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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

High-Precision Low-Cost Micro Birdbath Resonating Gyroscope (CRADA Final Report)

As part of the Cyclotron Road program, Enertia Microsystems Inc. (EMI) investigated a high-performance micro mechanical resonator called the micro birdbath resonator and a high-precision micro electromechanical systems (MEMS) gyroscope called the birdbath resonator gyroscope (BRG). The BRG is a novel fused-silica MEMS gyroscope. The BRG can obtain significantly greater accuracy, comparable size, and comparable cost with MEMS gyroscopes made of silicon that are currently on the market.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

Editorial: Deep-sea observation equipment and exploration technology

The increasing interest in deep-sea exploration is a crucial catalyst for driving advancements in deep-sea observation technology research. Numerous sophisticated sensors have been developed to facilitate comprehensive studies in deep-sea physics, chemistry, and geology. For example, cutting-edge small and compact seabed samplers are now employed on various platforms, such as Autonomous Underwater Vehicles (AUVs), Remotely Operated Vehicles (ROVs), and Human-Operated Vehicles (HOVs), enabling observation of the hadal zone. Additionally, Micro-electromechanical systems (MEMS) sensors are routinely utilized for ocean wave observation. This Research Topic aims to foster new insights into ocean exploration and observation technology, including ocean sensor technology, ocean observation platforms, and ocean observation reliability technology.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Vertical and Lateral Etch Survey of Ferroelectric AlN/Al 1-x Sc x N in Aqueous KOH Solutions

Due to their favorable electromechanical properties, such as high sound velocity, low dielectric permittivity and high electromechanical coupling, Aluminum Nitride (AlN) and Aluminum Scandium Nitride (Al 1-x Sc x N) thin films have achieved widespread application in radio frequency (RF) acoustic devices. The resistance to etching at high scandium alloying, however, has inhibited the realization of devices able to exploit the highest electromechanical coupling coefficients. In this work, we investigated the vertical and lateral etch rates of sputtered AlN and Al 1-x Sc x N with Sc concentration x ranging from 0 to 0.42 in aqueous potassium hydroxide (KOH). Etch rates and the sidewall angles were reported at different temperatures and KOH concentrations. We found that the trends of the etch rate were unanimous: while the vertical etch rate decreases with increasing Sc alloying, the lateral etch rate exhibits a V-shaped transition with a minimum etch rate at x = 0.125. By performing an etch on an 800 nm thick Al 0.875 Sc 0.125 N film with 10 wt% KOH at 65 °C for 20 min, a vertical sidewall was formed by exploiting the ratio of the {$10\overline{11}$ planes and {$1\overline{1}00$ planes etch rates. This method does not require preliminary processing and is potentially beneficial for the fabrication of lamb wave resonators (LWRs) or other microelectromechanical systems (MEMS) structures, laser mirrors and Ultraviolet Light-Emitting Diodes (UV-LEDs). It was demonstrated that the sidewall angle tracks the trajectory that follows the {$\overline{1}2\overline{12}$ of the hexagonal crystal structure when different c/a ratios were considered for elevated Sc alloying levels, which may be used as a convenient tool for structure/composition analysis.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

A Threshold Helium Leakage Detection Switch with Ultra Low Power Operation

Detecting helium leakage is important in many applications, such as in dry cask nuclear waste storage systems. This work develops a helium detection system based on the relative permittivity (dielectric constant) difference between air and helium. This difference changes the status of an electrostatic microelectromechanical system (MEMS) switch. The switch is a capacitive-based device and requires a very negligible amount of power. Exciting the switch’s electrical resonance enhances the MEMS switch sensitivity to detect low helium concentration. This work simulates two different MEMS switch configurations: a cantilever-based MEMS modeled as a single-degree-freedom model and a clamped-clamped beam MEMS molded using the COMSOL Multiphysics finite-element software. While both configurations demonstrate the switch’s simple operation concept, the clamped-clamped beam was selected for detailed parametric characterization due to its comprehensive modeling approach. The beam detects at least 5% helium concentration levels when excited at 3.8 MHz, near electrical resonance. The switch performance decreases at lower excitation frequencies or increases the circuit resistance. The MEMS sensor detection level was relatively immune to beam thickness and parasitic capacitance changes. However, higher parasitic capacitance increases the switch’s susceptibility to errors, fluctuations, and uncertainties.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
DOE OSTI2021

An Acoustic Quench Detection Method for CICC Conductor Operating in Gas or Liquid

A method using micro-electro-mechanical system (MEMS) acoustic sensor technology to detect a quench and abnormal behavior of a superconductor is discussed. MEMS of microphone chips are installed along the coolant space of a superconducting conductor to monitor the coolant condition. By arranging the acoustic sensor array in a coolant flow channel, it is possible to quickly detect a change in the local condition of the coolant with precise spatial resolution. This method is useful for monitoring superconducting magnets and power cables, especially those made with a cable-in-conduit-conductor (CICC) configuration. The methodology described in this work will also be very useful for a high temperature superconducting (HTS) conductor, such as REBCO tape conductors.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
NASA NTRS1993

Advanced microfabrication technologies for microspacecraft

Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecraft through the use of lighter and stronger materials in conjunction with new mechanical/structural design concepts and design optimization methods. At the same time, electronic components have been scaled down while increasing functional utility. A two-fold benefit is derived for space applications through the use of less expensive components and the lower launch costs associated with lighter components. GE-CRD is actively pursuing research in these key technologies for a wide range of applications including satellites. These key technologies will be reviewed and an update on GE progress will be given. The need to reduce weight and lower cost, while maintaining product quality and reliability are primary drivers in the design of satellites, in general, and microsatellites in particular. For the structural subsystem, these requirements pose a complex design problem unless new mechanical design concepts and computer-aided design optimization methods are employed. Several new concepts, such as battery packs doubling as panel reinforcements and fuel tanks as integral structural members, need to utilized. In addition, new viscoelastic material damping concepts for spacecraft components provide for lighter weight/lower cost designs, while satisfying the structural dynamics requirements. High density interconnect (HDI) technology permits the use of bare IC's on a ceramic substrate with 90 percent active area utilization. A copper/polyimide multilayer structure is the backbone of the technology, which has demonstrated a size/weight reduction of greater than 10x compared to printed circuit board with performance up to the GHz level. HDI modules have exceptional mechanical robustness as evidenced by survival of 180 kg rapid acceleration tests. Microelectromechanical systems (MEMS) are redefining sensors and actuators by miniaturization through micromachining techniques. Sharing many fabrication steps with HDI, we have developed a new technique for surface micromachining of copper/polyimide structures using computer-aided laser patterning.

Ghezzo, M.↗
NASA NTRS1995

Silicon Satellites: Picosats, Nanosats, and Microsats

Silicon, the most abundant solid element in the Earth's lithosphere, is a useful material for spacecraft construction. Silicon is stronger than stainless steel, has a thermal conductivity about half that of aluminum, is transparent to much of the infrared radiation spectrum, and can form a stable oxide. These unique properties enable silicon to become most of the mass of a satellite, it can simultaneously function as structure, heat transfer system, radiation shield, optics, and semiconductor substrate. Semiconductor batch-fabrication techniques can produce low-power digital circuits, low-power analog circuits, silicon-based radio frequency circuits, and micro-electromechanical systems (MEMS) such as thrusters and acceleration sensors on silicon substrates. By exploiting these fabrication techniques, it is possible to produce highly-integrated satellites for a number of applications. This paper analyzes the limitations of silicon satellites due to size. Picosatellites (approximately 1 gram mass), nanosatellites (about 1 kg mass), and highly capable microsatellites (about 10 kg mass) can perform various missions with lifetimes of a few days to greater than a decade.

Janson, Siegfried W.↗
NASA NTRS1995

Micromechanical Switches on GaAs for Microwave Applications

In this presentation, we describe the fabrication of micro-electro-mechanical system (MEMS) devices, in particular, of low-frequency multi-element electrical switches using SiO2 cantilevers. The switches discussed are related to micromechanical membrane structures used to perform switching of optical signals on silicon substrates. These switches use a thin metal membrane which is actuated by an electrostatic potential, causing the switch to make or break contact. The advantages include: superior isolation, high power handling capabilities, high radiation hardening, very low power operations, and the ability to integrate onto GaAs monolithic microwave integrated circuit (MMIC) chips.

Randall, John N.↗
NASA NTRS1995

PZT Thin Film Piezoelectric Traveling Wave Motor

With the development of micro-electro-mechanical systems (MEMS), its various applications are attracting more and more attention. Among MEMS, micro motors, electrostatic and electromagnetic, are the typical and important ones. As an alternative approach, the piezoelectric traveling wave micro motor, based on thin film material and integrated circuit technologies, circumvents many of the drawbacks of the above mentioned two types of motors and displays distinct advantages. In this paper we report on a lead-zirconate-titanate (PZT) piezoelectric thin film traveling wave motor. The PZT film with a thickness of 150 micrometers and a diameter of 8 mm was first deposited onto a metal substrate as the stator material. Then, eight sections were patterned to form the stator electrodes. The rotor had an 8 kHz frequency power supply. The rotation speed of the motor is 100 rpm. The relationship of the friction between the stator and the rotor and the structure of the rotor on rotation were also studied.

Shen, Dexin↗
NASA NTRS1995

High-Performance electronics at ultra-low power consumption for space applications: From superconductor to nanoscale semiconductor technology

A detailed review of Sandia's work in ultralow power dissipation electronics for space flight applications, including superconductive electronics, new advances in quantum well structures, and ultra-high purity 3-5 materials, and recent advances in micro-electro-optical-mechanical systems (MEMS) is presented. The superconductive electronics and micromechanical devices are well suited for application in micro-robotics, micro-rocket engines, and advanced sensors.

Duncan, Robert V.↗
NASA NTRS1996

Microelectromechanical Systems for Aerodynamics Applications

Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight

Mehregany, Mehran↗
NASA NTRS1998

Propulsion Options for Primary Thrust and Attitude Control of Microspacecraft

Order of magnitude decreases in the size of scientific satellites and spacecraft could provide concurrent decreases in mission costs because of lower launch and fabrication costs. Although many subsystems are amenable to dramatic size reductions, miniaturization of the propulsion subsystems is not straightforward. There are a range of requirements for both primary and attitude control propulsion, dictated by mission requirements, satellite size, and power restrictions. Many of the established propulsion technologies can not currently be applied to microspacecraft. Because of this, micro-electromechanical systems (MEMS) fabrication technology is being explored as a path for miniaturization.

deGroot, W. A.↗
NASA NTRS1998

Microfabricated Chemical Sensors for Safety and Emission Control Applications

Chemical sensor technology is being developed for leak detection, emission monitoring, and fire safety applications. The development of these sensors is based on progress in two types of technology: 1) Micromachining and microfabrication (MicroElectroMechanical Systems (MEMS)-based) technology to fabricate miniaturized sensors. 2) The development of high temperature semiconductors, especially silicon carbide. Using these technologies, sensors to measure hydrogen, hydrocarbons, nitrogen oxides, carbon monoxide, oxygen, and carbon dioxide are being developed. A description is given of each sensor type and its present stage of development. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, G. W.↗
NASA NTRS1998

Advanced Exploration Technologies: Micro and Nano Technologies Enabling Space Missions in the 21st Century

Some of the many new and advanced exploration technologies which will enable space missions in the 21st century and specifically the Manned Mars Mission are explored in this presentation. Some of these are the system on a chip, the Computed-Tomography imaging Spectrometer, the digital camera on a chip, and other Micro Electro Mechanical Systems (MEMS) technology for space. Some of these MEMS are the silicon micromachined microgyroscope, a subliming solid micro-thruster, a micro-ion thruster, a silicon seismometer, a dewpoint microhygrometer, a micro laser doppler anemometer, and tunable diode laser (TDL) sensors. The advanced technology insertion is critical for NASA to decrease mass, volume, power and mission costs, and increase functionality, science potential and robustness.

Krabach, Timothy↗
NASA NTRS1999

STS-93 Post Flight Presentation

An overview of Flight STS-93 is presented. The primary objective of the STS-93 mission was to deploy the Advanced X-Ray Astrophysics Facility (AXAF), also known as the Chandra X-ray Observatory. The mission flew on the Columbia Shuttle, on July 22, 1999. This facility is the most sophisticated X-ray observatory ever built. Other payloads on STS-93 were: (1) the Midcourse Space Experiment (MSX), (2) Shuttle Ionospheric Modification with Pulsed Local Exhaust (SIMPLEX), (3) Southwest Ultraviolet Imaging System (SWUIS), (4) Gelation of Sols: Applied Microgravity Research (GOSAMR), Space Tissue Loss-B (STL-B), (5) Light Weight Flexible Solar Array Hinge (LFSAH), (6) Cell Culture Module (CCM), and (7) the Shuttle Amateur Radio Experiment-II (SAREX-II), (8) EarthKam, (9) Plant Growth Investigations in Microgravity (PGIM), (10) Commercial Generic Bioprocessing Apparatus (CGBA), (11) Micro-Electrical Mechanical System (MEMS), and (12) the Biological Research in Canisters (BRIC). The crew was: Eileen M. Collins, Mission Commander, the first female shuttle commander; Jeffrey S. Ashby, Pilot; Steven A. Hawley , Mission Specialist; Catherine G. Coleman, Mission Specialist; Michel Tognini (CNES), Mission Specialist. The video contains views of life aboard the space shuttle. This mission featured both a night launching and a night landing at the Kennedy Space Center.

Source record↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS2000

Effects of Radiation on the Mechanical Properties of Polysilicon and Polydiamond thin Film

Due to its many excellent properties, diamond is being explored as a material for MicroElectroMechanical Systems (MEMS). However, as is true in the case of silicon, a large amount of basic material characterization issues still warrant investigation. This paper presents preliminary results from charged particle irradiation of Chemical Vapor Deposited (CVD) polycrystalline diamond films. The films were simultaneously dosed to a level of 9.4 x l0(exp 13)/sq cm using 700 keV protons and 1 MeV electrons. The samples were then subject to cross-sectional nanoindention analysis and Raman spectroscopy. Polycrystalline silicon was also investigated for comparison purposes. The diamond was unaffected by the irradiation. However, the silicon did indicate a slight decrease in the Young's Modulus.

Newton, Robert L.↗
NASA NTRS2001

Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications

In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).

Simons, Rainee N.↗