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A standard calibration method for any particle impact noise detection (PIND) test system used to detect loose particles responsible for failures in hybrid circuits was developed along with a procedure for preparing PIND standard test devices. Hybrid packages were seeded with a single gold ball, hermetically sealed, leak tested, and PIND tested. Conclusions are presented.
Calibrated set of microcircuit packages containing tiny particles with known masses can be used as reference standards for Particle-Impact Noise-Detection (PIND) tests.
This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.
Testing of semiconductor electronics at temperatures above their designed operating envelope is recognized as vital to qualification and lifetime prediction of circuits. This work describes the high temperature electrical testing of prototype 4H silicon carbide (SiC) junction field effect transistor (JFET) integrated circuits (ICs) technology implemented with multilayer interconnects; these ICs are intended for prolonged operation at temperatures up to 773K (500 C). A 50 mm diameter sapphire wafer was used in place of the standard NASA packaging for this experiment. Testing was carried out between 300K (27 C) and 1150K (877 C) with successful electrical operation of all devices observed up to 1000K (727 C).
This paper describes the development of a packaged silicon carbide (SiC) based MEMS pressure sensor system designed specifically for a conventional turbofan engine. The electronic circuit is based on a Clapp-type oscillator that incorporates a 6H-SiC MESFET, a SiCN MEMS capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The pressure sensor serves as the capacitor in the LC tank circuit, thereby linking pressure to the resonant frequency of the oscillator. The oscillator and DC bias circuitry were fabricated on an alumina substrate and secured inside a metal housing. The packaged sensing system reliably operates at 0 to 350 psi and 25 to 540C. The system has a pressure sensitivity of 6.8 x 10E-2 MHzpsi. The packaged system shows negligible difference in frequency response between 25 and 400C. The fully packaged sensor passed standard benchtop acceptance tests and was evaluated on a flight-worthy engine.
This slide presentation reviews some of the actions that NASA is taking to address the issue of counterfeit electronic parts. While the emphasis is on electronic parts, the vision is broad enough to include materials and software. The effort includes coordination with other agencies, to identify and with the Government-Industry Data Exchange Program (GIDEP). An interim GIDEP Policy for suspected counterfeits was instituted. NASA's recommendation to the policy was for identification of the supplier and suggests allowing access to that information by government only. The issues with the General MIL specification, the testing requirements for radiation issues, the continuing development of Class Y standards for electronic equipment, status of package case isolation tests needed for 750 and 883,enhancement of 750 Internal Visual Inspection are reviewed. Further issues with consistent ESD control conditions across commodities, test methods, humidity limits, etc are briefly reviewed. The cost benefit analysis of film versus Real time radiography are also reviewed.
Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared.
While some Graphical Processing Units (GPUs) are discrete components (i.e.GTX1050), others take the form of an IP block or embedded engine within a System on Chip (SoC) device such as the Qualcomm Snapdragon"TM" 820 which contains a Qualcomm Adreno"TM" 530 GPU. Within this device are various functional blocks which can be exercised with software payloads. NVidia's Jetson"TM" TX1 SoC is provided on a System on Module (SOM). Within it are Central Processing Unit (CPU) cores and an nVidia GPU which can be accessed similarly to a discrete GPU coprocessor. While the packaging is different, each one of these GPUs needs to be tested using the same standardized code.
Test hardware used as pathfinder for Thermal Standard test materials and methods
Calibrations by four U.S. laboratories of four hot-cathode ion gauges, in the range 0.07-13 mPa, showed systematic differences among laboratories that were much larger than the expected error of any one calibration. They also suggested that any of the four gauges tested, if properly packaged and shipped, was able to serve as a transfer standard with probable error of 2%. A second comparison was made of the calibrations by two U.S. laboratories of some other gauges that had also been calibrated by the National Physical Laboratory, England. Results did not permit conclusive determination of whether differences were due to the laboratories or to changes in the gauges.
The Intravenous Fluid Generation (IVGEN) Experiment was a technology demonstration experiment that purified ISS potable water, mixed it with salt, and transferred it through a sterilizing filter. On-orbit performance was verified as appropriate and two 1.5 l bags of normal saline solution were returned to earth for post-flight testing by a FDA certified laboratory for compliance with United States Pharmacopiea (USP) standards. Salt concentration deviated from required values and an analysis identified probable causes. Current efforts are focused on Total Organic Content (TOC) testing, and shelf life.The Intravenous Fluid Generation (IVGEN) Experiment demonstrated the purification of ISS potable water, the mixing of the purified water with sodium chloride, and sterilization of the solution via membrane filtration. On-orbit performance was monitored where feasible and two 1.5-liter bags of normal saline solution were returned to earth for post-flight testing by a FDA-registered laboratory for compliance with United States Pharmacopeia (USP)standards [1]. Current efforts have been focused on challenge testing with identified [2] impurities (total organic-carbon), and shelf life testing. The challenge testing flowed known concentrations of contaminants through the IVGEN deionizing cartridge and membrane filters to test their effectiveness. One finding was that the filters and DI-resin themselves contribute to the contaminant load during initial startup, suggesting that the first 100 ml of fluid be discarded. Shelf life testing is ongoing and involves periodic testing of stored DI cartridges and membrane filters that are capped and sealed in hermetic packages. The testing is conducted at six month intervals measuring conductivity and endotoxins in the effluent. Currently, the packaging technique has been successfully demonstrated for one year of storage testing. The USP standards specifies that the TOC be conducted at point of generation as opposed to point of consumption. Samples were generated and shipped to an FDA facility however, testing determined that the samples failed the TOC specification with most likely due to leaching from the sample container. Shelf life testing is examining packaging techniques and periodic testing of samples of DI cartridges that are capped and sealed in hermetic packages. Periodic testing of the purified water output will be conducted at six month intervals.
Over the course of 60 years of shape memory alloy research and development, the properties of these alloys have been measured using various testing methods, which are often customized by the organization performing the test. However, commercial adoption of shape memory alloys in aeronautic actuator applications requires reducing property uncertainty through standardizing test methods. Historically, differential scanning calorimetry (DSC) has been used to measure transformation temperatures under stress-free conditions. This testing method is well established, and tests are run under the applicable standard, ASTM F2004-17: Standard Test Method for Transformation Temperature of Nickel-Titanium Alloys by Thermal Analysis. Two other test methods for measuring strains and transformation temperatures under constant load or free recovery after prestraining have only recently been standardized—ASTM E3097: Standard Test Method for Mechanical Uniaxial Constant Force Thermal Cycling of SMAs (UCFTC) and ASTM E3098: Standard Test Method for Mechanical Uniaxial Pre-Strain and Thermal Free Recovery of SMAs (UPFR). These standards represent a critical step forward in producing reliable material property data for the use of these alloys in aeronautics and other commercial areas. However, no standard programs or software packages were previously available for postprocessing UCFTC- and UPFR-type test data to extract property data. Each organization that performed the testing analyzed data using its own custom manual methods, such as using a plot and a straight edge, spreadsheet plotting methods, or custom code routines, to extract the required values for strains, stresses, and transformation temperatures. SMAnalytics represents the first publicly available uniform software package for processing data generated using the DSC, UCFTC, and UPFR test methods, as well as many modifications of these methods, including loading in martensite versus austenite and performing multiple thermal cycles at stress. In doing so, it provides a tool for reducing potential error or variability in the measured values due to the precision of the technique used and person-to-person variability. It is also expected that this automated data-parsing tool can accelerate the data analysis phase of the test campaign, especially for large data files. This User’s Manual describes how the SMAnalytics software works and the method for its use.
Test probe, in conjunction with standard equipment, tests axial-lead electronic components in their original packages. The probe can be modified to test any electronic component with automatic or nonautomatic equipment.
A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.
This paper gives a description of OPC (Object Linking and Embedding for Process Control) standards for process control and outlines the experiences at JSC with using these standards to interface with I/O hardware from three independent vendors. The I/O hardware was integrated with a commercially available SCADA/HMI software package to make up the control and monitoring system for the Environmental Systems Test Stand (ESTS). OPC standards were utilized for communicating with I/O hardware and the software was used for implementing monitoring, PC-based distributed control, and redundant data storage over an Ethernet physical layer using an embedded din-rail mounted PC.
The Space Food Systems Laboratory (SFSL) is a multipurpose laboratory responsible for space food and package research and development. It is located on-site at Johnson Space Center in Building 17. The facility supports the development of flight food, menus, packaging and food related hardware for Shuttle, International Space Station, and Advanced Life Support food systems. All foods used to support NASA ground tests and/or missions must meet the highest standards before they are 'accepted' for use on actual space flights. The foods are evaluated for nutritional content, sensory acceptability, safety, storage and shelf life, and suitability for use in micro-gravity. The food packaging is also tested to determine its functionality and suitability for use in space. Food Scientist, Registered Dieticians, Packaging Engineers, Food Systems Engineers, and Technicians staff the Space Food Systems Laboratory.
In August 2008, Schuessler Consulting was contracted by NASA GSFC in support of the NASA Electronic Parts and Packaging (NEPP) program to perform two separate studies on moisture laden air in a stainless steel cylinder that had been designed to become a consensus standard for Test Method 1018. This Test Method was originally released for hybrids under Mil. Std. 883 but was quickly utilized on other microelectronic devices under the auspice of Mil. Std. 750. The cylinder had subsequently been fabricated for the 750 community. It was back-filled with moist air and subsequently analyzed over a period of time under a previous NASA contract. It had been shown that moisture in the 4000 - 5000 ppm range could be analyzed rather precisely with a mass spectrometer, commonly referred to as a Residual Gas Analyzer (RGA). The scope of this study was to ascertain if the composition and precision varied as a function of thermal shock at sub-zero temperatures and whether there was consensus when the standard was submitted to other RGA units. It was demonstrated and published that the consensus standard would yield precise RGA data for moisture within +/- 1% when optimized for a given RGA unit. It has been subsequently shown in this study at Oneida Research Services, that sub-zero storage did not affect that precision when a well-defined protocol for the analysis was followed. The consensus standard was taken to a second facility for analysis where it was found that moisture adsorption on the transfer lines caused precision to drop to +/- 12%. The Single Sample Cylinder (SSC) is a one liter stainless steel cylinder with associated sampling valves and has considerable weight and volume. But this considerable size allows for approximately 300 gas samples of the same composition to be delivered to any RGA unit. Lastly, a smaller cylinder, approximately 75 cc, of a second consensus standard was fabricated and tested with a different mix of fixed gases where moisture was kept in the 100 ppm range. This second standard has the potential of providing 30 gaseous samples and can be readily shipped to any analytical facility that desires to generate comparison RGA data. A series of comparison residual gas analyses was performed at the Honeywell Federal Manufacturing & Technologies facility in the National Nuclear Facility Administration s plant in Kansas City to complete this project. It was shown that improvements in the precision of a given RGA unit can be done by controlling the cycle time for each analysis and increasing analysis temperatures to minimize moisture adsorption. It was also found that a "one time event" in the subzero storage of the large SSC did not effect the units ability to continuously supply precise samples of the same chemistry, however the "event" caused a permanent +8% shift in the reported value of the moisture content. Lastly, a set of SSC RGA results was plotted on a common graph with DSCC "correlation study" RGA data. The result demonstrates the ability of the SSC to remove many of the individual variances that single, individual samples introduce. The consensus standards are now in storage at Oneida Research Services, one of the DSCC certified houses that does RGA to Military Standards, where they await future studies. The analytical data and the operational parameters of the instruments used are provided in the following discussion. Limitations and suggested means for improvement of both precision and accuracy are provided.