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Fossum, E.

Publications and source records attributed to Fossum, E..

A Single Chip CMOS APS Digital Camera

A complete programmable digital camera-on-a-chip based on low power active pixel sensor technology is implemented as a single CMOS integrated circuit.

imaging sensor camera-on-a-chip digital camera

A Fully Integrated Micro-Magnometer/Microspacecraft for Multipoint Measurements: The Free-Flyer Magnometer

In the decades since the advent of in situ plasma measurements on board spacecraft, the instrumentation has grown bigger, heavier, and more complex as our understanding of space plasmas improves and our appetite for more information increases...There has thus been a recent interest in the miniaturization of both spacecraft and the instrument payload... This paper describes the results and status of an ongoing design study to understand the problems and trade space of fully integrating an instrument into a micro-spacecraft.

plasma plasma measurement space plasma

Development of CMOS Active Pixel Image Sensors for Low Cost Commercial Applications

JPL, under sponsorship from the NASA Office of Advanced Concepts and Technology, has been developing a second-generation solid-state image sensor technology. Charge-coupled devices (CCD) are a well-established first generation image sensor technology. For both commercial and NASA applications, CCDs have numerous shortcomings. In response, the active pixel sensor (APS) technology has been under research. The major advantages of APS technology are the ability to integrate on-chip timing, control, signal-processing and analog-to-digital converter functions, reduced sensitivity to radiation effects, low power operation, and random access readout.

solid-state image sensors active pixel sensor APS

Ultra Low Power Imaging Systems Using CMOS Image Sensor Technology

The need for miniaturization in advanced science sensor systems has led to the development of a new image sensor technology, the active pixel image sensor (APS). The development of CMOS APS technology allows the integration of timing and control electronics, imaging detector arrays, signal chains and analog-to-digital conversion on a single integrated circuit. The impact on the imaging system is to reduce power by approximately 1000x over existing systems - from tens of watts to tens of milliwatts.

imaging

Two-Dimensional Interdigitated Pixel Detector for Energetic Particle Spectrometers

This paper describes a type of cosmic ray detector suitable for the construction of a small, low power space-based instrument to detect the energy and isotope of energetic nuclei, such as those produced by solar flares. The detector is similar to previous types of silicon PIN detectors where the fully depleted body of the wafer comprises intrinsic region of the PIN structure. The novel aspect of this detector is that the one surface is divided into a two-dimensional array of pixels, and that the collected holes are divided between a row and a column collector in each pixel, yielding both dimensions of position information from this side of the detector.

cosmic

Development of CMOS Active Pixel Image Sensors for Low Cost Commercial Applications

This paper describes ongoing research and development of CMOS active pixel image sensors for low cost commercial applications. A number of sensor designs have been fabricated and tested in both p-well and n-well technologies. Major elements in the development of the sensor include on-chip analog signal processing circuits for the reduction of fixed pattern noise, on-chip timing and control circuits and on-chip analog-to-digital conversion (ADC). Recent results and continuing efforts in these areas will be presented.

active pixel image sensors CMOS signal processing

Approaches and Analysis for On-Focal-Plane Analog-to-Digital Conversion

This paper presents approaches for on-focal-plane analog-to-digital conversion (ADC). Common approaches and architectures for ADC and their utility for on-focal-plane integration are discussed. Candidate approaches are analyzed with respect to required amplifier gain, bandwidth, capacitance matching, noise and offsets as a function of ADC resolution. A column-parallel ADC architecture appears to be an effective compromise of chip area, power, circuit speed and ADC resolution. The discussion is valid for both infrared focal-plane arrays (FPAs) and visible image sensors.

analog-to-digital

Cryogenic GaAS JFETS

Gallium arsenide junction field-effect transistors (GaAS JFETS) are promising for deep cryogenic (<10k) readout electonics applications.

structure

Progress in CMOS Active Pixel Image Sensors

Recent research results regarding the investigation of CMOS active pixel image sensors (APS) are reported. An investigation of various designs for the pixel, including photogate devices of various geometries and photodiode devices has been performed. Opto-electronic performance including intra-pixel photoresponse maps taken using a focused laser scanning apparatus are presented. Several imaging arrays have also been investigated. A 128 x 128 image sensor has been fabricated and characterized. Both p-well and n-well implementations have been explored. The demonstrated arrays use 2 micron CMOS design rules and have a 40 x 40 micron pixel pitch.

active

Assessment of Image Sensor Technology for Future NASA Missions

An assessment of solid-state UV/visible image sensor technology for future NASA missions is presented. The paper will attempt to summarize the state of the art in image sensor technology in the United States, Canada, Japan, and Europe. The state of the art and future trends will be compared to a forecast of future NASA needs in scientific image sensors for planetary exploration, earth science, astrophysics, and spacecraft systems such as star trackers and optical communications.

solid-state