SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Quality assurance provisions cover personnel training, radiographic equipment, radiographic test procedures, and inspection and examination of radiographs. Supplementary information includes accept and reject criteria for radiographic inspection of resistors, capacitors, transistors, hybrid microcircuits, diodes, small coils and transformers.
Beam lead technology for microcircuit interconnections with applications to metallization, passivation, and bonding
Interrelations between advanced processing techniques, integrated circuits, laser radiation, and microcircuit interconnections
MOS transistors and bipolar microcircuits mobile charge density, observing p-n junction effects
The results are presented of a comprehensive study and evaluation for the bonding of flip chip and beam leaded devices onto hybrid microcircuit substrates used in high reliability space applications. The program included the evaluation of aluminum flip chips, solder (silver/tin) bump chips, gold beam leaded devices, and aluminum beam leaded devices.
A handbook is presented which was designed to accompany an oral presentation on the effects of radiation on the outer planets grand tour (OPGT). A summary of OPGT radiation environments expected from natural sources and the radioisotope thermoelectric generators and basic radiation effects and processes are reviewed, and ionization and displacement effects are examined. The presentation summarizes the effects of radiation on miscellaneous spacecraft materials and devices. The annealing and hardening of electronics are described. Special emphasis is placed on microcircuits. Mathematical modeling of circuits affected by radiation and radiation environmental testing are discussed. A review of means of evaluating the performance and correcting failures of irradiated devices is also presented.
The purpose of this paper is to illustrate the failure mode caused by thermal deformation and how thermal deformation affects bond integrity. Wege bonding in small-signal transistors, microcircuits and LSI circuits is the subject of this work. Repeated switching of the devices between high and low power at a rate that allows thermal expansion and contraction in the interconnecting wire causes the wire to flex at the point of reduced cross-sectional area until finally the wire breaks due to metal fatigue. It was observed that the thermal deformation was related to many factors such as device power dissipation, current density in the wire, wi *e dress and length, thermal time constant and frequency of operation.
The current reliability problems related to electronic components and microcircuits are presented in this paper. Specific process controls, design, materials, application constraints, destructive testing, electrical tests, and procedures for implementation are recommended to improve the reliability of selected electronic components.
Both in practical engineering and in control of muscular systems, low level subsystems automatically provide crude approximations to the proper response. Through low level tuning of these approximations, the proper response variant can emerge from standardized high level commands. Such systems are expressly suited to emerging large scale integrated circuit technology. A computer, using symbolic descriptions of subsystem responses, can select and shape responses of low level digital or analog microcircuits. A mathematical theory that reveals significant informational units in this style of control and software for realizing such information structures are formulated.
The field of integrated optics is surveyed. Light coupling into films, modulation of light propagating in films, and current integrated optics developments and devices are discussed. It is concluded that integrated optics technology is expected to revolutionize the electronics industry as completely as did microcircuit technology. An extensive bibliography for the field of integrated optics is included.
In the assembly of hybrid microcircuits, passive and active discrete chip components are attached by epoxy cements and by solders. This study was initiated to determine the integrity of such attachments. Alumina substrates were subjected to a group of thermal and mechanical test environments defined by test methods in MIL-STD-883. Lot samples of substrates with assembly variations were subjected to separately applied testing and to serial testing. These test methods were applied sequentially to the same lot of substrates. Epoxy cements were generally satisfactory with respect to separate tests, although sequential tests severely degraded epoxy bond strengths of all types. Bond strengths to unglazed substrates were slightly superior to those of the same components on glazed types. Solder joints were vulnerable to catastrophic failure in several environments, especially temperature cycling and thermal shock. Vibration and impact shock also produced solder joint failures.
The need for remotely controlled manipulators and explorers, coupled with emerging large-scale integrated (LSI) circuit technology, foreshadow the dominant role of a style of hybrid control. Systems having many degrees of freedom should be guided and regulated by controllers to which commands are given in purpose-oriented form, to be converted into appropriate machine-oriented signals to effectors for achieving the purpose. In particular, numerical tabulations of functions should be replaced by low-level analog microcircuit realizations of the functions, particularly when feedback can keep errors from piling up. The study is concerned with new problems and organizations that arise in attempting to exploit obvious principles to the fullest degree.
Ten classes of parts covered in report: capacitors, crystals, diodes, fuses, inductors, microcircuits, relays, fixed resistors, transformers, and transistors. Each class is contained in separate section and includes discussion of inherent failure modes, screening rationale, general screening requirements, derating criteria, and stress-analysis data.
Developments in spacecraft technology are discussed with emphasis on the Explorer satellite program. The subjects considered include the following: (1) nutational behavior of the Explorer-45 satellite, (2) panoramic sensor development, (3) onboard camera signal processor for Explorer satellites, and (4) microcircuit development. Information on the zero gravity testing of heat pipes is included. Procedures for cleaning heat treated aluminum heat pipes are explained. The development of a five-year magnetic tape, an accurate incremental angular encoder, and a blood freezing apparatus for leukemia research are also discussed.
The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.
A research program was conducted to further the professional knowledge of qualified engineering and science faculty members, to stimulate an exchange of ideas between participants and NASA engineers and scientists, and to enrich the research activities of the participants' institutions. Abstracts of reports submitted at the end of the program are presented. Topics investigated include multispectral photography, logic circuits, gravitation theories, information systems, fracture mechanics, holographic interferometry, surface acoustic wave technology, ion beams in the upper atmosphere, and hybrid microcircuits.
Report discusses number of tests used in comparing polymer adhesives with metal bonding processes and includes charts and photographs to illustrate test results. Findings suggest reduced quality control costs when epoxies are used in fabrication of microcircuits.
Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.