Mass spectrometric studies at high temperatures. IX - The sublimation pressure of copper /II/ fluoride.
Sublimation pressure of copper fluoride measured via mass spectrometry, noting dissociation energy
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Sublimation pressure of copper fluoride measured via mass spectrometry, noting dissociation energy
Friction of copper-aluminum alloys related to decreasing stacking-fault energy
Friction characteristics and interfacial recrystallization of single-crystal and polycrystalline copper sliding on aluminum oxide
Mechanical testing and metallographic examination of aluminum to copper coldwelded joints after thermal exposure - SNAP-8 electrical terminal
Axial load fatigue endurance distributions of annealed oxygen free high conductivity copper specimens with cold worked surface layer tested at four stress levels
Stress rupture and creep properties analyzed in tungsten fiber reinforced copper composites
Recovery of deformed copper-palladium and gold- palladium alloys by isothermal and isochronal annealing, noting vacancy and interstitial migration
Yield and angular distribution of cesium ion- sputtered copper, noting dependence on angle of incidence, target temperature and energy
Thermionic work functions and electron emission S curves for contaminated copper surface in oxygen and cesium vapors, separate and mixed
For a simple diffraction pattern, the time required to calculate interplanar distances from measurements of the pattern is not excessive. If more than a few lines are present, however, or if several patterns are to be studied, it is very advantageous to have available a table giving interplanar spacings directly in terms of the linear measurements made on the film of the lines appearing on the diffraction pattern. The preparation of the table given here was undertaken when the expansion of research activities involving X-ray diffraction techniques indicated that such a table would greatly decrease the time required to analyze diffraction patterns. The table was prepared for use with K alpha(sub 1) radiation from the following target materials: molybdenum, copper, cobalt, iron, and chromium.
The NASA Electronic Parts and Packaging Program co-manager, requested the NASA Engineering and Safety Center (NESC) to compile a body of publicly available knowledge on copper (Cu) wire bonds and perform reliability testing and analysis on these bonds, including environment tests, sample destructive physical analysis, and bond pull/shear tests during environment test intervals. The goal was to understand the risks of using Cu wire bonds for space applications and develop guidelines on Cu bond pull/shear limits for NASA applications. This document contains the results of the NESC assessment.
Electric arc air heater with magnetic diffusion and water cooled copper electrodes
Explorer XIII satellite - copper-wire-card micrometeoroid detectors
Solar absorptance and thermal emittance of copper, gold, nickel and silver as function of temperature
Thermal path prevents voids and discontinuities which make heat sinks in electronic equipment inefficient. The thermal path combines the high thermal conductivity of copper with the resiliency of silicone rubber.
High permeability, soft magnetic rings are placed on both sides of electron beam weld seams in copper-Monel circular joint. This eliminates deflection of the electron beam caused by magnetic fields present in the weld area.
Copper wire for electrical harnesses, when plated with both nickel and silver, resists galvanic corrosion and high temperatures while maintaining electrical properties and solderability.
Acrylic enamel spray containing metallic copper pigment lubricates refractory metal tubing during cold drawing operations so that the tubing surface remains free from scratches and nicks and does not seize in the die. Zirconium alloys, zirconium, tantalum alloys, niobium alloys, vanandium alloys and titanium alloys have been drawn using this lubricant.