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At least 37 records · Page 2

Pattern Generator for Bench Test of Digital Boards

All efforts to develop electronic equipment reach a stage where they need a board test station for each board. The SMAP digital system consists of three board types that interact with each other using interfaces with critical timing. Each board needs to be tested individually before combining into the integrated digital electronics system. Each board needs critical timing signals from the others to be able to operate. A bench test system was developed to support test of each board. The test system produces all the outputs of the control and timing unit, and is delivered much earlier than the timing unit. Timing signals are treated as data. A large file is generated containing the state of every timing signal at any instant. This file is streamed out to an IO card, which is wired directly to the device-under-test (DUT) input pins. This provides a flexible test environment that can be adapted to any of the boards required to test in a standalone configuration. The problem of generating the critical timing signals is then transferred from a hardware problem to a software problem where it is more easily dealt with.

Berkun, Andrew C.↗

Design of the Wind Tunnel Model Communication Controller Board

The NASA Langley Research Center's Wind Tunnel Reinvestment project plans to shrink the existing data acquisition electronics to fit inside a wind tunnel model. Space limitations within a model necessitate a distributed system of Application Specific Integrated Circuits (ASICs) rather than a centralized system based on PC boards. This thesis will focus on the design of the prototype of the communication Controller board. A portion of the communication Controller board is to be used as the basis of an ASIC design. The communication Controller board will communicate between the internal model modules and the external data acquisition computer. This board is based around an Field Programmable Gate Array (FPGA), to allow for reconfigurability. In addition to the FPGA, this board contains buffer Random Access Memory (RAM), configuration memory (EEPROM), drivers for the communications ports, and passive components.

Wilson, William C.↗

Columbia Accident Investigation Board. Volume One

The Columbia Accident Investigation Board's independent investigation into the February 1, 2003, loss of the Space Shuttle Columbia and its seven-member crew lasted nearly seven months. A staff of more than 120, along with some 400 NASA engineers, supported the Board's 13 members. Investigators examined more than 30,000 documents, conducted more than 200 formal interviews, heard testimony from dozens of expert witnesses, and reviewed more than 3,000 inputs from the general public. In addition, more than 25,000 searchers combed vast stretches of the Western United States to retrieve the spacecraft's debris. In the process, Columbia's tragedy was compounded when two debris searchers with the U.S. Forest Service perished in a helicopter accident. This report concludes with recommendations, some of which are specifically identified and prefaced as 'before return to flight.' These recommendations are largely related to the physical cause of the accident, and include preventing the loss of foam, improved imaging of the Space Shuttle stack from liftoff through separation of the External Tank, and on-orbit inspection and repair of the Thermal Protection System. The remaining recommendations, for the most part, stem from the Board's findings on organizational cause factors. While they are not 'before return to flight' recommendations, they can be viewed as 'continuing to fly' recommendations, as they capture the Board's thinking on what changes are necessary to operate the Shuttle and future spacecraft safely in the mid- to long-term. These recommendations reflect both the Board's strong support for return to flight at the earliest date consistent with the overriding objective of safety, and the Board's conviction that operation of the Space Shuttle, and all human space-flight, is a developmental activity with high inherent risks.

SPACE SHUTTLE COLUMBIA↗

Data Relay Board with Protocol for High-Speed, Free-Space Optical Communications

In a free-space optical communication system, the mitigation of transient outages through the incorporation of error-control methods is of particular concern, the outages being caused by scintillation fades and obscurants. The focus of this innovative technology is the development of a data relay system for a reliable high-data-rate free-spacebased optical-transport network. The data relay boards will establish the link, maintain synchronous connection, group the data into frames, and provide for automatic retransmission (ARQ) of lost or erred frames. A certain Quality of Service (QoS) can then be ensured, compatible with the required data rate. The protocol to be used by the data relay system is based on the draft CCSDS standard data-link protocol Proximity-1, selected by orbiters to multiple lander assets in the Mars network, for example. In addition to providing data-link protocol capabilities for the free-space optical link and buffering the data, the data relay system will interface directly with user applications over Gigabit Ethernet and/or with highspeed storage resources via Fibre Channel. The hardware implementation is built on a network-processor-based architecture. This technology combines the power of a hardware switch capable of data switching and packet routing at Gbps rates, with the flexibility of a software- driven processor that can host highly adaptive and reconfigurable protocols used, for example, in wireless local-area networks (LANs). The system will be implemented in a modular multi-board fashion. The main hardware elements of the data relay system are the new data relay board developed by Rockwell Scientific, a COTS Gigabit Ethernet board for user interface, and a COTS Fibre Channel board that connects to local storage. The boards reside in a cPCI back plane, and can be housed in a VME-type enclosure.

Wright, Malcolm↗

High-Speed On-Board Data Processing for Science Instruments

A new development of on-board data processing platform has been in progress at NASA Langley Research Center since April, 2012, and the overall review of such work is presented in this paper. The project is called High-Speed On-Board Data Processing for Science Instruments (HOPS) and focuses on a high-speed scalable data processing platform for three particular National Research Council's Decadal Survey missions such as Active Sensing of CO2 Emissions over Nights, Days, and Seasons (ASCENDS), Aerosol-Cloud-Ecosystems (ACE), and Doppler Aerosol Wind Lidar (DAWN) 3-D Winds. HOPS utilizes advanced general purpose computing with Field Programmable Gate Array (FPGA) based algorithm implementation techniques. The significance of HOPS is to enable high speed on-board data processing for current and future science missions with its reconfigurable and scalable data processing platform. A single HOPS processing board is expected to provide approximately 66 times faster data processing speed for ASCENDS, more than 70% reduction in both power and weight, and about two orders of cost reduction compared to the state-of-the-art (SOA) on-board data processing system. Such benchmark predictions are based on the data when HOPS was originally proposed in August, 2011. The details of these improvement measures are also presented. The two facets of HOPS development are identifying the most computationally intensive algorithm segments of each mission and implementing them in a FPGA-based data processing board. A general introduction of such facets is also the purpose of this paper.

Beyon, Jeffrey Y.↗

Development and evaluation of polyimide laminates for printed wiring board applications

A developmental and evaluation program on polyimide laminates as printed wiring boards is described. The development of an experimental polyimide with low linear coefficient of thermal expansion normal to the plane of the board is discussed, and its properties are evaluated along with two commercial polyimide printed wiring boards for comparison with the type G-10 epoxy board. Thermal cycling data indicate an urgent need for effectively controlling the expansion normal to the plane of the board in order to minimize solder joint damage.

Patterson, W. J.↗

Tethered Satellite System Contingency Investigation Board

The Tethered Satellite System (TSS-1) was launched aboard the Space Shuttle Atlantis (STS-46) on July 31, 1992. During the attempted on-orbit operations, the Tethered Satellite System failed to deploy successfully beyond 256 meters. The satellite was retrieved successfully and was returned on August 6, 1992. The National Aeronautics and Space Administration (NASA) Associate Administrator for Space Flight formed the Tethered Satellite System (TSS-1) Contingency Investigation Board on August 12, 1992. The TSS-1 Contingency Investigation Board was asked to review the anomalies which occurred, to determine the probable cause, and to recommend corrective measures to prevent recurrence. The board was supported by the TSS Systems Working group as identified in MSFC-TSS-11-90, 'Tethered Satellite System (TSS) Contingency Plan'. The board identified five anomalies for investigation: initial failure to retract the U2 umbilical; initial failure to flyaway; unplanned tether deployment stop at 179 meters; unplanned tether deployment stop at 256 meters; and failure to move tether in either direction at 224 meters. Initial observations of the returned flight hardware revealed evidence of mechanical interference by a bolt with the level wind mechanism travel as well as a helical shaped wrap of tether which indicated that the tether had been unwound from the reel beyond the travel by the level wind mechanism. Examination of the detailed mission events from flight data and mission logs related to the initial failure to flyaway and the failure to move in either direction at 224 meters, together with known preflight concerns regarding slack tether, focused the assessment of these anomalies on the upper tether control mechanism. After the second meeting, the board requested the working group to complete and validate a detailed integrated mission sequence to focus the fault tree analysis on a stuck U2 umbilical, level wind mechanical interference, and slack tether in upper tether control mechanism and to prepare a detailed plan for hardware inspection, test, and analysis including any appropriate hardware disassembly.

Source record↗

On-Board Fiber-Optic Network Architectures for Radar and Avionics Signal Distribution

Continued progress in both civil and military avionics applications is overstressing the capabilities of existing radio-frequency (RF) communication networks based on coaxial cables on board modem aircrafts. Future avionics systems will require high-bandwidth on- board communication links that are lightweight, immune to electromagnetic interference, and highly reliable. Fiber optic communication technology can meet all these challenges in a cost-effective manner. Recently, digital fiber-optic communication systems, where a fiber-optic network acts like a local area network (LAN) for digital data communications, have become a topic of extensive research and development. Although a fiber-optic system can be designed to transport radio-frequency (RF) signals, the digital fiber-optic systems under development today are not capable of transporting microwave and millimeter-wave RF signals used in radar and avionics systems on board an aircraft. Recent advances in fiber optic technology, especially wavelength division multiplexing (WDM), has opened a number of possibilities for designing on-board fiber optic networks, including all-optical networks for radar and avionics RF signal distribution. In this paper, we investigate a number of different novel approaches for fiber-optic transmission of on-board VHF and UHF RF signals using commercial off-the-shelf (COTS) components. The relative merits and demerits of each architecture are discussed, and the suitability of each architecture for particular applications is pointed out. All-optical approaches show better performance than other traditional approaches in terms of signal-to-noise ratio, power consumption, and weight requirements.

Alam, Mohammad F.↗

Physically separating printed circuit boards with a resilient, conductive contact

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Baker, John D.↗

Stripline/Microstrip Transition in Multilayer Circuit Board

A stripline-to-microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz). The transition is designed to satisfy the following requirements in addition to the basic coupling requirement described above: (1) The transition must traverse multiple layers, including intermediate layers that contain DC circuitry. (2) The transition must work at a frequency of 32 GHz with low loss and low reflection. (3) The power delivered by the transition to top-layer microstrip must be split equally in opposite directions along the microstrip. Referring to the figure, this amounts to a requirement that when power is supplied to input port 1, equal amounts of power flow through output ports 2 and 3. (4) The signal-line via that is necessarily a part of such a transition must not be what is known in the art as a blind via; that is, it must span the entire thickness of the circuit board.

Epp, Larry↗

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

Bradley, Arthur T.↗

On-board Absolute Localization Based on Orbital Imagery for a Future Mars Science Helicopter

Future Mars Rotorcraft require advanced navigationcapabilities to enable all terrain access over long distance flightsthat are executed fully autonomously. A critical component toenable precision navigation during long traverses is the abilityto perform on-board absolute localization to eliminate drift inposition estimates of the on-board odometry algorithm. Inthis paper, we present an approach for on-board map-basedlocalization to provide global reference position based on orbitalor aerial image maps. Our approach builds on a vision-basedlocalization method to localize against a map derived fromHiRISE image products – an ortho-projected image (orthoimage) and a corresponding digital elevation map. The mapis pre-computed using a feature-based approach. Features arestored with their 3D world coordinates, and a descriptor to codethe local image intensity information in the vicinity of the featurelocation. An on-board matching algorithm uses this informationto match visual features in a query image acquired during flight,guided by a pose prior from the on-board range-visual-inertialstate estimator (Range-VIO). Valid matches are then used bya perspective-n-point (PnP) algorithm to estimate the absolutepose of the vehicle in a global frame. We demonstrate andevaluate our approach on simulated data, and data from UASflights.

Balaram, J. Bob↗

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD↗

Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Bradbury, E. J.↗

Noise generated by impingement of a jet upon a large flat board

Data were obtained on the noise generated by an air jet impinging on a large flat board. The board was large enough so that the flow leaving the edges of the board generated no significant noise. The impingement angle, nozzle shape and size, jet velocity, and the distance from the nozzle to the board were varied in the experiment. Far-field noise data are presented. The nozzle-alone noise contribution to the total noise was generally small and was subtracted from the total, leaving the impingement-only noise. The impingement-only noise was adequately correlated by eighth power of the peak impingement velocity and first power of the impingement area. The spectral data were correlated by a Strouhal number based on the peak impingement velocity and a characteristic impingement diameter.

Olsen, W. A.↗

Bench-top soldering aid for PC boards

Multiple-board rack allows technician to insert components into several boards, flip them all in single motion, and then systematically solder leads on reverse side. Two adjustable crossbars allow boards of any size up to 10 by 24 inches. Operator can rotate racks and adjust angle of boards from standing or sitting position.

Manton, N. R.↗

Coating Circuit Boards With Silicone

Techniques appropriate to boards containing CMOS circuits detailed. Document presents procedure for applying thin conformal coating to such electronic assemblies as printed-circuit boards and wire-wrapped boards. Coating is from 1 to 7 mils (25 to 178 micrometers) thick and composed of room-temperature-vulcanizing (RTV) silicone. Specifies materials, equipment, spraying method, and quality requirements. Takes into account special needs of circuits made with complementary metal-oxide/semiconductor (CMOS) devices on circuit boards. Special attention given to preventing damage by electrostatic discharge, to which CMOS circuits especially sensitive.

Gaudiano, S.↗

Two-dimensional graphics tools for a transputer based display board

A package of 2-D graphics routines has been developed in an effort to standardize and simplify the user interface for a transputer based graphics display board. The routines available take advantage of the graphic board's capabilities while also presenting an intuitive approach for generating drawings. The routines allow a user to perform graphics rendering in a 2-D real-coordinate space without regard to the actual screen coordinates. Multiple windows, which can be placed arbitrarily on the screen as well as the ability to use double-buffering techniques for smooth animations are also supported. The routines are designed to be run on a transputer other than the graphics display board. The window and screen parameters are maintained locally. The conversion to device coordinates is also performed locally. The only data sent to the display board are control and device coordinate display commands. The routines available include: rotation translation, and scaling commands; absolute and relative point and line commands; circle, rectangle and polygon commands; and window and viewpoint definition commands.

Ellis, Graham K.↗