Courey, Karim J.↗
An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.
Courey, Karim J.↗
An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers
In this experiment, an empirical model to quantify the probability of occurrence of an electrical short circuit from tin whiskers as a function of voltage was developed. This empirical model can be used to improve existing risk simulation models. FIB and TEM images of a tin whisker confirm the rare polycrystalline structure on one of the three whiskers studied. FIB cross-section of the card guides verified that the tin finish was bright tin.
Courey, Karim↗
Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers
To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish.
Courey, Karim J.↗
A study of the structure of grain boundaries in polycrystalline magnesium oxide
Random network grain boundary structure in polycrystalline magnesium oxide
MAGNESIUM OXIDE↗
Electron-microscope-beam effects in the investigation of thin-film structure
Bi polycrystalline film grown by vacuum deposition on amorphous substrates investigated for electron microscope beam effects
Howard, L. L.↗
Integrated Computational Materials Engineering to Establish Process-Structure-Property Relations in Polycrystalline Materials
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Saikumarreddy R. Yertapally↗
The effect of grain boundaries on mechanical behavior in polycrystalline ceramics
Atomic structure and chemical composition influence on grain boundaries effect on mechanical failure in polycrystalline ceramics
De Wys, E. C.↗