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Papapolymerou, John

Publications and source records attributed to Papapolymerou, John.

Low-Power Characterization and Integration of Carbon Black Resistive Ink for Aerosol Jet-Printed RF Components

Aerosol jet printing (AJP) is gaining attention in additive manufacturing research, especially in the discipline of microwave engineering. Currently, no reliable AJP method exists to fabricate resistors that are both electrically small and with a resistance compatible with waveguide impedances for use in microwave components. In this work, the commercially available Metalon JR-038 is characterized and used to fabricate a resistor that is 100 μ m long by 250 μ m wide for the first time to the best of our knowledge. Furthermore, this resistor was then used to fabricate a Ka-band Wilkinson power divider using only the AJP process.

36 MATERIALS SCIENCE↗

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits

Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.

42 ENGINEERING↗

Experimental Investigation of 60 GHz Transmission Characteristics Between Computers on a Conference Table for WPAN Applications

In this paper, the first measurements of the received radiated power between antennas located on a conference table to simulate the environment of antennas embedded in laptop computers for 60 GHz Wireless Personal Area Network (WPAN) applications is presented. A high gain horn antenna and a medium gain microstrip patch antenna for two linear polarizations are compared. It is shown that for a typical conference table arrangement with five computers, books, pens, and coffee cups, the antennas should be placed a minimum of 5 cm above the table, but that a height of greater than 20 cm may be required to maximize the received power in all cases.

Ponchak, George E.↗

A Compact Low-loss Magic-T using Microstrip-Slotline Transitions

The design of a compact low-loss magic-T is proposed. The planar magic-T incorporates the compact microstrip-slotline tee junction and small microstrip-slotline transition area to reduce slotline radiation. The experimental results show that the magic-T produces broadband in-phase and out-of-phase power combiner/divider responses, has an average in-band insertion loss of 0.3 dB and small in-band phase and amplitude imbalance of less than plus or minus 1.6 deg. and plus or minus 0.3 dB, respectively.

U-yen, Kongpop↗

RF and DC Power Handling Characterization of Thin Film Resistors Embedded on LCP

For the first time, the DC and RF power handling capability of NiCrAlSi thin film resistors on Liquid Crystal Polymer (LCP) is presented. It is shown that there is a maximum power that the resistors can handle without causing degradation of the resistors, and this value is significantly less than the power required for burn out of the resistors. EDAX shows that the resistors fail due to electromigration of Ni and Cr, and migration of C from the LCP.

Ponchak, George E.↗

Ultra-Compact Broadband High-Spurious Suppression Bandpass Filter Using Double Split-end Stepped Impedance Resonators

We propose an ultra compact single-layer spurious suppression band pass filter design which has the following benefit: 1) Effective coupling area can be increased with no fabrication limitation and no effect on the spurious response; 2) Two fundamental poles are introduced to suppress spurs; 3) Filter can be designed with up to 30% bandwidth; 4) The Filter length is reduced by at least 100% when compared to the conventional filter; 5) Spurious modes are suppressed up to at the seven times the fundamental frequency; and 6) It uses only one layer of metallization which minimize the fabrication cost.

U-Yen, Kongpop↗

"The Design of a Compact, Wide Spurious-Suppression Bandwidth Bandpass Filter Using Stepped Impedance Resonators"

We propose an analytical design for a microstrip broadband spurious-suppression filter. The proposed design uses every section of the transmission lines as both a coupling and a spurious suppression element, which creates a very compact, planar filter. While a traditional filter length is greater than the multiple of the quarter wavelength at the center passband frequency (lambda(sub g)/4), the proposed filter length is less than (order n(Ssup th) + l)center dot lambda(sub g)/8. The filter s spurious response and physical dimension are controlled by the step impedance ratio (R) between two transmission line sections as a lambda(sub g)/4 resonator. The experimental result shows that, with R of 0.2, the out-of-band attenuation is greater than 40 dB; and the first spurious mode is shifted to more than 5 times the fundamental frequency. Moreover, it is the most compact planar filter design to date. The results also indicate a low in-band insertion loss.

U-Yen, Kongpop↗

Excitation of Coupled Slotline Mode in Finite Ground CPW with Unequal Ground Plane Widths

The coupling between the desired CPW mode and the unwanted coupled slotline mode is presented for finite ground coplanar waveguides with unequal ground plane widths. Measurements, quasi-static conformal mapping, and Finite-Difference Time-Domain analysis are performed to determine the dependence of the slotline mode excitation on the physical dimensions of the FGC line and on the frequency range of operation. It is shown that the ratio of the slotline mode to the CPW mode can be as high as 18 dB. The use of airbridges is shown to reduce the slotline mode by 15 dB, but that the slotline mode fully reestablishes itself after 2000 microns. Furthermore, these results are independent of frequency.

Ponchak, George E.↗

180 Degree Hybrid (Rat-Race) Junction on CMOS Grade Silicon with a Polyimide Interface Layer

180-degree hybrid junctions can be used to equally divide power between two output ports with either a 0 or 180-degree phase difference. Alternatively, they can be used to combine signals from two sources and output a sum and difference signal. The main limitation of implementing; these on CMOS grade silicon is the high loss associated with the substrate. In this paper, we present a low loss 180-degree hybrid junction on CMOS grade (15 omega-cm) silicon with a polyimide interface layer for the first time. The divider utilizes Finite Ground Coplanar (FGC) line technology, and operates at a center frequency of 15 GIIz.

Ponchak, George E.↗

Coupling Between Microstrip Lines With Finite Width Ground Plane Embedded in Thin Film Circuits

Three-dimensional (3D) interconnects built upon multiple layers of polyimide are required for constructing 3D circuits on CMOS (low resistivity) Si wafers, GaAs, and ceramic substrates. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines a r e susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements a r e used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions. Furthermore, it is shown that coupled microstrip lines establish a slotline type mode between the two ground planes and a dielectric waveguide type mode, and that the via holes recommended here eliminate these two modes.

Ponchak, George E.↗

Coupling Between CPW and Slotline Modes in Finite Ground CPW with Unequal Ground Plane Widths

The coupling between the desired CPW mode and the unwanted, slotline, mode is presented for finite ground coplanar waveguides with unequal ground plane widths. Measurements, quasi-static conformal mapping, and Method of Moment analysis are performed to determine the dependence of the slotline mode excitation on the physical dimensions of the FGC line and on the frequency range of operation. Introduction: Finite ground coplanar waveguide (FGC) is often used in low cost Monolithic Microwave Integrated Circuits (MMICs) because of its many advantages over microstrip and conventional CoPlanar Waveguide (CPW). It is uniplanar, which facilitates easy connection of series and shunt elements without via holes, supports a low loss, quasi-TEM mode over a wide frequency band, and since the ground planes are electrically and physically narrow, typically less than lambda/5 wide where lambda is the guided wavelength, they reduce the circuit size and the influence of higher order modes. However, they still support the parasitic slotline mode that plagues all CPW transmission lines.

Ponchak, George E.↗

Measured Propagation Characteristics of Finite Ground Coplanar Waveguide on Silicon with a Thick Polyimide Interface Layer

Measured propagation characteristics of Finite Ground Coplanar (FGC) waveguide on silicon substrates with resistivities spanning 3 orders of magnitude (0.1 to 15.5 Ohm cm) and a 20 micron thick polyimide interface layer is presented as a function of the FGC geometry. Results show that there is an optimum FGC geometry for minimum loss, and silicon with a resistivity of 0.1 Ohm cm has greater loss than substrates with higher and lower resistivity. Lastly, substrates with a resistivity of 10 Ohm cm or greater have acceptable loss.

Ponchak, George E.↗

Folded Coplanar Waveguide Slot Antenna on Silicon Substrates With a Polyimide Interface Layer

A novel mm-wave Coplanar Waveguide (CPW) folded slot antenna is characterized on low-resistivity Si substrate (1 omega-cm) and a high resistivity Si substrate with a polyimide interface layer for the first time. The antenna resonates around 30 GHz with a return loss greater than 14.6 dB. Measured radiation patterns indicate the existence of a main lobe, but the radiation pattern is affected by a strong surface wave mode, which is greater in the high resistivity Si wafer.

Bacon, Andrew↗

Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented.

Ponchak, George E.↗

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗

Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on complementary metal oxide semiconductor (CMOS) (low resistivity) Si wafers. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements are used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions.

Ponchak, George E.↗

Coupling between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing SilSiGe monolithic microwavdmillimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented. A discussion of the electric and magnetic field distributions for the coupled microstrip lines is presented to provide a physical rationale for the presented results.

Ponchak, George E.↗