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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

Solar Cell Modules with Parallel Oriented Interconnections

Twenty-four solar modules, half of which were 48 cells in an all-series electrical configuration and half of a six parallel cells by eight series cells were provided. Upon delivery of environmentally tested modules, low power outputs were discovered. These low power modules were determined to have cracked cells which were thought to cause the low output power. The cracks tended to be linear or circular which were caused by different stressing mechanisms. These stressing mechanisms were fully explored. Efforts were undertaken to determine the causes of cell fracture. This resulted in module design and process modifications. The design and process changes were subsequently implemented in production.

Source record↗

The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

Bouldin, D. L.↗

Panel D report: Standards needed to interconnect ADS pilots for data sharing in data formats and descriptions

Data exchange specifications and standards needed to facilitate the interchange of information between three pilot modes in an Applications Data Service program are addressed. In designing standards, the following considerations were considered important: (1) accessible, understandable Data Base Management Systems (DBMS) catalogs, (2) formatting conventions, (3) archival data records and data descriptions formats, (4) standardized terminology, and (5) optimization of data formats by individual DBMS.

Source record↗

Predicting the Reliability of Solar-Cell Interconnections

The reduction of life expectancy by thermal cycling calculated during design. Connections between solar cells critical parts of solarcell arrays generating electric power. Reliability affects life expectancy of modules, panels, and arrays. Used to predict stress-cycle lifetimes of such structures as arches, walkways, cylindrical ribbing of aircraft fuselages and submarine hulls, and pipeline expansion loops. Testing costs reduced by about 90 percent.

Mon, G. R.↗

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

An apparatus is disclosed which includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a dc magnetron sputtering system. A gas inlet introduces various gases to the vacuum chamber and creates various gas plasma during the sputtering steps. The rotating turntables insure that the respective wafers are present under the sputtering guns for an average amount of time such that consistency in sputtering and deposition is achieved. By continuous and sequential processing of the wafers in a common vacuum chamber without removal, the adverse affects of exposure to atmospheric conditions are eliminated providing higher quality circuit contacts and functional device.

Routh, D. E.↗

Utility interconnection issues for wind power generation

This document organizes the total range of utility related issues, reviews wind turbine control and dynamic characteristics, identifies the interaction of wind turbines to electric utility systems, and identifies areas for future research. The material is organized at three levels: the wind turbine, its controls and characteristics; connection strategies as dispersed or WPSs; and the composite issue of planning and operating the electric power system with wind generated electricity.

Herrera, J. I.↗

Local network interconnection through a satellite point-to-multipoint link

Four architectures to implement a point to multipoint satellite link protocol for communication services offered by the Telecom 1 satellite network are presented. A safe communication service with error correction and flow control facilities is described. It is shown that a time transparent communication system combines simplicity and cost advantages.

Duarte, O. Muniz Bandeira↗

Modal reduction strategies for interconnected flexible bodies simulation

Multi-body dynamics programs require characterization of each body. The Galileo spacecraft system modes to be retained were determined using available criteria, modal influence coefficients, and bode. The descent to component level was achieved via a two-phase diagonalization process starting with submatrices of truncated augmented system modal matrix.

Eke, F. O.↗

Optical control of an 8-element Ka-band phased array using a high-speed optoelectronic interconnect

Optical distribution of control signals in electronically steered phased array antennas is being considered. A demonstration experiment is described in which a high speed hybrid GaAs optoelectronic integrated circuit (OEIC) was used to control an eight element phased array antenna. The OEIC, which accepts a serial optical control signal as input and converts it to 16 demultiplexed parallel outputs, was used to control the monolithic GaAs phase shifters of a Ka-band patch panel array antenna. Antenna pattern switching speeds of 2.25 microsec, limited by interface circuitry, were observed.

Richard, M. A.↗

Testing interconnected VLSI circuits in the Big Viterbi Decoder

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Onyszchuk, I. M.↗

Fiber-optic interconnection networks for spacecraft

The overall goal of this effort was to perform the detailed design, development, and construction of a prototype 8x8 all-optical fiber optic crossbar switch using low power liquid crystal shutters capable of operation in a network with suitable fiber optic transmitters and receivers at a data rate of 1 Gb/s. During the earlier Phase 1 feasibility study, it was determined that the all-optical crossbar system had significant advantages compared to electronic crossbars in terms of power consumption, weight, size, and reliability. The result is primarily due to the fact that no optical transmitters and receivers are required for electro-optic conversion within the crossbar switch itself.

Powers, Robert S.↗

Broadband vertical interconnects using slot-coupled shielded microstrip lines

A full-wave space-domain integral equation analysis of aperture coupled shielded microstrip lines is presented based on the Equivalence Principle. The formulation includes the capability to model multilayered substrates through the derivation of the associated dyadic Green's functions which represent the layers through impedance boundary conditions. The method of moments is used to solve for the line currents and slot voltage with even and odd mode excitations which are then interpreted through transmission line analysis to determine the two-port scattering parameters. A parametric study together with experimental data is presented which demonstrates the behavior of the coupler and the accuracy of the technique.

Vandenberg, Norman L.↗

High density packaging and interconnect of massively parallel image processors

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Carson, John C.↗

Architecture for Survivable Systems Processing (ASSP). Technology benefits for Open System Interconnects

The Architecture for Survivable Systems Processing (ASSP) program is a two phase program whose objective is the derivation, specification, development and validation of an open system architecture capable of supporting advanced processing needs of space, ground, and launch vehicle operations. The output of the first phase is a set of hardware and software standards and specifications defining this architecture at three levels. The second phase will validate these standards and develop the technology necessary to achieve strategic hardness, packaging density, throughput requirements, and interoperability/interchangeability.

Wood, Richard J.↗

High Frequency Interconnects on Silicon Substrates

The measured propagation constant of coplanar waveguide (CPW) on silicon wafers as a function of the line dimensions and the resistivity of the Si wafer; CPW on GaAs wafers as a function of the line dimensions, and thin film microstrip (TFMS) polyimide fabricated with polyimide on the surface of a silicon wafer is presented. It is shown that the attenuation of CPW on 2500 Omega-cm Si wafers and-of TFMS with a polyimide thickness of 4 micrometer or greater is comparable to the attenuation of similar lines on GaAs.

Ponchak, George E.↗

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗