Carbon Fiber Reinforced Plastic with Substantially Improved Through-plane Thermal Conductivity
Thermal conductivity of carbon fiber support structures that also serve as cooling substrates is of increasing importance for high energy physics detectors. One of the shortcomings of current carbon fiber laminates is that they exhibit excellent thermal conductivity of order several hundred W/(m*K) along the fiber direction, whereas the through plane thermal conductivity perpendicular to the fibers is orders of magnitude lower, and at about 1 W/(m*K) more in the range of thermal insulators. This proposal aims to significantly improve the through plane thermal conductivity, by at least a factor five, changing CFRP from being a thermal insulator to a thermal conductor in the through plane direction. Between June 2021 and December 2022, a total of 36 carbon fiber laminate test samples and two carbon loaded epoxy test samples were manufactured and analyzed for thermal performance. Unfortunately, the promising results obtained with a similar sample manufactured in 2017 were not reproduced. We believe this to be mainly due the excessive age of the carbon fiber prepreg material used for this SBIR - the same material batch, produced in 2015, was used in 2017 and in 2021/2022, i.e. the material was seven years old when the final samples were produced - , and to a lesser degree to the difference in pressure attainable with the 2017 and 2021/2022 laminate curing setups. While disappointing, the results are not completely discouraging, since for the samples with the highest compression the through-plane thermal conductivities plotted as a function of per-ply thickness extrapolate well to the data point from the 2017 sample.