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NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.
Information compiled on the shock and vibration environment encountered by items and equipment during shipment shows the distribution of drop heights for particular packages, distribution systems, and handling operations. Applications of the data to typical package design problems are discussed.
Lightweight battery-package provides for even cooling of individual alkaline cells, constraint against cell expansion, and convenient placement of cells. The battery package also provides for venting of the cells and includes instrumentation to measure cell temperature, pressure, and voltage.
Parts are securely held on sealed, printed circuit board that is both package and test fixture. Parts can be handled, stored, and tested in sealed package.
Semiconductor package has been developed for high power semiconductor devices that operate in the GHz-frequency range at several watts. Package includes stud, insulating ring, electrically conductive washer, insulating washer, braze ring, and cap. It is mechanically strong and can be used with variety of circuits.
The design and characteristics of the scientific instrument package for the Large Space Telescope are discussed. The subjects include: (1) general scientific objectives, (2) package system analysis, (3) scientific instrumentation, (4) imaging photoelectric sensors, (5) environmental considerations, and (6) reliability and maintainability.
The current design and hardware components of the patented 14 sqm Stokes flow parachute are described. The Stokes-flow parachute is a canopy of open mesh material, which is kept deployed by braces. Because of the light weight of its mesh material, and the high drag on its mesh elements when they operate in the Stokes-flow flight regime, this parachute has an extremely low ballistic coefficient. It provides a stable aerodynamic platform superior to conventional nonporous billowed parachutes, is exceptionally packable, and is easily contained within the canister of the Sidewinder Arcas or the RDT and E rockets. Thus, it offers the potential for gathering more meteorological data, especially at high altitudes, than conventional billowed parachutes. Methods for packaging the parachute are also recommended. These methods include schemes for folding the canopy and for automatically releasing the pressurizing fluid as the packaged parachute unfolds.
The effects of two types of control-system nonlinearities, sensor deadband and actuator breakout torque, on the pointing capability of a Apollo Telescope Mount (ATM) double-gimbal experiment isolation and control system are investigated. A composite structural model of a flexible experiment package connected through frictionless double gimbals to a flexible carrier vehicle is used for this investigation. Contributions of the primary carrier control system to experiment pointing are neglected. Pointing errors onboard the experiment package due to random crew-motion input into the carrier vehicle are computed. A stability investigation is performed to verify control-system stability with nominal nonlinearities and gains. Indications are that there is no stability problem due to the nonlinearities. A nonlinearity sensitivity study is carried out to determine the effects on pointing accuracy. Its results indicate that nominal ATM control system nonlinearities limit the pointing accuracy to approximately 0.4 arc second in the presence of crew motion. Methods of reducing the error to less than 0.1 arc second are discussed.
A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.
An optimum feeding system for the space shuttle was presented. This system consisted of all rehydratable type foods which were enclosed in a 4 in. x 4 in. x 1 in. flexible package. A feasibility follow-on study was conducted, and two acceptable, feasible prototypes for this package are described.
The package considered is intended for the channel electron multiplier (CEM) detectors which are to be used for the extreme ultraviolet telescope and helium glow detector instruments of the Apollo-Soyuz test project. In the package design selected, the cone of the CEM is supported at the front end by a silicone rubber ring which is molded in place and self-bonded to both the cone and the housing wall. The helix is supported and insulated from the housing by a fiber glass sleeve which is bonded to the inside of the housing.
Materials are presented for assisting instructors in teaching the LARSYS Educational Package, which is a set of instructional materials to train people to analyze remotely sensed multispectral data. The seven units of the package are described. These units are: quantitative remote sensing, overview of the LARSYS software system, the 2780 remote terminal, demonstration of LARSYS on the 2780 remote terminal, exercises, guide to multispectral data analysis, and a case study using LARSYS for analysis of LANDSAT data.
An interactive graphics software package which allows users to display the non-zero structure of large sparse symmetric materials was described and methods used to implement it as a portable FORTRAN callable subroutine were summarized. In particular, the system permits the display of the resulting matrix after reordering the rows and columns, with the reordering scheme either defined by the user or automatically generated by the program with the aim of reducing matrix bandwidth and profile. Although the primary application of the package has been to the finite element analysis of structures, it is equally well suited to the many other areas of engineering and science which use sparse matrices.
A valve opening-response problem encountered during development of a control valve for the Skylab thruster attitude control system (TACS) is described. The problem involved effects of dynamic interaction among valves in the quad-redundant valve package. Also described is a detailed computer simulation of the quad-valve package which was helpful in resolving the problem.
A detailed description of a video system for controlling space shuttle payloads and experiments is presented in the preliminary design review and critical design review, first and second engineering design reports respectively, and in the final report submitted jointly with the design package. The material contained in the four subsequent sections of the package contains system descriptions, design data, and specifications for the recommended 2-view system. Section 2 contains diagrams relating to the simulation test configuration of the 2-view system. Section 3 contains descriptions and drawings of the deliverable breadboard equipment. A description of the recommended system is contained in Section 4 with equipment specifications in Section 5.