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This letter reports the performance of a novel single-stage W-band amplifier fabricated utilizing flip-chip bump-bonding. We have bump-bonded a high-speed, low-noise InP high electron mobility transistor (HEMT) device onto a separately fabricated passive circuit having a GaAs substrate.
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In this paper, we present an overview of high frequency Monolithic Millimeter-wave Integrated Circuit (MMIC) amplifiers and discuss the state of the art for low noise amplifiers and power amplifiers.
We present results on an InP monolithic millimeter- wave integrated circuit (MMIC) amplifier having 10-dB gain at 235 GHz. We designed this circuit and fabricated the chip in Northrop Grumman Space Technology's (NGST) 0.07- m InP high electron mobility transistor (HEMT) process. Using a WR3 (220-325 GHz) waveguide vector network analyzer system interfaced to waveguide wafer probes, we measured this chip on-wafer for -parameters. To our knowledge, this is the first time a WR3 waveguide on-wafer measurement system has been used to measure gain in a MMIC amplifier above 230 GHz.
This viewgraph presentation surveys the fastest Monolithic Millimeter-wave Integrated Circuit (MMIC) amplifiers to date; summarize previous solid state power amp results to date; reviews examples of MMICs, reviews Power vs. Gate periphery and frequency; Summarizes previous LNA results to date; reviews Noise figure results and trends toward higher frequency
We have developed and demonstrated miniature 180 GHz Monolithic Microwave Integrated Circuit (MMIC) radiometer modules that have low noise temperature, low mass and low power consumption. These modules will enable the Geostationary Synthetic Thinned Aperture Radiometer (GeoSTAR) of the Precipitation and All-weather Temperature and Humidity (PATH) Mission for atmospheric temperature and humidity profiling. The GeoSTAR instrument has an array of hundreds of receivers. Technology that was developed included Indium Phosphide (InP) MMIC Low Noise Amplifiers (LNAs) and second harmonic MMIC mixers and I-Q mixers, surface mount Multi-Chip Module (MCM) packages at 180 GHz, and interferometric array at 180 GHz. A complete MMIC chip set for the 180 GHz receiver modules (LNAs and I-Q Second harmonic mixer) was developed. The MMIC LNAs had more than 50% lower noise temperature (NT=300K) than previous state-of-art and MMIC I-Q mixers demonstrated low LO power (3 dBm). Two lots of MMIC wafers were processed with very high DC transconductance of up to 2800 mS/mm for the 35 nm gate length devices. Based on these MMICs a 180 GHz Multichip Module was developed that had a factor of 100 lower mass/volume (16x18x4.5 mm3, 3g) than previous generation 180 GHz receivers.
This article presents a new algorithmic framework for multilayer inversion of the dense media radiative transfer (DMRT) equations of snowpack emission, with particular emphasis on the role of high-frequency microwave channels above 60 GHz. The approach relies on dictionary matching and locally constrained least squares. The results demonstrate that the algorithm can invert the DMRT model and retrieve depth, density, and grain size of a single-layer snowpack when dependencies of density and grain size on depth are properly accounted for. However, as the number of layers increases, the sensitivity of the inversion to observation noise grows markedly. Using observations, over the Great Plains in the United States, from the microwave imager onboard the global precipitation measurement (GPM, 10-166 GHz) core satellite, the initial results demonstrate that under a clear-sky condition and no vegetation canopy, the algorithm is capable to retrieve the snow depth and water equivalent of seasonal snow with a mean absolute error (MAE) of less than 0.15 m--when compared to the high-resolution analysis data from the SNOw Data Assimilation System (SNODAS).