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Results for “thermal compression bonding”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

In Situ Study on Cu-to-Cu Thermal Compression Bonding

Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength of the Cu bonds, the bonding processes generally require high temperature and high pressure, which may degrade the performance and reliability of the device. Therefore, it is imperative to investigate the processing parameters to understand the bonding mechanism and achieve effective TCB at a low temperature and low pressure. Here, we developed an in situ TCB technique inside a scanning electron microscope. The in situ TCB method enables a real-time observation of bonding development, which provides critical insights into how the texture and microstructure of Cu bumps may influence the creep and surface diffusion during the bonding process. This work features a strategy to advance our understanding of the bonding mechanisms and provides insight into tailoring the microstructure of Cu for bonding at a low temperature and low pressure.

36 MATERIALS SCIENCE↗
NASA NTRS2012

Fabrication of a Silicon Backshort Assembly for Waveguide-Coupled Superconducting Detectors

The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microwave background to search for evidence for gravitational waves from a posited epoch of inflation early in the Universe s history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with excellent control of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs we present work on the fabrication of micromachined silicon, producing conductive quarter-wave backshort assemblies for the CLASS 40 GHz focal plane. Each 40 GHz backshort assembly consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through-wafer vias to provide a 2.04 mm long square waveguide delay section. The third wafer terminates the waveguide delay in a short. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detector chips with the quarter-wave backshort assemblies.

Crowe, Erik J.↗
NASA NTRS2012

Fabrication of Silicon Backshorts with Improved Out-of-Band Rejection for Waveguide-Coupled Superconducting Detectors

The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microqave background to search for gravitational waves form a posited epoch of inflation early in the universe's history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with good conrol of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs we will present work on the fabrication of silicon quarter-wave backshorts for the CLASS 40GHz focal plane. The 40GHz backshort consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through wafer vins to provide a 2.0mm long square waveguide. The third wafer acts as the backshort cap. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detectors with silicon quarter wave backshorts and present current measurement results.

Crowe, Erik J.↗
DOE OSTI2024

Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices

Bonding diamond to the back side of gallium nitride (GaN) electronics has been shown to improve thermal management in lateral devices; however, engineering challenges remain with the bonding process and characterizing the bond quality for vertical device architectures. Here, in this study, integration of these two materials is achieved by room-temperature compression bonding centimeter-scale GaN and a diamond die via an intermetallic bonding layer of Ti/Au. Recent attempts at GaN/diamond bonding have utilized a modified surface activation bonding (SAB) method, which requires Ar fast atom bombardment immediately followed by bonding within the same tool under ultrahigh vacuum (UHV) conditions. The method presented here does not require a dedicated SAB tool yet still achieves bonding via a room-temperature metal–metal compression process. Imaging of the buried interface and the total bonding area is achieved via transmission electron microscopy (TEM) and confocal acoustic scanning microscopy (C-SAM), respectively. The thermal transport quality of the bond is extracted from spatially resolved frequency-domain thermoreflectance (FDTR) with the bonded areas boasting a thermal boundary conductance of >100 MW/m 2 ·K. Additionally, Raman maps of GaN near the GaN–diamond interface reveal a low level of compressive stress, <80 MPa, in well-bonded regions. FDTR and Raman were coutilized to map these buried interfaces and revealed some poor thermally bonded areas bordered by high-stress regions, highlighting the importance of spatial sampling for a complete picture of bond quality. Overall, this work demonstrates a novel method for thermal management in vertical GaN devices that maintains low intrinsic stresses while boasting high thermal boundary conductances.

Raman↗
NASA NTRS2003

Cloverleaf Vibratory Microgyroscope with Integrated Post

A modified design and fabrication sequence has been devised to improve the performance of a cloverleaf vibratory microgyroscope that includes an axial rod or post rigidly attached to the center of the cloverleaf structure. The basic concepts of cloverleaf vibratory microgyroscopes, without and with rods or posts, were described in two prior articles in NASA Tech Briefs, Vol. 21, No. 9 (September 1997): Micromachined Planar Vibratory Microgyroscopes (NPO-19713), page 68 and Planar Vibratory Microgyroscope: Alternative Configuration (NPO-19714), page 70. As described in more detail in the second-mentioned prior article, the cloverleaf-shaped structure and the rod or post are parts of a vibratory element that senses rotation via the effect of the Coriolis force upon its vibrations. Heretofore, the posts for devices of this type have been fabricated separately, then assembled manually onto the cloverleaf structures. The resulting imperfections in the assembled units have given rise to asymmetric stresses in the cloverleaf structures and, consequently, to changes in resonant frequencies of vibration and in shapes of vibration modes. These changes, in turn, have caused variations in performance among nominally identical devices. The modified design provides for the fabrication of the upper half of the post as an integral part of the cloverleaf structure; this is accomplished by reactive-ion etching of a single-piece half-post-and-cloverleaf structure from a wafer of silicon. The lower half of the post and a baseplate are also a single piece made by reactive-ion etching from a wafer of silicon. The two pieces are bonded together (see figure) by a thermal-compression metal-to-metal bonding technique to form a cloverleaf gyroscope with an integrated post structure..

Tang, Tony K.↗
DOE OSTI2021

Dynamically Unveiling Metal–Nitrogen Coordination during Thermal Activation to Design High‐Efficient Atomically Dispersed CoN 4 Active Sites

Abstract We elucidate the structural evolution of CoN 4 sites during thermal activation by developing a zeolitic imidazolate framework (ZIF)‐8‐derived carbon host as an ideal model for Co 2+ ion adsorption. Subsequent in situ X‐ray absorption spectroscopy analysis can dynamically track the conversion from inactive Co−OH and Co−O species into active CoN 4 sites. The critical transition occurs at 700 °C and becomes optimal at 900 °C, generating the highest intrinsic activity and four‐electron selectivity for the oxygen reduction reaction (ORR). DFT calculations elucidate that the ORR is kinetically favored by the thermal‐induced compressive strain of Co−N bonds in CoN 4 active sites formed at 900 °C. Further, we developed a two‐step (i.e., Co ion doping and adsorption) Co‐N‐C catalyst with increased CoN 4 site density and optimized porosity for mass transport, and demonstrated its outstanding fuel cell performance and durability.

He, Yanghua↗
DOE OSTI2021

Dynamically Unveiling Metal–Nitrogen Coordination during Thermal Activation to Design High-Efficient Atomically Dispersed CoN 4 Active Sites

We elucidate the structural evolution of CoN 4 sites during thermal activation by developing a zeolitic imidazolate framework (ZIF)-8-derived carbon host as an ideal model for Co 2+ ion adsorption. Subsequent in situ X-ray absorption spectroscopy analysis can dynamically track the conversion from inactive Co-OH and Co-O species into active CoN 4 sites. The critical transition occurs at 700 °C and becomes optimal at 900 °C, generating the highest intrinsic activity and four-electron selectivity for the oxygen reduction reaction (ORR). DFT calculations elucidate that the ORR is kinetically favored by the thermal-induced compressive strain of Co-N bonds in CoN 4 active sites formed at 900 °C. Further, we developed a two-step (i.e., Co ion doping and adsorption) Co-N-C catalyst with increased CoN 4 site density and optimized porosity for mass transport, and demonstrated its outstanding fuel cell performance and durability.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Mechanical and thermomechanical properties of an LLM-105 based PBX high explosive with and without accelerated aging

In this paper we present measurements and analysis on the mechanical and thermomechanical properties of the LLM-105 based plastic bonded high explosive RX-55-DQ. Specifically we present uni-axial compression, and thermal measurements (CTE and ratchet growth), and for some of the measurements we provide a comparison to measurements on TATB-based PBX 9502. We also present the same mechanical property measurements performed on RX-55-DQ samples that underwent accelerated aging.

thermomechnical properties↗
NASA NTRS2009

Advanced Embedded Active Assemblies for Extreme Space Applications

This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.

lead bonding↗
DOE OSTI2021

Anisotropic Structural Collapse of Mg 3 Sb 2 and Mg 3 Bi 2 at High Pressure

Alloys between Mg 3 Sb 2 and Mg 3 Bi 2 have recently been shown to be exceptional thermoelectric materials due in part to their anomalously low thermal conductivity. In the present study, in situ high-pressure synchrotron X-ray diffraction was used to investigate the structure and bonding in Mg 3 Sb 2 and Mg 3 Bi 2 at pressures up to 50 GPa. Our results confirm prior predictions of isotropic in-plane and out-of-plane compressibility but reveal large disparities between the bond strength of the two distinct Mg sites. Using single-crystal diffraction, we show that the octahedral Mg–Sb bonds are significantly more compressible than the tetrahedral Mg–Sb bonds in Mg 3 Sb 2 , which lends support to prior arguments that the weaker octahedral Mg bonds are responsible for the anomalous thermal properties of Mg 3 Sb 2 and Mg 3 Bi 2 . Further, we report the discovery of a displacive and reversible phase transition in both Mg 3 Sb 2 and Mg 3 Bi 2 above 7.8 and 4.0 GPa, respectively. Furthermore, the transition to the high-pressure structure involves a highly anisotropic volume collapse, in which the out-of-plane axis compresses significantly more than the in-plane axes. Single-crystal diffraction at high pressure was used to solve the monoclinic high-pressure structure ( C 2/ m ), which is a distorted variant of the ambient-pressure structure containing four unique Mg coordination environments.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Design of a High Toughness Epoxy for Superconducting Magnets and Its Key Properties

Nb 3 Sn accelerator magnets are poised to enable the luminosity upgrade of the Large Hadron Collider (LHC) at CERN, improving its potential for exploring physics beyond the standard model of particle physics. The prototype Nb 3 Sn magnets consistently need 10–25 quenches to achieve their best performance. A hypothesis is that the long training of these magnets may at least be partially induced by epoxy cracking and bonding failures. In 2018, we showed that several existing epoxies have a higher toughness and less tendency to crack at low temperatures than CTD-101K, the epoxy resin with which almost all Nb 3 Sn accelerator magnets have been impregnated. Here we explore a new high toughness formulation for reducing quench training of Nb 3 Sn accelerator magnets, through combining two amine curing agents to achieve a good glass transition temperature (T g ), adding a viscosity reducer to achieve low viscosity, and experimenting a coupling agent for improved bonding strengths. In this work, we report results of comprehensive materials tests, including thermal shock, tensile, compressive, shear tests, viscosity and T g tests.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
NASA NTRS1981

Design, Fabrication and Test of Graphite/Polyimide Composite Joints and Attachments for Advanced Aerospace Vehicles

Standard and advanced bonded joint concepts were evaluated to develop a data base for the design and analysis of advanced composite joints for use at elevated temperatures (561K (550F)). Design concepts for specific joint applications and the fundamental parameters controlling the static strength characteristics of such joints were identified. Test results are presented for rail shear and sandwich beam compression tests and tension tests of moisture conditioned specimens and bonded on "T" sections. Coefficients of thermal expansion data are presented for A7F (LARC 13 Amide-imide modified) adhesion. Static discriminator test results for type 1 and type 2 bonded and bolted preliminary attachment concepts are presented and discussed.

Cushman, J. B.↗
DOE OSTI2020

Self-Repairing Polymer-Modified Cements for High Temperature Geothermal and Fossil Energy Applications

In this work five novel polymer-cement composite formulations were prepared and evaluated as potential cementitious material alternatives to conventional wellbore cement. These cement composites were cured at 200 °C and their mechanical properties, including compressive strength, Young modulus, shear bond strength to steel casing, and self-healing and re-adhering (to steel) capability. Thermal stability was also evaluated by curing these cement materials at 200 °C for up to one month followed by determining their mineralogy and chemical composition by X-ray diffraction spectroscopy, 13C NMR, and total organic carbon. Permeability analysis was performed before and after healing a longitudinal fracture on unmodified cements and polymer-cement composites with the later showing lower (2nd/1st) permeability ratios with respect to base cements. Furthermore, a reduction in permeability of up to 80X on average with respect to their unmodified (base) cement, was observed in two polymer-cement formulations suggesting that the introduction of these polymers bring about self-healing capability. Two of the best performing polymer-cement composites were exposed to 30-day curing period at 200 °C showing that their self-healing capability is maintained. The composite stability is associated to the fact that the polymer material is stable as demonstrated by total organic carbon and NMR spectroscopy. These advanced polymer-cement composites with higher ductility and self-healing capability could be used as alternative wellbore cement materials for geothermal and fossil energy applications.

Rod, Kenton A.↗