SEARCH · Search NASA
Results for “microelectromechanical systems”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Microelectromechanical Systems (MEMS) Technology Integration Into Microspacecraft
The need to significantly reduce the mass, power, and volume of future scientific spacecraft has resulted in an increased interest on the part of NASA in the relatively new technology of microelectro- mechanical systems (MEMS). In addition to being light, compact and low-power-consuming, this technology offers other advantages to space applications, such as high performance solid-state reliability.
Low-Loss, High-Isolation Microwave Microelectromechanical Systems (MEMS) Switches Being Developed
Switches, electrical components that either permit or prevent the flow of electricity, are the most important and widely used electrical devices in integrated circuits. In microwave systems, switches are required for switching between the transmitter and receiver; in communication systems, they are needed for phase shifters in phased-array antennas, for radar and communication systems, and for the new class of digital or software definable radios. Ideally, switches would be lossless devices that did not depend on the electrical signal's frequency or power, and they would not consume electrical power to change from OFF to ON or to maintain one of these two states. Reality is quite different, especially at microwave frequencies. Typical switches in microwave integrated circuits are pin diodes or gallium arsenide (GaAs) field-effect transistors that are nonlinear, with characteristics that depend on the power of the signal. In addition, they are frequency-dependent, lossy, and require electrical power to maintain a certain state. A new type of component has been developed that overcomes most of these technical difficulties. Microelectromechanical (MEMS) switches rely on mechanical movement as a response to an applied electrical force to either transmit or reflect electrical signal power. The NASA Glenn Research Center has been actively developing MEMS for microwave applications for over the last 5 years. Complete fabrication procedures have been developed so that the moving parts of the switch can be released with near 100-percent yield. Moreover, the switches fabricated at Glenn have demonstrated state-of-the-art performance. A typical MEMS switch is shown. The switch extends over the signal and ground lines of a finite ground coplanar waveguide, a commonly used microwave transmission line. In the state shown, the switch is in the UP state and all the microwave power traveling along the transmission line proceeds unimpeded. When a potential difference is applied between the cantilever and the transmission line, the cantilever is pulled downward until it connects the signal line to the ground planes, creating a short circuit. In this state, all the microwave power is reflected. The graph shows the measured performance of the switch, which has less than 0.1 dB of insertion loss and greater than 30dB of isolation. These switches consume negligible electrical power and are extremely linear. Additional research is required to address reliability and to increase the switching speed.
Microelectromechanical Systems
Micro-electromechanical systems (MEMS) is an enabling technology that merges computation and communication with sensing and actuation to change the way people and machines interact with the physical world. MEMS is a manufacturing technology that will impact widespread applications including: miniature inertial measurement measurement units for competent munitions and personal navigation; distributed unattended sensors; mass data storage devices; miniature analytical instruments; embedded pressure sensors; non-invasive biomedical sensors; fiber-optics components and networks; distributed aerodynamic control; and on-demand structural strength. The long term goal of ARPA's MEMS program is to merge information processing with sensing and actuation to realize new systems and strategies for both perceiving and controlling systems, processes, and the environment. The MEMS program has three major thrusts: advanced devices and processes, system design, and infrastructure.
Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications
MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.
Microelectromechanical Systems (MEMS) Actuator for Reconfigurable Patch Antenna Demonstrated
A microstrip patch antenna with two contact actuators along the radiating edges for frequency reconfiguration was demonstrated at K-band frequencies. The layout of the antenna is shown in the following figure. This antenna has the following advantages over conventional semiconductor varactor-diode-tuned patch antennas: 1. By eliminating the semiconductor diode and its nonlinear I-V characteristics, the antenna minimizes intermodulation signal distortion. This is particularly important in digital wireless systems, which are sensitive to intersymbol interference caused by intermodulation products. 2. Because the MEMS actuator is an electrostatic device, it does not draw any current during operation and, hence, requires a negligible amount of power for actuation. This is an important advantage for hand-held, battery-operated, portable wireless systems since the battery does not need to be charged frequently. 3. The MEMS actuator does not require any special epitaxial layers as in the case of diodes and, hence, is cost effective.
Microelectromechanical Systems (MEMS) Actuator-Based, Polarization Reconfigurable Patch Antenna Demonstrated
A nearly square patch antenna with a contact actuator along a radiating edge for polarization reconfiguration was demonstrated at Ka-band frequencies at the NASA Glenn Research Center. The layout of the antenna is shown in the following sketch. This antenna has the following advantages: 1) It can be dynamically reconfigured to receive and transmit a linearly polarized signal or a circularly polarized signal. This feature allows the substitution of multiple antennas on a satellite by a single antenna, thereby resulting in significant cost savings. 2) In our approach, the polarization is switched between the two states without affecting the frequency of operation; thus, valuable frequency spectrum is conserved. 3) The ability to switch polarization also helps mitigate propagation effects due to adverse weather on the performance of a satellite-to-ground link. Hence, polarization reconfigurability enhances link reliability.
Microelectromechanical Systems (MEMS) Broadband Light Source Developed
A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.
Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS
MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.
Fabrication and Characterization of Giant Magnetoresistive (GMR) Sensor Microelectromechanical System (MEMS) Device
This paper discusses the fabrication aspects of a sensor device that is based on a sputter deposited multilayer giant magnetoresistive (GMR) sensor. The device consists of a micromachined microstructure (membrane), GMR sensor, and a sputtered hard magnetic thin film element on to microstructure.
Giant Magnetoresistive (GMR) Sensor Microelectromechanical System (MEMS) Device
The measurement of acceleration has been accomplished using several technologies in high-reliability applications such as guidance control, detonation, and shock/vibration measurement. Electromechanical, piezoelectric, piezoresistive, and capacitive acceleration sensors are available and the literature pertinent to giant magnetoresistive sensors (GMR) for the above applications are scanty.
Giant Magnetoresistive (GMR) Sensor Microelectromechanical System (MEMS) Device for Nondestructive Evaluation (NDE) Health Monitoring Applications for International Space Station (ISS)
This paper discusses the fabrication aspects of an accelerometer device that is based on a sputter deposited, multilayer, and giant magnetoresistive field sensor.
Giant Magnetoresistive (GMR) Sensor Microelectromechanical System (MEMS) Device for Nondestructive Evaluation (NDE) Health Monitoring Applications for International Space Station (ISS)
This paper discusses the fabrication aspects of a sensor device that is based on a sputter deposited, multilayer, giant magnetoresistive field sensor.
Technical Challenges in Reliable MicroelectroniCs Packaging of Microelectromechanical Systems (MEMS) for Space Applications
MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc.
Assessment and Assurance of Microelectronics Packaging Technology of Microeletromechanical Systems (MEMS)
Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc.
Distributed Attitude Control and Maneuvering for Deep Space SmallSats
The aim of the Distributed Attitude Control and Maneuvering for Deep Space SmallSats project is to advance a multi-purpose, deep space mission-enabling technology for low-power attitude and thermal control of small satellites to a flight demonstration technology readiness level (TRL). The film-evaporation microelectromechanical systems tunable array (FEMTA) small satellite technology combines innovative microelectromechanical systems (MEMS) microfabrication and microscale effects in fluid surface tension to produce a thermally actuated capillary valve. Using water as the propellant, the FEMTA thruster can generate finely controllable thrust at a thrust to power ratio of about 200 microNewton per Watt (W).
Light-Driven Polymeric Bimorph Actuators
Light-driven polymeric bimorph actuators are being developed as alternatives to prior electrically and optically driven actuators in advanced, highly miniaturized devices and systems exemplified by microelectromechanical systems (MEMS), micro-electro-optical-mechanical systems (MEOMS), and sensor and actuator arrays in smart structures. These light-driven polymeric bimorph actuators are intended to satisfy a need for actuators that (1) in comparison with the prior actuators, are simpler and less power-hungry; (2) can be driven by low-power visible or mid-infrared light delivered through conventional optic fibers; and (3) are suitable for integration with optical sensors and multiple actuators of the same or different type. The immediate predecessors of the present light-driven polymeric bimorph actuators are bimorph actuators that exploit a photorestrictive effect in lead lanthanum zirconate titanate (PLZT) ceramics. The disadvantages of the PLZT-based actuators are that (1) it is difficult to shape the PLZT ceramics, which are hard and brittle; (2) for actuation, it is necessary to use ultraviolet light (wavelengths < 380 nm), which must be generated by use of high-power, high-pressure arc lamps or lasers; (3) it is difficult to deliver sufficient ultraviolet light through conventional optical fibers because of significant losses in the fibers; (4) the response times of the PLZT actuators are of the order of several seconds unacceptably long for typical applications; and (5) the maximum mechanical displacements of the PLZT-based actuators are limited to those characterized by low strains beyond which PLZT ceramics disintegrate because of their brittleness. The basic element of a light-driven bimorph actuator of the present developmental type is a cantilever beam comprising two layers, at least one of which is a polymer that exhibits a photomechanical effect (see figure). The dominant mechanism of the photomechanical effect is a photothermal one: absorption of light energy causes heating, which, in turn, causes thermal expansion.