Deciphering Mechanical Damage Signatures in Epoxy Mold Compounds for Microelectronics Packaging

Kropka, Jamie Michael [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000946517375); Hiep-Vo, Vincent Phuc Thien [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]; Long, Kevin Nicholas [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000347184161)

doi:10.2172/3027439

DOE OSTI · 3027439

Deciphering Mechanical Damage Signatures in Epoxy Mold Compounds for Microelectronics Packaging

Kropka, Jamie Michael [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000946517375)·Hiep-Vo, Vincent Phuc Thien [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]·Long, Kevin Nicholas [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000347184161)

View original source ↗Read source document ↗Export metadata ↓

Abstract

The source did not provide an abstract. Follow the original record for more information.

Keep this discovery

Explore connections, maps & timelines

BibTeX RIS

Kropka, Jamie Michael [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000946517375), Hiep-Vo, Vincent Phuc Thien [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)], Long, Kevin Nicholas [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000347184161). 2025-02-01. Deciphering Mechanical Damage Signatures in Epoxy Mold Compounds for Microelectronics Packaging. https://doi.org/10.2172/3027439

Cite the original work for its findings. Save a collection to share your selection of sources.