DOE OSTI · 2541646
Integration of semiconductor membranes with piezoelectric substrates
Abstract
Piezoelectrically actuated devices constructed from thin semiconductor membranes bonded directly to piezoelectric substrates are provided. Methods for fabricating these devices are also provided. The bonding of the semiconductor to the piezoelectric material does not require the use of any intermediate layers, such as bonding agents.
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Lagally, Max G., Bhat, Abhishek, Flack, Frank Steele, Scott, Shelley Ann, Blick, Robert H.. 2024-01-02. Integration of semiconductor membranes with piezoelectric substrates. https://www.osti.gov/biblio/2541646
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