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At least 37 records · Page 2

The 1992/93 eclipse of 31 Cygni

Extensive new ultraviolet and optical spectra of an atmospheric eclipse define the physical properties throughout the wind and chromosphere of 31 Cyg. These data require mass loss of approximately 3 x 10(exp -8) solar masses/yr in a wind that may merge smoothly into the chromosphere. Considerations of how energy is injected into the wind, however, suggest that the chromosphere and wind are separate structures. Most, if not all, of the velocity structure in metallic lines, which we have heretofore simulated with Doppler widths in the range 15-25 km/s, results from differential expansion of the atmosphere. Electron densities in the inner R(sub star) of the chromosphere are in the range 1.5 x 10(exp 9) - 2 x 10(exp 8)/cu cm, which implies clumping of the gas. The ionization of oxygen and nitrogen is consistent with clumping by factors of 3-30 in the outer chromosphere, roughly the amount required to give enough gas pressure to support the chromosphere. Chromospheric gas in 31 Cyg becomes hotter with increasing height, thus with decreasing optical depth, in a way that seems similar for all the zeta Aur binaries. Excitation temperature for Fe II in 1992/93 rises from about 5000 K at the deepest points sampled to about 12,500 K high in the wind. Strengths of violet Balmer lines give an excitation temperature for hydrogen of 6200-6500 K above a radial mass column density of approximately 0.01 g/sq cm. This amount of excitation implies that Lyman-alpha is thermalized beneath about 4 x 10(exp -3) g/sq cm. The outer atmosphere was symmetrical to within a factor of 2 in 1992/93, although it was clearly variable at this level, and it had similar mass column densities as in 1982. One manifestation of the variability was a flow toward the B star at phases 0.013-0.022 spanning velocities 45-100 km/s. Several lines of evidence point to a complicated and variable ionization in the wind: At large distance from the K star, measured mass column densities are less by up to a factor of 3 than required by a smoothly flowing wind. Also, much of the gas beyond r = 350 solar radii = 1.75 R(sub star) has a negative radial velocity. Radial velocities of the shell lines imply the outer atmosphere rotates in the direction of orbital motion, possibly through the deflection of wind flow lines in this direction.

Eaton, Joel A.↗

Winds and accretion in delta Sagittae

The ten-year binary delta Sge (M2 Ib-II+B9.5 V) is a zeta Aur binary containing an abnormally cool component. Combining our analysis of the system as a visual binary with Batten's radial-velocity solution leads to the following properties: i = 40 deg, a = 51 mas = 8.83 A.U. = 1893 solar radius, hence d = 173 pc; M(sub B) = 2.9 solar mass and M(sub M) = 3.8 solar mass; and R(sub B) = 2.6 solar radius and R(sub M) = 152 solar radius. This interpretation of the orbit places the M supergiant on the asymptotic giant branch. We have collected ultraviolet spectra throughout the star's 1980-90 orbit, concentrated around the conjuction of 1990. The wind of the M giant appears in these as narrow shell lines of singly ionized metals, chiefly Fe II, with P-Cyg profiles at many phases, which show the slow variation in strength expected for the orbit but no pronounced atmospheric eclipse. The terminal velocity of the wind is 16-18 km/s, and its excitation temperature is approximately 10,000 K. Most of the broadening of the wind lines is caused by differential expansion of the atmosphere, with (unmeasurably) low turbulent velocities. Nontheless, the mass loss rate (1.1 +/- 0.4 X 10 (exp -8) solar mas/yr) is almost the same as found previously by Reimers and Schroder for very different assumptions about the velocity structure. Also seen in the spectrum throughout the orbit are the effects of a variable, high-speed wind as well as evidence for accretion onto the B9.5 star. This high-speed wind absorbs in species of all ionization stages observed, e. g., C II, Mg II, Al III, SI IV, C IV, and has a terminaal velocity in the range 200-450 km/s. We presume this wind originates at the B dwarf, not the M supergiant, and speculate that it comes from an accretion disk, as suggested by recent models of magnetically moderated accretion. Evidence for accretion is redshifted absorption in the same transitions formed in the high-speed wind, as well as broad emission lines of singly ionized metals. This emission seems to be scattered out of the continuum of the B star. Finally, we discuss Auger ionization by accretion luminosity as the cause of the high ionization in these high-speed flows as well as the source of the extended circumstellar clouds of Si(3+) and C(3+) ions in zeta Aur binaries.

Eaton, Joel A.↗

A New Kind of Curing

A new curing method using automated tape placement (ATP) with electron beam (EB), or e-beam, produces a combination known as in situ e-beam curing. Through a Small Business Innovation Research (SBIR) contract from NASA's Marshall Space Flight Center, Science Research Laboratory, Inc., created the in situ e-beam curing technique, which uses a low-energy electron beam gun to cure various composite materials. One important benefit is the technique's utilization of room temperature curing, which lessens the chance of mismatching the thermal expansion coefficients of different materials. For instance, metals and composites will expand at different rates when heated, but the low-energy e-beam gun reduces the expansion differential. Using a low-energy gun also results in less x-ray shielding, significantly reduced capital costs, reduced facility space, and increased processing capabilities for larger parts. However, using a low-energy gun also means that each tape layer is treated individually because the gun can penetrate only one layer at a time. The e-beam gun emits lower energy x-rays, which are more easily shielded than those emitted by previous guns. The low-energy system is relatively portable due to its light weight and small size. The gun weighs about 70 pounds and can be easily mounted on a robotic arm or an ATP head.

Source record↗

Impact of Thermal Gradients on Wind Tunnel Force Measurements

In a wind tunnel facility, the direct measurement of forces and moments induced on the model are performed by a force measurement balance. The measurement balance is a precision-machined device that has strain gages at strategic locations to measure the strain (i.e., deformations) due to applied forces and moments. The strain gages convert the strain (and hence the applied force) to an electrical voltage that is measured by external meters. Thermal gradients can complicate the process, however. Thermal gradients on the balance cause differential expansion (or contraction) of various parts of the balance that induce a strain that is detected by the strain gages and is indistinguishable from an external applied force. The thermal gradients can result when testing is done at elevated temperatures or at cryogenic temperatures such as at the National Transonic Facility (NTF) at NASA Langley Research Center (LaRC).

Hereford, James↗

Solder Creep-Fatigue Interactions with Flexible Leaded Part

In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

creep effects↗

Rigid collapsible dish structure

A collapsible dish structure composed of a plurality of rows of rigid radial petal assemblies concentric with the axis of the dish. The petal assemblies consist of a center petal and two side petals, the center petal hinged on an axis tangent to a circle concentric with the axis of the dish and the side petals hinged to the center petal at their mating edge. The center petal is foldable inwardly and the side petals rotate about their hinges such that the collapsed dish structure occupies a much smaller volume than the deployed dish. Means of controlling the shape of the dish to compensate for differential expansion of the deployed dish are also provided.

Palmer, William B.↗

Experimental and Computational Validation of a Novel Particle Flow Control Valve for CSP Systems

Particle-based Concentrated Solar Power (CSP) systems most often utilize the state-of-the art slide gate mechanism for particle flow control. The slide-gate was found to have a sensitivity of 0.354 g/s-mm, a measure of mass flow rate over actuation position [1]. Particle-based CSP developers have noted that the slide gate is conducive to particle lodging, leaking, and difficulty actuating under particle pressure as well as differential expansion of the gate from thermal cycling. The goal of this work is to design, develop and test a novel particle flow control device that can operate without any hindrance from these shortcomings.

14 SOLAR ENERGY↗

Modeling of SiC Lateral Resonant Devices Over a Broad Temperature Range

Finite-element analysis (FEA) modal results of 3C-SiC lateral resonant devices anchored to a Si substrate are presented as resonant frequency versus temperature. The suspended elements are etched from a 2 micron, 3C-SiC film grown at 1600 K on a 500 micron-thick, Si substrate. The analysis includes, temperature-dependent properties, shape change due to volume expansion with temperature, and thermal stress caused by differential thermal expansion of different materials. Two designs are considered: type I has anchor locations close to the geometric centroid and a small shuttle; type 11 has a large shuttle with anchors far from the centroid, The resonant frequency decreases approximately 3.5% over a 1000 K temperature increase for the type-I device, and behaves according to theory. The resonant frequency of the type-11 device decreases by 2% over the first 400 K, then rises slightly over the remaining 600 K. This device deviates from theory because of the high thermal stress induced in the beams. The thermal stress is caused by the differential thermal expansion of the suspended element relative to the substrate. The results show that the device geometry must be properly chosen if the resonant frequency of that device will be used to calculate the temperature coefficient of Young's modulus. These results apply only to resonators of one material on a substrate of a different material.

DeAnna, Russell G.↗

Reliability of hybrid microcircuit bonding

Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.

Caruso, S. V.↗

Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

DeAnna, Russell G.↗

Thermal expansion method for lining tantalum alloy tubing with tungsten

A differential-thermal expansion method was developed to line T-111 (tantalum - 8 percent tungsten - 2 percent hafnium) tubing with a tungsten diffusion barrier as part of a fuel element fabrication study for a space power nuclear reactor concept. This method uses a steel mandrel, which has a larger thermal expansion than T-111, to force the tungsten against the inside of the T-111 tube. Variables investigated include lining temperature, initial assembly gas size, and tube length. Linear integrity increased with increasing lining temperature and decreasing gap size. The method should have more general applicability where cylinders must be lined with a thin layer of a second material.

Watson, G. K.↗

Bearing-Mounting Concept Accommodates Thermal Expansion

Pins or splines allow radial expansion without slippage. Design concept for mounting rotary bearing accommodates differential thermal expansion between bearing and any structure(s) to which bearing connected. Prevents buildup of thermal stresses by allowing thermal expansion to occur freely but accommodating expansion in such way not to introduce looseness. Pin-in-slot configuration also maintains concentricity.

Nespodzany, Robert↗

Silicon Holder For Molecular-Beam Epitaxy

Simple assembly of silicon wafers holds silicon-based charge-coupled device (CCD) during postprocessing in which silicon deposited by molecular-beam epitaxy. Attains temperatures similar to CCD, so hotspots suppressed. Coefficients of thermal expansion of holder and CCD equal, so thermal stresses caused by differential thermal expansion and contraction do not develop. Holder readily fabricated, by standard silicon processing techniques, to accommodate various CCD geometries. Silicon does not contaminate CCD or molecular-beam-epitaxy vacuum chamber.

Hoenk, Michael E.↗

High-temperature chemical expansion of Pr0.1Ce0.9O2-δ thin films determined by Differential Laser Doppler Vibrometry

The chemical expansion of thin-film praseodymium-cerium oxide solid solutions (Pr 0.1 Ce 0.9 O 2-δ , PCO10) is investigated at temperatures ranging from 500 °C to 800 °C and oxygen activities down to about 10 -22 . Differential Laser Doppler Vibrometry (D-LDV) in combination with periodic electrochemical pumping of oxygen is used to detect very small displacements of the sample surface. With decreasing pumping frequency, the film approaches chemical equilibrium, which is nearly reached at 700 °C below 0.01 Hz. D-LDV enables direct measurement of film thickness changes as well as the bending of the underlying substrates due electrochemically induced lateral mechanical stress. The substrate bending is found to be more than an order of magnitude larger than the film thickness change, increasing the detection limit by the same factor. The thickness change of the thin film is calculated from the measured displacement of the sample surface and compared with directly measured values. Thin-film literature data available for low oxygen activities up to 650 °C agree with our measurements. In addition, the thickness change of the film is determined from the displacement at different sample positions, which validates previous measurements. Finally, thin film chemical expansion is found to be larger by a factor of about 2 than the corresponding bulk value in agreement with predictions from a mechanical model that the out-of-plane expansion of a constrained film is increased.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Expansion Compression Contacts for Thermoelectric Legs

In a proposed alternative to previous approaches to making hot-shoe contacts to the legs of thermoelectric devices, one relies on differential thermal expansion to increase contact pressures for the purpose of reducing the electrical resistances of contacts as temperatures increase. The proposed approach is particularly applicable to thermoelectric devices containing p-type (positive-charge-carrier) legs made of a Zintl compound (specifically, Yb14MnSb11) and n-type (negative charge-carrier) legs made of SiGe. This combination of thermoelectric materials has been selected for further development, primarily on the basis of projected thermoelectric performance. However, it is problematic to integrate, into a practical thermoelectric device, legs made of these materials along with a metal or semiconductor hot shoe that is required to be in thermal and electrical contact with the legs. This is partly because of the thermal-expansion mismatch of these materials: The coefficient of thermal expansion (CTE) of SiGe is 4.5 x 10(exp -6) C (exp -1), while the CTE of Yb14MnSb11 is 20 x 10(exp -6) C(exp -1). Simply joining a Yb14MnSb11 and a SiGe leg to a common hot shoe could be expected to result in significant thermal stresses in either or both legs during operation. Heretofore, such thermal stresses have been regarded as disadvantageous. In the proposed approach, stresses resulting from the CTE mismatch would be turned to advantage.

Sakamoto, Jeffrey↗