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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1977

System design package for IBM system one: solar heating and domestic hot water

This report is a collation of documents and drawings that describe a prototype solar heating and hot water system using air as the collector fluid and a pebble bed for heat storage. The system was designed for installation into a single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system was packaged for evaluation of the system with information sufficient to assemble a similar system.

Source record↗
NASA NTRS1978

System Design Package for SIMS Prototype System 3, Solar Heating and Domestic Hot Water

A collation of documents and drawings are presented that describe a prototype solar heating and hot water system using liquid flat plate collectors and a gas or electric furnace energy subsystem. The system was designed for installation into a single-family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system are packaged for evaluation of the system with information sufficient to assemble a similar system.

Source record↗
NASA NTRS1978

System design package for SIMS prototype system 4, solar heating and domestic hot water

The system consisted of a modular designed prepackaged solar unit, containing solar collectors, a rock storage container, blowers, dampers, ducting, air-to-water heat exchanger, DHW preheat tank, piping, and system controls. The system was designed to be installed adjacent to a small single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system were packaged for evaluation.

Source record↗
NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗
NASA NTRS1977

System design package for SIMS prototype system 2, solar hot water

Information necessary to evaluate the design and assembly of a solar hot water system is presented. A prototype system designed for use in a single family dwelling is investigated in terms of the following subsystems: collector, storage, energy transport, and control.

Source record↗
NASA NTRS1980

Installation package for a solar-heating system

Package consists of installation, operation and maintenance manuals for four commercial solar energy subsystems, including flat plate solar collector pebble bed thermal-storage. Manual gives design information, sizing data, specification drawings, and other material for subsystem.

Source record↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
NASA NTRS2016

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗
NASA NTRS1979

System design package for a solar heating and cooling system installed at Akron, Ohio

Information used to evaluate the design of a solar heating, cooling, and domestic hot water system is given. A conventional heat pump provides summer cooling items as the design data brochure, system performance specification, system hazard analysis, spare parts list, and detailed design drawings. A solar system is installed in a single-family dwelling at Akron, Ohio, and at Duffield, Virginia.

Source record↗
NASA NTRS1993

Review and analysis of dense linear system solver package for distributed memory machines

A dense linear system solver package recently developed at the University of Texas at Austin for distributed memory machine (e.g. Intel Paragon) has been reviewed and analyzed. The package contains about 45 software routines, some written in FORTRAN, and some in C-language, and forms the basis for parallel/distributed solutions of systems of linear equations encountered in many problems of scientific and engineering nature. The package, being studied by the Computer Applications Branch of the Analysis and Computation Division, may provide a significant computational resource for NASA scientists and engineers in parallel/distributed computing. Since the package is new and not well tested or documented, many of its underlying concepts and implementations were unclear; our task was to review, analyze, and critique the package as a step in the process that will enable scientists and engineers to apply it to the solution of their problems. All routines in the package were reviewed and analyzed. Underlying theory or concepts which exist in the form of published papers or technical reports, or memos, were either obtained from the author, or from the scientific literature; and general algorithms, explanations, examples, and critiques have been provided to explain the workings of these programs. Wherever the things were still unclear, communications were made with the developer (author), either by telephone or by electronic mail, to understand the workings of the routines. Whenever possible, tests were made to verify the concepts and logic employed in their implementations. A detailed report is being separately documented to explain the workings of these routines.

Narang, H. N.↗
NASA NTRS1979

Solar heating system final design package

The system is composed of a warm air collector, a logic control unit and a universal switching and transport unit. The collector was originally conceived and designed as an integrated roof/wall system and therefore provides a dual function in the structure. The collector serves both as a solar energy conversion system and as a structural weather resistant skin. The control unit provides totally automatic control over the operation of the system. It receives input data from sensor probes in collectors, storage and living space. The logic was designed so as to make maximum use of solar energy and minimize use of conventional energy. The transport and switching unit is a high-efficiency air-handling system equipped with gear motor valves that respond to outputs from the control system. The fan unit was designed for maximum durability and efficiency in operation, and has permanently lubricated ball bearings and excellent air-handling efficiency.

Source record↗
NASA NTRS1980

Solar-heating system design package

Report describes solar heating system composed of warm-air solar collector, logic control unit, and switching and transport unit, that meets government standards for installation in residential dwellings. Text describes system operation and performance specifications complemented by comprehensive set of subcomponent design drawings.

Source record↗
NASA NTRS1991

Design And Analysis Of Linear Control Systems

Package of five computer programs developed to assist in design and analysis of linear control systems by use of root-locus and frequency-response methods. Package written in FORTRAN (BODE, TPEAK) and BASIC (LOCUS, KTUNE, and POLYROOT).

Jamison, John W.↗
NASA NTRS1978

System design package for the solar heating and cooling central data processing system

The central data processing system provides the resources required to assess the performance of solar heating and cooling systems installed at remote sites. These sites consist of residential, commercial, government, and educational types of buildings, and the solar heating and cooling systems can be hot-water, space heating, cooling, and combinations of these. The instrumentation data associated with these systems will vary according to the application and must be collected, processed, and presented in a form which supports continuity of performance evaluation across all applications. Overall software system requirements were established for use in the central integration facility which transforms raw data collected at remote sites into performance evaluation information for assessing the performance of solar heating and cooling systems.

Source record↗
NASA NTRS2010

System for Packaging Planetary Samples for Return to Earth

A system is proposed for packaging material samples on a remote planet (especially Mars) in sealed sample tubes in preparation for later return to Earth. The sample tubes (Figure 1) would comprise (1) tubes initially having open tops and closed bottoms; (2) small, bellows-like collapsible bodies inside the tubes at their bottoms; and (3) plugs to be eventually used to close the tops of the tubes. The top inner surface of each tube would be coated with solder. The side of each plug, which would fit snugly into a tube, would feature a solder-filled ring groove. The system would include equipment for storing, manipulating, filling, and sealing the tubes. The containerization system (see Figure 2) will be organized in stations and will include: the storage station, the loading station, and the heating station. These stations can be structured in circular or linear pattern to minimize the manipulator complexity, allowing for compact design and mass efficiency. The manipulation of the sample tube between stations is done by a simple manipulator arm. The storage station contains the unloaded sample tubes and the plugs before sealing as well as the sealed sample tubes with samples after loading and sealing. The chambers at the storage station also allow for plug insertion into the sample tube. At the loading station the sample is poured or inserted into the sample tube and then the tube is topped off. At the heating station the plug is heated so the solder ring melts and seals the plug to the sample tube. The process is performed as follows: Each tube is filled or slightly overfilled with sample material and the excess sample material is wiped off the top. Then, the plug is inserted into the top section of the tube packing the sample material against the collapsible bellowslike body allowing the accommodation of the sample volume. The plug and the top of the tube are heated momentarily to melt the solder in order to seal the tube.

Badescu, Mircea↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗