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Radioactive Material (RAM) Packagings Used to transport radioactive material • Weapons components • Medical isotopes • Spent nuclear fuel • Etc. • Packages must adhere to 10 CFR 71 which drive to NUREGs, ASME codes, etc. • Transport Index (A2 values) determine if a package is Type A, Type AF, Type B, Type B(U)F
Final Technical ReportThis project aimed to research, develop, and test electric traction drive system technology for use in vehicle applications that are capable of meeting the targets set by the Department of Energy Vehicle Technologies Office. The project is categorized into three major thrusts: Bonding interfaces for packaging, thermal management of electric vehicle (EV) power inverters, and electric motor thermal management. Device- and System-Level Thermal Packaging for Electric-Drive Technologies project aimed to develop, analyze, and validate transformative approaches in thermal management and packaging for power electronics and electric motor systems, with the ultimate goal of enhancing power density, efficiency, and reliability in electrified transportation platforms.
The Oak Ridge National Laboratory (ORNL) Package Testing Program (PTP) uses commercial off-the-shelf (COTS) software in performing data collection of thermal test results for package designs that contain radioactive materials. Specifically, this software is used to collect temperature data from the furnace, packages, and ambient air to prepare and execute the thermal test specified in 10 CFR 71.73, “Thermal Test.” This software quality assurance (SQA) plan sets forth the guidelines, standards, and procedures that shall be used to provide SQA for PTP software applications. This is a living document that will be maintained for the lifecycle of the PTP program. The SQA plan follows the requirements set forth in ORNL Standards Based Management System (SBMS): Information Technology; Subject Area: Software Quality Assurance. When applicable to the requirements as described in ORNL SBMS, Software Quality Assurance, the software shall be listed in the ORNL Software Registration System (SRS). Exemptions to this SBMS are COTS and firmware that are not modified; spreadsheet applications and personal productivity tools that do not have a utility or safety application, research applications, legacy software, system software, vendor-supplied software used to interface with the vendor’s services, software used within the organization to facilitate processing or management of information, and software developed for applications not specific to the US Department of Energy (DOE).
Microfabricated surface ion traps and silicon-based photonics are critical technologies for scaling quantum systems. Current ion trap architectures face scalability and integration challenges due to limitations in optical access, fabrication techniques, and material compatibility. State-of-the-art quantum computers and atomic clocks are investigating monolithic integration, which necessitates custom traps for each ion species and has not overcome the integration hurdles presented by merging these technologies. The Chimera (Ion Traps and Packaging for Heterogeneous Integration) project proposes a novel approach utilizing heterogeneous integration (HI) of ion traps and photonic circuits. This separation of components allows for flexibility in ion trap design and reduces fabrication compromises. The Chimera project specifically designed an ion trap to interface vertically with a separately fabricated waveguide chip and demonstrates the first steps to integrating them at the packaging level. The ion trap features a large area of removed silicon, allowing the photonics chip outputs closer to the ion trap, improving alignment and packaging processes. The alignment must be accurate to < 1 µm to ensure that the light from the waveguide can overlap with the trapping region. This fine alignment must also be maintained through an ultra-high vacuum bake, a critical step in preparing an ion trap experiment. By combining separate chips, we demonstrate a new path for scaling trapped ion technology that is less reliant on monolithic integration. We successfully fabricated a trap with a large area of oxide removed, resulting in a region thinned to about 40 µm, a key milestone toward successful integration.
Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.
The evolution of the thermal design of the Apollo lunar surface experiments package central station from the basic concept to the final flight hardware is discussed, including results of development, prototype, and qualification tests that were used to verify that the flight hardware would operate adequately on the lunar surface. In addition, brief discussions of the thermal design of experiments included in the experiments package are presented. The flight thermal performance is compared with analytical results and thermal-vacuum test results, and design modifications for future lunar surface experiment packages are presented.
Flat conductor cable (FCC) is relatively new, highly promising means for electrical packaging and system integration. FCC offers numerous desirable traits (weight, volume and cost savings, flexibility, high reliability, predictable and repeatable electrical characteristics) which make it extremely attractive as a packaging medium. FCC, today, finds wide application in everything from integration of lunar equipment to the packaging of electronics in nuclear submarines. Described are cable construction and means of termination, applicable specifications and standards, and total FCC systems. A list of additional sources of data is also included for more intensive study.
For optimal packaging of equipment in shallow-cone vehicle toroidal packaging sets center of gravity of equipment forward. Packages are supported on rings within probe structure to provide low center of gravity. System permits interchanging of units for balance control, so minimum of lateral ballast is required.
The relative penalties associated with various techniques for providing an onboard cold environment for storage of perishable food items, and for the development of packaging and vehicle stowage parameters were investigated in terms of the overall food system design analysis of space shuttle. The degrees of capability for maintaining both a 40 F to 45 F refrigerated temperature and a 0 F and 20 F frozen environment were assessed for the following cooling techniques: (1) phase change (heat sink) concept; (2) thermoelectric concept; (3) vapor cycle concept; and (4) expendable ammonia concept. The parameters considered in the analysis were weight, volume, and spacecraft power restrictions. Data were also produced for packaging and vehicle stowage parameters which are compatible with vehicle weight and volume specifications. Certain assumptions were made for food packaging sizes based on previously generated space shuttle menus. The results of the study are shown, along with the range of meal choices considered.
The use of solar electric propulsion (SEP) for spacecraft primary propulsion imposes an extreme range of operational and environmental design requirements associated with the diversity of missions for which solar electric primary propulsion is advantageous. One SEP element which is particularly sensitive to these environmental extremes is the power processor unit (PPU) which powers and controls the electric ion thruster. An improved power processor thermal-mechanical packaging approach, referred to as dual shear plate packaging, has been designed to accommodate these different requirements with minimum change to the power processor design. Details of this packaging design are presented together with test results obtained from thermal-vacuum and structural-vibration tests conducted with prototype hardware.
The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.
Tasks ranging from quick simple plot (which requires only one call to package) to highly sophisticated plots (including motion picture plots) easily generated with basic knowledge of FORTRAN and plot commands. Designers preparing software system that requires plotted output will find this package offers many advantages over standard hardware support packages available.
Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.
Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
The three axis low-g accelerometer package designed for use on the Space Processing Application Rocket (SPAR) Program is described. The package consists of the following major sections: (1) three Kearfott model 2412 accelerometers mounted in an orthogonal triad configuration on a temperature controlled, thermally isolated cube, (2) the accelerometer servoelectronics (printed circuit cards PC-6 through PC-12), and (3) the signal conditioner (printed circuit cards PC-15 and PC-16). The measurement range is 0 + or - 0.031 g with a quantization of 1.1 x 10 to the 7th power g. The package was flown successfully on six SPAR launches with the Black Brant booster. These flights provide approximately 300 s of free fall or zero-g environment.
The changes, modifications, and inclusions which were adapted to the current version of the MINIVER program are discussed. Extensive modifications were made to various subroutines, and a new plot package added. This plot package is the Johnson Space Center DISSPLA Graphics System currently driven under an 1110 EXEC 8 configuration. User instructions on executing the MINIVER program are provided and the plot package is described.
The software package evaluation was designed to analyze commercially available, field-proven, production control or manufacturing resource planning management technology and software package. The analysis was conducted by comparing SRB production control software requirements and conceptual system design to software package capabilities. The methodology of evaluation and the findings at each stage of evaluation are described. Topics covered include: vendor listing; request for information (RFI) document; RFI response rate and quality; RFI evaluation process; and capabilities versus requirements.
A software package was developed for use with micro and minicomputers, particularly the LSI-11/DPD-11 series. The package has a number of Fortran-callable subroutines which perform a variety of frequently needed tasks for biomedical applications. All routines are well documented, flexible, easy to use and modify, and require minimal programmer knowledge of peripheral hardware. The package is also economical of memory and CPU time. A single subroutine call can perform any one of the following functions: (1) plot an array of integer values from sampled A/D data, (2) plot an array of Y values versus an array of X values; (3) draw horizontal and/or vertical grid lines of selectable type; (4) annotate grid lines with user units; (5) get coordinates of user controlled crosshairs from the terminal for interactive graphics; (6) sample any analog channel with program selectable gain; (7) wait a specified time interval, and (8) perform random access I/O of one or more blocks of a sequential disk file. Several miscellaneous functions are also provided.