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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

A New Kind of Curing

A new curing method using automated tape placement (ATP) with electron beam (EB), or e-beam, produces a combination known as in situ e-beam curing. Through a Small Business Innovation Research (SBIR) contract from NASA's Marshall Space Flight Center, Science Research Laboratory, Inc., created the in situ e-beam curing technique, which uses a low-energy electron beam gun to cure various composite materials. One important benefit is the technique's utilization of room temperature curing, which lessens the chance of mismatching the thermal expansion coefficients of different materials. For instance, metals and composites will expand at different rates when heated, but the low-energy e-beam gun reduces the expansion differential. Using a low-energy gun also results in less x-ray shielding, significantly reduced capital costs, reduced facility space, and increased processing capabilities for larger parts. However, using a low-energy gun also means that each tape layer is treated individually because the gun can penetrate only one layer at a time. The e-beam gun emits lower energy x-rays, which are more easily shielded than those emitted by previous guns. The low-energy system is relatively portable due to its light weight and small size. The gun weighs about 70 pounds and can be easily mounted on a robotic arm or an ATP head.

Source record↗
NASA NTRS1999

Impact of Thermal Gradients on Wind Tunnel Force Measurements

In a wind tunnel facility, the direct measurement of forces and moments induced on the model are performed by a force measurement balance. The measurement balance is a precision-machined device that has strain gages at strategic locations to measure the strain (i.e., deformations) due to applied forces and moments. The strain gages convert the strain (and hence the applied force) to an electrical voltage that is measured by external meters. Thermal gradients can complicate the process, however. Thermal gradients on the balance cause differential expansion (or contraction) of various parts of the balance that induce a strain that is detected by the strain gages and is indistinguishable from an external applied force. The thermal gradients can result when testing is done at elevated temperatures or at cryogenic temperatures such as at the National Transonic Facility (NTF) at NASA Langley Research Center (LaRC).

Hereford, James↗
NASA NTRS1994

Solder Creep-Fatigue Interactions with Flexible Leaded Part

In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

creep effects↗
NASA NTRS1982

Rigid collapsible dish structure

A collapsible dish structure composed of a plurality of rows of rigid radial petal assemblies concentric with the axis of the dish. The petal assemblies consist of a center petal and two side petals, the center petal hinged on an axis tangent to a circle concentric with the axis of the dish and the side petals hinged to the center petal at their mating edge. The center petal is foldable inwardly and the side petals rotate about their hinges such that the collapsed dish structure occupies a much smaller volume than the deployed dish. Means of controlling the shape of the dish to compensate for differential expansion of the deployed dish are also provided.

Palmer, William B.↗
NASA NTRS1999

Modeling of SiC Lateral Resonant Devices Over a Broad Temperature Range

Finite-element analysis (FEA) modal results of 3C-SiC lateral resonant devices anchored to a Si substrate are presented as resonant frequency versus temperature. The suspended elements are etched from a 2 micron, 3C-SiC film grown at 1600 K on a 500 micron-thick, Si substrate. The analysis includes, temperature-dependent properties, shape change due to volume expansion with temperature, and thermal stress caused by differential thermal expansion of different materials. Two designs are considered: type I has anchor locations close to the geometric centroid and a small shuttle; type 11 has a large shuttle with anchors far from the centroid, The resonant frequency decreases approximately 3.5% over a 1000 K temperature increase for the type-I device, and behaves according to theory. The resonant frequency of the type-11 device decreases by 2% over the first 400 K, then rises slightly over the remaining 600 K. This device deviates from theory because of the high thermal stress induced in the beams. The thermal stress is caused by the differential thermal expansion of the suspended element relative to the substrate. The results show that the device geometry must be properly chosen if the resonant frequency of that device will be used to calculate the temperature coefficient of Young's modulus. These results apply only to resonators of one material on a substrate of a different material.

DeAnna, Russell G.↗
NASA NTRS1976

Reliability of hybrid microcircuit bonding

Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.

Caruso, S. V.↗
NASA NTRS1998

Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

DeAnna, Russell G.↗
NASA NTRS1973

Thermal expansion method for lining tantalum alloy tubing with tungsten

A differential-thermal expansion method was developed to line T-111 (tantalum - 8 percent tungsten - 2 percent hafnium) tubing with a tungsten diffusion barrier as part of a fuel element fabrication study for a space power nuclear reactor concept. This method uses a steel mandrel, which has a larger thermal expansion than T-111, to force the tungsten against the inside of the T-111 tube. Variables investigated include lining temperature, initial assembly gas size, and tube length. Linear integrity increased with increasing lining temperature and decreasing gap size. The method should have more general applicability where cylinders must be lined with a thin layer of a second material.

Watson, G. K.↗
NASA NTRS1995

Bearing-Mounting Concept Accommodates Thermal Expansion

Pins or splines allow radial expansion without slippage. Design concept for mounting rotary bearing accommodates differential thermal expansion between bearing and any structure(s) to which bearing connected. Prevents buildup of thermal stresses by allowing thermal expansion to occur freely but accommodating expansion in such way not to introduce looseness. Pin-in-slot configuration also maintains concentricity.

Nespodzany, Robert↗
NASA NTRS1993

Silicon Holder For Molecular-Beam Epitaxy

Simple assembly of silicon wafers holds silicon-based charge-coupled device (CCD) during postprocessing in which silicon deposited by molecular-beam epitaxy. Attains temperatures similar to CCD, so hotspots suppressed. Coefficients of thermal expansion of holder and CCD equal, so thermal stresses caused by differential thermal expansion and contraction do not develop. Holder readily fabricated, by standard silicon processing techniques, to accommodate various CCD geometries. Silicon does not contaminate CCD or molecular-beam-epitaxy vacuum chamber.

Hoenk, Michael E.↗
NASA NTRS2009

Expansion Compression Contacts for Thermoelectric Legs

In a proposed alternative to previous approaches to making hot-shoe contacts to the legs of thermoelectric devices, one relies on differential thermal expansion to increase contact pressures for the purpose of reducing the electrical resistances of contacts as temperatures increase. The proposed approach is particularly applicable to thermoelectric devices containing p-type (positive-charge-carrier) legs made of a Zintl compound (specifically, Yb14MnSb11) and n-type (negative charge-carrier) legs made of SiGe. This combination of thermoelectric materials has been selected for further development, primarily on the basis of projected thermoelectric performance. However, it is problematic to integrate, into a practical thermoelectric device, legs made of these materials along with a metal or semiconductor hot shoe that is required to be in thermal and electrical contact with the legs. This is partly because of the thermal-expansion mismatch of these materials: The coefficient of thermal expansion (CTE) of SiGe is 4.5 x 10(exp -6) C (exp -1), while the CTE of Yb14MnSb11 is 20 x 10(exp -6) C(exp -1). Simply joining a Yb14MnSb11 and a SiGe leg to a common hot shoe could be expected to result in significant thermal stresses in either or both legs during operation. Heretofore, such thermal stresses have been regarded as disadvantageous. In the proposed approach, stresses resulting from the CTE mismatch would be turned to advantage.

Sakamoto, Jeffrey↗
NASA NTRS1989

Making Large Composite Vessels Without Autoclaves

Method for making fiber-reinforced composite structure relies on heating and differential thermal expansion to provide temperature and pressure necessary to develop full strength, without having to place structure in large, expensive autoclave. Layers of differentially expanding material squeeze fiber-reinforce composite between them when heated. Method suitable for such cylindrical structures as pressure vessels and tanks. Used for both resin-matrix and metal-matrix composites.

Sigur, W. A.↗
NASA NTRS1990

Thermal compensating mount

The main objective is to provide a device for maintaining the alignment integrity of an alignment sensitive component over a wide range of temperatures. A thermal compensating mount is presented. A cylindrical extension is integrally formed to the alignment sensitive component. Both the extension and component share the same coefficient of thermal expansion. The cylindrical extension is placed into a mounting structure which has a diameter greater than that of the extension. An adhesive secures the cylindrical extension to the mount. The difference between the diameters of the cylindrical extension and the cylindrical receptacle is such that the differential thermal expansion across the extension and the receptacle edges is exactly compensated for by the thermal compensation of the adhesive between them. Accordingly, the alignment sensitive component does not change position when subjected to temperature variations. One application of this invention is laser optical-path folding prisms, which are fixed to the mounting surface by a small amount of epoxy adhesive.

Jalink, Antony, Jr.↗
NASA NTRS1981

The effect of thermal cycling to 1100 C on the alpha /Mo/ phase in directionally solidified gamma/gamma-prime-alpha alloys

Specimens of gamma/gamma-prime-alpha (Mo) eutectic alloy were thermally cycled or isothermally exposed at temperatures of 1075 to 1100 C. Transmission electron microscopy examination of cycled specimens indicated that even an exposure of 10 minutes effected noticeable changes in the shape of the alpha phase, and that the changes were cumulative as more cycles were added. The cross sections of fine, smooth fibers changed from rectangles to octagons, while lamellae and irregular shapes spheroidized. These effects are attributed to the differences in thermal expansion coefficients between the alpha phase and the gamma/gamma-prime matrix, and to the higher diffusion rates prevailing at elevated temperatures. Where the configuration of the alpha phase is a simple shape, such as a fiber, increasing the temperature eventually brings about a stress free interface between the alpha phase and the matrix by differential thermal expansion. Where the shape of the alpha phase is more complex, a stressed interface persists to higher temperatures where diffusion produces the more drastic morphological changes.

Harf, F. H.↗
NASA NTRS2004

Thermally Conductive Metal-Tube/Carbon-Composite Joints

An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

Copeland, Robert J.↗