NASA NTRS · 20210004215
Transmission Lines for High Frequency and High Density Packaging
Abstract
We report on resistivity and chemical stability of Cr/Au bilayers deposited by sputtering on three kinds of substrates: alumina, aluminum nitride and aluminum nitride coated alumina. The insertion loss of Cr/Au microstrip lines fabricated on these three substrates was low and stable after 100 cycles in the -65 degree C to 125 degree C temperature range.
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Lee, K., Herman, M., Lowry, L., Kolawa, E.. 1994-11-07. Transmission Lines for High Frequency and High Density Packaging. https://ntrs.nasa.gov/citations/20210004215
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