Novel Techniques for Millimeter Wave Packages
A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented.
millimeter-wave↗
SEARCH · Search NASA
Results for “PACKAGING”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Laser-welded packaging of a Nd:YAG laser for space applications
This paper describes the fabrication of a rugged, laser-welded package for a 200mW, monolithic diode-pumped solid state Nd:YAG laser operating at 1319nm.
laser↗
Chip Scale Package Issues
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
solder↗
Chip Scale Package Integrity Assessment by Isothermal Aging
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
chipscale↗
Chip Scale Package Implementation Challenges
The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chipscale↗
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
CSP↗
PHM Society Conference Tutorial Session 1: A Guide to NASA The NASA Python Prognostics Packages
A guide to NASA Python Prognostics Packages
Prognostics↗
New package for Belleville spring permits rate change, easy disassembly
A spring package, with grooves to hold the spring washers at the inner and outer edges, reduces hysteresis to a minimum. Three-segment retainers permit easy disassembly so that the spring rate can be changed.
Mac Glashan, W. F.↗
Modular thermoelectric cell is easily packaged in various arrays
Modular thermoelectric cells are easily packaged in various arrays to form power supplies and have desirable voltage and current output characteristics. The cells employ two pairs of thermoelectric elements, each pair being connected in parallel between two sets of aluminum plates. They can be used as solar energy conversion devices.
Epstein, J.↗
Self-inflating lifevest stores in small package
Emergency lifevest is inflated with carbon dioxide from a self-contained cartridge in 10 seconds. When deflated, it fits into a package occupying less than 20 cubic inches and weighing less than one pound.
Radnofsky, M. I.↗
Rugged microelectronic module package supports circuitry on heat sink
Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.
Johnson, A. L.↗
TREETRAN - A Fortran IV subroutine package for manipulation of rooted trees
Fortran IV subroutine package for manipulation of rooted trees - Treetran
TREE↗
Input-output subroutine package UOM IOS FOR the IBM 7090/7094
Input-output subroutine package for IBM 7090/7094 computer monitoring systems
COMPUTER PROGRAM↗
Design and fabrication of a Brayton-cycle turbine research package
Brayton cycle compressor research package for testing aerodynamic performance of Brayton cycle compressors, with equipment specifications
BRAYTON CYCLE↗
Unmanned extravehicular environments operation qualification test of the Gemini extravehicular support package and extended umbilical Test plan
Gemini extravehicular support package tests for unmanned part of extravehicular environments operation qualification test program
GEMINI PROJECT↗
Abstracts of digital computer code packages assembled by the Radiation Shielding Information Center
Abstracts of digital computer code packages for radiation shielding calculations
RADIATION SHIELDING↗
Elastic guides reduce hysteresis effect in Belleville spring package
Peripheral support guides that elastically flex with the slight breathing on radial displacement during actuation can greatly reduce the hysteresis present in a Belleville spring package. This technique provides a control device that enhances the precision of pressure regulating valves, pressure switches, and vacuum actuators.
Mc Glashan, W. F., Jr.↗
Flame sprayed dielectric coatings improve heat dissipation in electronic packaging
Heat sinks in electronic packaging can be flame sprayed with dielectric coatings of alumina or beryllia and finished off with an organic sealer to provide high heat and electrical resistivity.
Mackay, T. L.↗