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Xilinx Virtex-5QV (V5QV) Independent SEU Data

This is an independent study to determine the single event destructive and transient susceptibility of the Xilinx Virtex-5QV (SIRF) device. A framework for evaluating complex digital systems targeted for harsh radiation environments such as space is presented.

Field Programmable Gate Array (FPGA)↗

SpaceCube Mini

This version of the SpaceCube will be a full-fledged, onboard space processing system capable of 2500+ MIPS, and featuring a number of plug-andplay gigabit and standard interfaces, all in a condensed 3x3x3 form factor [less than 10 watts and less than 3 lb (approximately equal to 1.4 kg)]. The main processing engine is the Xilinx SIRF radiation- hardened-by-design Virtex-5 FX-130T field-programmable gate array (FPGA). Even as the SpaceCube 2.0 version (currently under test) is being targeted as the platform of choice for a number of the upcoming Earth Science Decadal Survey missions, GSFC has been contacted by customers who wish to see a system that incorporates key features of the version 2.0 architecture in an even smaller form factor. In order to fulfill that need, the SpaceCube Mini is being designed, and will be a very compact and low-power system. A similar flight system with this combination of small size, low power, low cost, adaptability, and extremely high processing power does not otherwise exist, and the SpaceCube Mini will be of tremendous benefit to GSFC and its partners. The SpaceCube Mini will utilize space-grade components. The primary processing engine of the Mini is the Xilinx Virtex-5 SIRF FX-130T radiation-hardened-by-design FPGA for critical flight applications in high-radiation environments. The Mini can also be equipped with a commercial Xilinx Virtex-5 FPGA with integrated PowerPCs for a low-cost, high-power computing platform for use in the relatively radiation- benign LEOs (low-Earth orbits). In either case, this version of the Space-Cube will weigh less than 3 pounds (.1.4 kg), conform to the CubeSat form-factor (10x10x10 cm), and will be low power (less than 10 watts for typical applications). The SpaceCube Mini will have a radiation-hardened Aeroflex FPGA for configuring and scrubbing the Xilinx FPGA by utilizing the onboard FLASH memory to store the configuration files. The FLASH memory will also be used for storing algorithm and application code for the PowerPCs and the Xilinx FPGA. In addition, it will feature highspeed DDR SDRAM (double data rate synchronous dynamic random-access memory) to store the instructions and data of active applications. This version will also feature SATA-II and Gigabit Ethernet interfaces. Furthermore, there will also be general-purpose, multi-gigabit interfaces. In addition, the system will have dozens of transceivers that can support LVDS (low-voltage differential signaling), RS-422, or SpaceWire. The SpaceCube Mini includes an I/O card that can be customized to meet the needs of each mission. This version of the SpaceCube will be designed so that multiple Minis can be networked together using SpaceWire, Ethernet, or even a custom protocol. Scalability can be provided by networking multiple SpaceCube Minis together. Rigid-Flex technology is being targeted for the construction of the SpaceCube Mini, which will make the extremely compact and low-weight design feasible. The SpaceCube Mini is designed to fit in the compact CubeSat form factor, thus allowing deployment in a new class of missions that the previous SpaceCube versions were not suited for. At the time of this reporting, engineering units should be available in the summer 2012.

Michael Lin↗

Single Event Effects in FPGA Devices 2014-2015

This presentation provides an overview of single event effects in FPGA devices 2014-2015 including commercial Xilinx V5 heavy ion accelerated testing, Xilinx Kintex-7 heavy ion accelerated testing. Mitigation study, and investigation of various types of triple modular redundancy (TMR) for commercial SRAM based FPGAs.

Single event upset (SEU)↗

Virtex-4VQ dynamic and mitigated single event upset characterization summary

This report is the result of funding by the NASA Electronic Parts and Packaging Program (NEPP) and the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx Single Event Effects (SEE) Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universitie and national laboratories, combining resources to characterize reconfigurable, field programmable gate arrays (FPGAs) for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1–5. A notable exception is Ref. 6, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This work represents a continuation of the efforts reported in the “Virtex-4QV Static SEU Characterization Summary” [7]. The contents of this report describe various Single Event Functional Interrupt (SEFI) and Single Event Upset (SEU) modes seen while dynamically exercising the clocked resources within Virtex-4 devices and the corresponding mitigation techniques related to the aforementioned observed SEFI modes.

Allen, Gregory↗

High-Speed, Multi-Channel Serial ADC LVDS Interface for Xilinx Virtex-5 FPGA

Analog-to-digital converters (ADCs) are used in scientific and communications instruments on all spacecraft. As data rates get higher, and as the transition is made from parallel ADC designs to high-speed, serial, low-voltage differential signaling (LVDS) designs, the need will arise to interface these in field programmable gate arrays (FPGAs). As Xilinx has released the radiation-hardened version of the Virtex-5, this will likely be used in future missions. High-speed serial ADCs send data at very high rates. A de-serializer instantiated in the fabric of the FPGA could not keep up with these high data rates. The Virtex-5 contains primitives designed specifically for high-speed, source-synchronous de-serialization, but as supported by Xilinx, can only support bitwidths of 10. Supporting bit-widths of 12 or more requires the use of the primitives in an undocumented configuration, a non-trivial task. A new SystemVerilog design was written that is simpler and uses fewer hardware resources than the reference design described in Xilinx Application Note XAPP866. It has been shown to work in a Xilinx XC5VSX24OT connected to a MAXIM MAX1438 12-bit ADC using a 50-MHz sample clock. The design can be replicated in the FPGA for multiple ADCs (four instantiations were used for a total of 28 channels).

Taylor, Gregory H.↗

Smart Payload Development for High Data Rate Instrument Systems

This slide presentation reviews the development of smart payloads instruments systems with high data rates. On-board computation has become a bottleneck for advanced science instrument and engineering capabilities. In order to improve the computation capability on board, smart payloads have been proposed. A smart payload is a Localized instrument, that can offload the flight processor of extensive computing cycles, simplify the interfaces, and minimize the dependency of the instrument on the flight system. This has been proposed for the Mars mission, Mars Atmospheric Trace Molecule Spectroscopy (MATMOS). The design of this system is discussed; the features of the Virtex-4, are discussed, and the technical approach is reviewed. The proposed Hybrid Field Programmable Gate Array (FPGA) technology has been shown to deliver breakthrough performance by tightly coupling hardware and software. Smart Payload designs for instruments such as MATMOS can meet science data return requirements with more competitive use of available on-board resources and can provide algorithm acceleration in hardware leading to implementation of better (more advanced) algorithms in on-board systems for improved science data return

Virtex-4↗

Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook↗

Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook↗

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗

SpaceCube Version 1.5

SpaceCube 1.5 is a high-performance and low-power system in a compact form factor. It is a hybrid processing system consisting of CPU (central processing unit), FPGA (field-programmable gate array), and DSP (digital signal processor) processing elements. The primary processing engine is the Virtex- 5 FX100T FPGA, which has two embedded processors. The SpaceCube 1.5 System was a bridge to the SpaceCube 2.0 and SpaceCube 2.0 Mini processing systems. The SpaceCube 1.5 system was the primary avionics in the successful SMART (Small Rocket/Spacecraft Technology) Sounding Rocket mission that was launched in the summer of 2011. For SMART and similar missions, an avionics processor is required that is reconfigurable, has high processing capability, has multi-gigabit interfaces, is low power, and comes in a rugged/compact form factor. The original SpaceCube 1.0 met a number of the criteria, but did not possess the multi-gigabit interfaces that were required and is a higher-cost system. The SpaceCube 1.5 was designed with those mission requirements in mind. The SpaceCube 1.5 features one Xilinx Virtex-5 FX100T FPGA and has excellent size, weight, and power characteristics [4×4×3 in. (approx. = 10×10×8 cm), 3 lb (approx. = 1.4 kg), and 5 to 15 W depending on the application]. The estimated computing power of the two PowerPC 440s in the Virtex-5 FPGA is 1100 DMIPS each. The SpaceCube 1.5 includes two Gigabit Ethernet (1 Gbps) interfaces as well as two SATA-I/II interfaces (1.5 to 3.0 Gbps) for recording to data drives. The SpaceCube 1.5 also features DDR2 SDRAM (double data rate synchronous dynamic random access memory); 4- Gbit Flash for storing application code for the CPU, FPGA, and DSP processing elements; and a Xilinx Platform Flash XL to store FPGA configuration files or application code. The system also incorporates a 12 bit analog to digital converter with the ability to read 32 discrete analog sensor inputs. The SpaceCube 1.5 design also has a built-in accelerometer. In addition, the system has 12 receive and transmit RS- 422 interfaces for legacy support. The SpaceCube 1.5 processor card represents the first NASA Goddard design in a compact form factor featuring the Xilinx Virtex- 5. The SpaceCube 1.5 incorporates backward compatibility with the Space- Cube 1.0 form factor and stackable architecture. It also makes use of low-cost commercial parts, but is designed for operation in harsh environments.

Geist, Alessandro↗

Fast and Adaptive Lossless On-Board Hyperspectral Data Compression System for Space Applications

Efficient on-board lossless hyperspectral data compression reduces the data volume necessary to meet NASA and DoD limited downlink capabilities. The techniques also improves signature extraction, object recognition and feature classification capabilities by providing exact reconstructed data on constrained downlink resources. At JPL a novel, adaptive and predictive technique for lossless compression of hyperspectral data was recently developed. This technique uses an adaptive filtering method and achieves a combination of low complexity and compression effectiveness that far exceeds state-of-the-art techniques currently in use. The JPL-developed 'Fast Lossless' algorithm requires no training data or other specific information about the nature of the spectral bands for a fixed instrument dynamic range. It is of low computational complexity and thus well-suited for implementation in hardware, which makes it practical for flight implementations of pushbroom instruments. A prototype of the compressor (and decompressor) of the algorithm is available in software, but this implementation may not meet speed and real-time requirements of some space applications. Hardware acceleration provides performance improvements of 10x-100x vs. the software implementation (about 1M samples/sec on a Pentium IV machine). This paper describes a hardware implementation of the JPL-developed 'Fast Lossless' compression algorithm on a Field Programmable Gate Array (FPGA). The FPGA implementation targets the current state of the art FPGAs (Xilinx Virtex IV and V families) and compresses one sample every clock cycle to provide a fast and practical real-time solution for Space applications.

image compression↗

Single Event Effects in FPGA Devices 2015-2016

This presentation provides an overview of single event effects in FPGA devices 2015-2016 including commercial Xilinx V5 heavy ion accelerated testing, Xilinx Kintex-7 heavy ion accelerated testing, mitigation study, and investigation of various types of triple modular redundancy (TMR) for commercial SRAM based FPGAs.

Xilinx V5↗

Reconfigurable Hardware for Compressing Hyperspectral Image Data

High-speed, low-power, reconfigurable electronic hardware has been developed to implement ICER-3D, an algorithm for compressing hyperspectral-image data. The algorithm and parts thereof have been the topics of several NASA Tech Briefs articles, including Context Modeler for Wavelet Compression of Hyperspectral Images (NPO-43239) and ICER-3D Hyperspectral Image Compression Software (NPO-43238), which appear elsewhere in this issue of NASA Tech Briefs. As described in more detail in those articles, the algorithm includes three main subalgorithms: one for computing wavelet transforms, one for context modeling, and one for entropy encoding. For the purpose of designing the hardware, these subalgorithms are treated as modules to be implemented efficiently in field-programmable gate arrays (FPGAs). The design takes advantage of industry- standard, commercially available FPGAs. The implementation targets the Xilinx Virtex II pro architecture, which has embedded PowerPC processor cores with flexible on-chip bus architecture. It incorporates an efficient parallel and pipelined architecture to compress the three-dimensional image data. The design provides for internal buffering to minimize intensive input/output operations while making efficient use of offchip memory. The design is scalable in that the subalgorithms are implemented as independent hardware modules that can be combined in parallel to increase throughput. The on-chip processor manages the overall operation of the compression system, including execution of the top-level control functions as well as scheduling, initiating, and monitoring processes. The design prototype has been demonstrated to be capable of compressing hyperspectral data at a rate of 4.5 megasamples per second at a conservative clock frequency of 50 MHz, with a potential for substantially greater throughput at a higher clock frequency. The power consumption of the prototype is less than 6.5 W. The reconfigurability (by means of reprogramming) of the FPGAs makes it possible to effectively alter the design to some extent to satisfy different requirements without adding hardware. The implementation could be easily propagated to future FPGA generations and/or to custom application-specific integrated circuits.

Aranki, Nazeeh↗

FPGA NEPP : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for re-programmable field programmable gate arrays (FPGAs). The FY09 task was divided into three efforts: 1. Device physics-based design modifications 2. Contention study of Xilinx Virtex-4 3. IDDQ study of Actel A54SX The FY09 NEPP FPGA study was organized into these three sections in recognition of the continued and increasing importance of FPGAs to NASA. FPGAs represent the state of the art in electronic components with millions and millions of transistors integrated into a single device. Modern NASA spacecraft design has dozens and dozens of FPGAs implemented onboard. FPGAs are used in critical command and data handling, instrument control and monitoring, and communications protocols, to name just a few. The reliability of FPGAs is fundamental to mission success for NASA.

Sheldon, Douglas↗

VIRTEX-4 VQ static SEU Characterization Summary

This report is the result of the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx SEE Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universities and national laboratories, combining resources to characterize reconfigurable FPGAs for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1-4. A notable exception is Ref. 5, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This report of upset susceptibility to heavy ions and protons of the static memory elements in the Virtex-4QV family is a direct parallel to the XRTC report on the thin epitaxial devices in the Virtex-2 family released four years ago.

field programmable gate array (FPGA)↗

RFI Risk Reduction Activities Using New Goddard Digital Radiometry Capabilities

The Goddard Radio-Frequency Explorer (GREX) is the latest fast-sampling radiometer digital back-end processor that will be used for radiometry and radio-frequency interference (RFI) surveying at Goddard Space Flight Center. The system is compact and deployable, with a mass of about 40 kilograms. It is intended to be flown on aircraft. GREX is compatible with almost any aircraft, including P-3, twin otter, C-23, C-130, G3, and G5 types. At a minimum, the system can function as a clone of the Soil Moisture Active Passive (SMAP) ground-based development unit [1], or can be a completely independent system that is interfaced to any radiometer, provided that frequency shifting to GREX's intermediate frequency is performed prior to sampling. If the radiometer RF is less than 200MHz, then the band can be sampled and acquired directly by the system. A key feature of GREX is its ability to simultaneously sample two polarization channels simultaneously at up to 400MSPS, 14-bit resolution each. The sampled signals can be recorded continuously to a 23 TB solid-state RAID storage array. Data captures can be analyzed offline using the supercomputing facilities at Goddard Space Flight Center. In addition, various Field Programmable Gate Array (FPGA) - amenable radiometer signal processing and RFI detection algorithms can be implemented directly on the GREX system because it includes a high-capacity Xilinx Virtex-5 FPGA prototyping system that is user customizable.

Bradley, Damon↗

NASA Accelerates SpaceCube Technology into Orbit

On May 11, 2009, STS-125 Space Shuttle Atlantis blasted off from Kennedy Space Center on a historic mission to service the Hubble Space Telescope (HST). In addition to sending up the hardware and tools required to repair the observatory, the servicing team at NASA's Goddard Space Flight Center also sent along a complex experimental payload called Relative Navigation Sensors (RNS). The main objective of the RNS payload was to provide real-time image tracking of HST during rendezvous and docking operations. RNS was a complete success, and was brought to life by four Xilinx FPGAs (Field Programmable Gate Arrays) tightly packed into one integrated computer called SpaceCube. SpaceCube is a compact, reconfigurable, multiprocessor computing platform for space applications demanding extreme processing capabilities based on Xilinx Virtex 4 FX60 FPGAs. In a matter of months, the concept quickly went from the white board to a fully funded flight project. The 4-inch by 4-inch SpaceCube processor card was prototyped by a group of Goddard engineers using internal research funding. Once engineers were able to demonstrate the processing power of SpaceCube to NASA, HST management stood behind the product and invested in a flight qualified version, inserting it into the heart of the RNS system. With the determination of putting Xilinx into space, the team strengthened to a small army and delivered a fully functional, space qualified system to the mission.

Petrick, David↗