Fast multipliers
Parallel multiplier design with carry-save scheme and constructed from series integrated circuits, discussing speed, complexity and cost
Habibi, A.↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Economical custom LSI arrays
Automatic design technique uses standard circuit cells for producing large-scale integrated arrays. Computerized fabrication process provides individual cells of high density and efficiency, quick turnaround time, low cost, and ease of corrections for changes and errors.
Feller, A.↗
Battery peak-charge voltage monitor
Monitor was designed for use on dual air density satellite, utilizing standard integrated circuit components, thin-film resistors network, plus several passive components. Device measures unit charge and holds data for transmission at later time.
Shull, T. A.↗
Spread Of Charge From Ion Tracks In Integrated Circuits
Single-event upsets (SEU's) propagate to adjacent cells in integrated memory circuits. Findings of experiments in lateral transport of electrical-charge carriers from ion tracks in 256K dynamic randon-access memories (DRAM's). As dimensions of integrated circuits decrease, vulnerability to SEU's increases. Understanding gained enables design of less vulnerable circuits.
Zoutendyk, John A.↗
Improved Writing-Conductor Designs For Magnetic Memory
Writing currents reduced to practical levels. Improved conceptual designs for writing conductors in micromagnet/Hall-effect random-access integrated-circuit memory reduces electrical current needed to magnetize micromagnet in each memory cell. Basic concept of micromagnet/Hall-effect random-access memory presented in "Magnetic Analog Random-Access Memory" (NPO-17999).
Wu, Jiin-Chuan↗
Architecture and implementation considerations of a high-speed Viterbi decoder for a Reed-Muller subcode
The (64, 40, 8) subcode of the third-order Reed-Muller (RM) code for high-speed satellite communications is proposed. The RM subcode can be used either alone or as an inner code of a concatenated coding system with the NASA standard (255, 233, 33) Reed-Solomon (RS) code as the outer code to achieve high performance (or low bit-error rate) with reduced decoding complexity. It can also be used as a component code in a multilevel bandwidth efficient coded modulation system to achieve reliable bandwidth efficient data transmission. The progress made toward achieving the goal of implementing a decoder system based upon this code is summarized. The development of the integrated circuit prototype sub-trellis IC, particularly focusing on the design methodology, is addressed.
Lin, Shu↗
Testing self-timed circuits using scan paths
Testing is an essential part of any digital system design and one that can be made much easier if testing is considered during the design process rather than after the system is complete. There are a number of techniques for integrating testability into system design, but many of these traditional testing methods used for synchronous circuits are not directly applicable to non-clocked asynchronous circuits. As a result, many asynchronous circuits do not employ design for testability techniques. A method of using the familiar model of scan paths modified to test self-timed systems are presented. Specifically, circuits designed using a library of self-timed modules to assemble systems with two-phase transition control and bundled data paths are considered. The method involves modifying these self-timed modules such that circuits designed from them have a built-in scan path.
Khoche, Ajay↗
High performance VLSI telemetry data systems
NASA's deployment of major space complexes such as Space Station Freedom (SSF) and the Earth Observing System (EOS) will demand increased functionality and performance from ground based telemetry acquisition systems well above current system capabilities. Adaptation of space telemetry data transport and processing standards such as those specified by the Consultative Committee for Space Data Systems (CCSDS) standards and those required for commercial ground distribution of telemetry data, will drive these functional and performance requirements. In addition, budget limitations will force the requirement for higher modularity, flexibility, and interchangeability at lower cost in new ground telemetry data system elements. At NASA's Goddard Space Flight Center (GSFC), the design and development of generic ground telemetry data system elements, over the last five years, has resulted in significant solutions to these problems. This solution, referred to as the functional components approach includes both hardware and software components ready for end user application. The hardware functional components consist of modern data flow architectures utilizing Application Specific Integrated Circuits (ASIC's) developed specifically to support NASA's telemetry data systems needs and designed to meet a range of data rate requirements up to 300 Mbps. Real-time operating system software components support both embedded local software intelligence, and overall system control, status, processing, and interface requirements. These components, hardware and software, form the superstructure upon which project specific elements are added to complete a telemetry ground data system installation. This paper describes the functional components approach, some specific component examples, and a project example of the evolution from VLSI component, to basic board level functional component, to integrated telemetry data system.
Chesney, J.↗
Mark I Silicon Carbide Integrated Circuit Test Oven Assembly and Programming Guide
This report provides a parts list, with assembly and programming instructions for building firstgeneration (Mark I) compact test ovens; this oven design is customized for prolonged functional electrical testing of prototype silicon carbide (SiC) devices at temperatures up to 500 °C (932 °F). The general approach of using multiple compact ovens to perform long-term, high-temperature electronics testing efficiently is described in a conference paper (Izadnegahdar, Alain, et al.: Alternative Setup for LongDuration Low-Duty-Cycle 600 °C Ambient Testing of SiC Integrated Circuits. International Microelectronics Assembly and Packaging Society (iMAPS) HiTECH 2021 Technology Crossover Extravaganza, 2021), available at https://ntrs.nasa.gov/citations/20210011676. The new Mark I oven design described here offers several significant improvements over the compact oven described in that paper. For example, it is constructed from commercial off-the-shelf (COTS) components and requires minimal assembly. Much of the work involves drilling holes in the two aluminum project boxes, which contain the control electronics and the oven itself. The cost of components is less than $200 (USD) per oven, which makes constructing multiple ovens affordable. In addition, the two-box design separates the high-temperature heater from the electronics, which keeps the electronics cool, prolonging the lifetime of these components.
high temperature↗
Computation of the radiation characteristics of a generalized phased array
With the advent of monolithic microwave integrated circuit (MMIC) technology, the phased array has become a key component in the design of advanced antenna systems. Array-fed antennas are used extensively in today's multiple beam satellite antennas. A computer program based on a very efficient numerical technique for calculating the radiated power (Romberg integration), directivity, and radiation pattern of a phased array is described. The formulation developed is very general, and takes into account arbitrary element polarization, E- and H-plane element pattern, element location, and complex element excitation. For comparison purposes sample cases have been presented. Excellent agreement has been obtained for all cases. Also included are a user guide and a copy of the computer program.
Acosta, R. J.↗
Beyond G-band : a 235 GHz InP MMIC amplifier
We present results on an InP monolithic millimeter- wave integrated circuit (MMIC) amplifier having 10-dB gain at 235 GHz. We designed this circuit and fabricated the chip in Northrop Grumman Space Technology's (NGST) 0.07- m InP high electron mobility transistor (HEMT) process. Using a WR3 (220-325 GHz) waveguide vector network analyzer system interfaced to waveguide wafer probes, we measured this chip on-wafer for -parameters. To our knowledge, this is the first time a WR3 waveguide on-wafer measurement system has been used to measure gain in a MMIC amplifier above 230 GHz.
high electron mobility transistors (HEMTs)↗
Data Concentrator
Orbital Research, Inc., developed, built, and tested three high-temperature components for use in the design of a data concentrator module in distributed turbine engine control. The concentrator receives analog and digital signals related to turbine engine control and communicates with a full authority digital engine control (FADEC) or high-level command processor. This data concentrator follows the Distributed Engine Controls Working Group (DECWG) roadmap for turbine engine distributed controls communication development that operates at temperatures at least up to 225 C. In Phase I, Orbital Research developed detailed specifications for each component needed for the system and defined the total system specifications. This entailed a combination of system design, compiling existing component specifications, laboratory testing, and simulation. The results showed the feasibility of the data concentrator. Phase II of this project focused on three key objectives. The first objective was to update the data concentrator design modifications from DECWG and prime contractors. Secondly, the project defined requirements for the three new high-temperature, application-specific integrated circuits (ASICs): one-time programmable (OTP), transient voltage suppression (TVS), and 3.3V. Finally, the project validated each design by testing over temperature and under load.
Willett, Mike↗
A special purpose silicon compiler for designing supercomputing VLSI systems
Design of general/special purpose supercomputing VLSI systems for numeric algorithm execution involves tackling two important aspects, namely their computational and communication complexities. Development of software tools for designing such systems itself becomes complex. Hence a novel design methodology has to be developed. For designing such complex systems a special purpose silicon compiler is needed in which: the computational and communicational structures of different numeric algorithms should be taken into account to simplify the silicon compiler design, the approach is macrocell based, and the software tools at different levels (algorithm down to the VLSI circuit layout) should get integrated. In this paper a special purpose silicon (SPS) compiler based on PACUBE macrocell VLSI arrays for designing supercomputing VLSI systems is presented. It is shown that turn-around time and silicon real estate get reduced over the silicon compilers based on PLA's, SLA's, and gate arrays. The first two silicon compiler characteristics mentioned above enable the SPS compiler to perform systolic mapping (at the macrocell level) of algorithms whose computational structures are of GIPOP (generalized inner product outer product) form. Direct systolic mapping on PLA's, SLA's, and gate arrays is very difficult as they are micro-cell based. A novel GIPOP processor is under development using this special purpose silicon compiler.
Venkateswaran, N.↗
Automatic Design System
RCA has applied the results of NASA sponsored research in producing (LSIs), Large Scale Integrated Circuits, for its own product line -- communications equipment (for example) -- and for use in products manufactured by other companies such as the automobile engine analyzer developed by Chrysler Corp. Analyzer employs an LSI array to diagnose and solve problems for as many as 60 engine functions in less than four minutes. RCA's computerized system enables design in one to three months of LSIs which once required six to 12 months, and there has been an attendant reduction in design costs.
Source record↗
HDL to verification logic translator
The increasingly higher number of transistors possible in VLSI circuits compounds the difficulty in insuring correct designs. As the number of possible test cases required to exhaustively simulate a circuit design explodes, a better method is required to confirm the absence of design faults. Formal verification methods provide a way to prove, using logic, that a circuit structure correctly implements its specification. Before verification is accepted by VLSI design engineers, the stand alone verification tools that are in use in the research community must be integrated with the CAD tools used by the designers. One problem facing the acceptance of formal verification into circuit design methodology is that the structural circuit descriptions used by the designers are not appropriate for verification work and those required for verification lack some of the features needed for design. We offer a solution to this dilemma: an automatic translation from the designers' HDL models into definitions for the higher-ordered logic (HOL) verification system. The translated definitions become the low level basis of circuit verification which in turn increases the designer's confidence in the correctness of higher level behavioral models.
Gambles, J. W.↗
V-band integrated quadriphase modulator
A V-band integrated circuit quadriphase shift keyed modulator/exciter for space communications systems was developed. Intersatellite communications systems require direct modulation at 60 GHz to enhance signal processing capability. For most systems, particularly space applications, small and lightweight components are essential to alleviate severe system design constraints. Thus to achieve wideband, high data rate systems, direct modulation techniques at millimeter waves using solid state integrated circuit technology are an integral part of the overall technology developments.
Grote, A.↗
Investigation of failure mechanisms in integrated vacuum circuits
The fabrication techniques of integrated vacuum circuits are described in detail. Data obtained from a specially designed test circuit are presented. The data show that the emission observed in reverse biased devices is due to cross-talk between the devices and can be eliminated by electrostatic shielding. The lifetime of the cathodes has been improved by proper activation techniques. None of the cathodes on life test has shown any sign of failure after more than 3500 hours. Life tests of triodes show a decline of anode current by a factor of two to three after a few days. The current recovers when the large positive anode voltage (100 V) has been removed for a few hours. It is suggested that this is due to trapped charges in the sapphire substrate. Evidence of the presence of such charges is given, and a model of the charge distribution is presented consistent with the measurements. Solution of the problem associated with the decay of triode current may require proper treatment of the sapphire surface and/or changes in the deposition technique of the thin metal films.
Rosengreen, A.↗
Hardware additions to microprocessor architecture aid software development
An address trap (breakpoint) mechanism and last-in-first-out (LIFO) address stack are suggested as two additions to the basic microprocessor architecture whose functions are solely to aid the programmer. These devices provide the programmer with the ability to specify address breakpoints and to trace program execution back through N instructions, where N is the depth of the stack. Both devices, plus interface logic and buffering, have been designed for an INTEL 8080-based system using approximately 25 integrated-circuit packages.
Sievers, M. W.↗