DOE OSTI · 1327873
Device level 3D-ICs Through Membrane Projected Lithography Using CMOS Compatible Materials.
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Finnegan, Patrick Sean, Burckel, David Bruce. 2015-09-01. Device level 3D-ICs Through Membrane Projected Lithography Using CMOS Compatible Materials.. https://www.osti.gov/biblio/1327873
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