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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Water flow boiling heat transfer and pressure drop in smooth, etched, and herringbone aluminum tubes
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Industrial data-driven machine learning soft sensing for optimal operation of etching tools
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Au nanopillar array prepared by selective etching of Au-Sr3Al2O6 vertically aligned nanocomposite thin films
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Investigation of in-situ mechanical and chemical etching: A milder hydrometallurgical approach for Au, Ni, and Cu recovery from printed circuit boards
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In Situ Atomic Tracking on the Interfacial Etching and Reconfiguration of Cu-ReSe 2 Contact during Thermal Annealing
The Schottky barrier height can be greatly affected by the metal diffusion, reaction, and covalent bonding formation at the contact. Exploring novel methods and revealing the fundamental mechanisms for contact engineering are of vital importance for microelectronic devices. Here, in this study, the annealing induced interfacial reactions at Cu-ReSe 2 contact are dynamically revealed from the atomic scale. Accompanied by the diffusion of Se to Cu, ReSe 2 is gradually decomposed to a thin Re interlayer through a “chain-by-chain” manner. Theoretical calculations show that the Cu atoms can facilitate the chemical bond breaking of ReSe 2 , significantly lowering the Se diffusion energy barrier toward Cu. The formed Re/ReSe 2 heterostructure presents a metal-like band structure, which underscores the critical role of Cu in altering the interfacial chemistry and promoting carrier transport across the interface. Our results can provide vital insights into the contact properties of ReSe 2 and provide a possible method for fabricating high-performance ReSe 2 -based devices.
Coupling into Hyperbolic Carbon-Nanotube Films with a Deep-Etched Antenna Grating
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Revitalizing interface in protonic ceramic cells by acid etch
Protonic ceramic electrochemical cells hold the promise to be operated at intermediate temperatures below 600 °C. Although the high proton conductivity of the bulk electrolyte has been demonstrated, it cannot be fully utilized in electrochemical full cells due to unknown causes. A practical solution is thus urgently needed. Here we showed that it comes from poor contacts between the low-temperature processed oxygen electrode-electrolyte interface. We demonstrated that a simple acid treatment can effectively rejuvenate the high-temperature annealed electrolyte surface, resulting in reactive bonding between the oxygen electrode and the electrolyte and improved electrochemical performance and stability. This enables exceptional protonic ceramic fuel-cell performance down to 350 °C, with peak power densities of 1.6 W cm -2 at 600 °C, 650 mW cm -2 at 450 °C, and 300 mW cm -2 at 350 °C, as well as stable electrolysis operations at large current densities above 3.9 A cm -2 under 1.4 V applied voltage at 600 °C. Furthermore, our work highlights the critical role of interfacial engineering in ceramic electrochemical devices and offers new understanding and practices towards sustainable energy infrastructure.
Sub-micron thick liquid sheets produced by isotropically etched glass nozzles
Liquid sheet jet formation holds immense promise to provide a continuously replenished target for static structural biology and high energy density studies conducted in X-ray free electron laser, synchrotron, and pulsed electron facilities.
Simulation and Design of Step-Etched Junction Termination Extensions for GaN Power Diodes.
Abstract not provided.
Passivation Mechanisms in Locally Etched P-Type Poly-Si on Silicon Nitride/Silicon Oxide Stack
Tunneling oxide passivated contacts are quickly becoming the industry standard for high-efficiency c-Si based photovoltaic cells. Further development of these structures is essential to enable higher efficiencies and better reliability of cells. By utilizing poly-Si/SixNy/SiOx stacks, very high efficiencies have been demonstrated on small area cells. In this work we investigate the cause of the excellent passivation seen by these structures and show that the primary reason of the excellent passivation seen is the blocking B diffusion to the SiOx/c -Si interface. We also show that the interface between the silicon nitride and polysilicon affects B diffusion through to the c-Si interface. Finally, we demonstrate that the composition of the nitride used is of great importance, and that an incorrect nitride composition leads to B diffusion, and is directly correlated to poor passivation performance.