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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 361 records · Page 20

A Combined Computational, Experimental, and Technology Development Approach to In-Space Laser Manufacturing Maturation at NASA Marshall Space Flight Center

In-space manufacturing (ISM) is emerging as a field vital to continued access and capabilities in the space environment. NASA Marshall Space Flight Center (MSFC) is advancing the frontier of in-space laser manufacturing (ISLM) techniques through work initially focused on maturing laser beam welding (LBW) and laser forming (LF) for use in space. Such techniques proffer the ability to assemble and join structures in space from sheet metal or other stock – extant satellites, in situ resource utilization of Lunar regolith, etc. – by forming to desired shapes and then joining via in-space welding (ISW). ISLM processes are useful for assembly, joining, modification, and repair of structures in free space and on the Lunar surface such as large observatories, antennas, trusses, blast/thermal/radiation shields, pressure vessels, and more. However, these techniques are not yet qualified & certified (Q&C) for regular application in space. It would be prohibitively expensive, laborious, and time-consuming to perform Q&C via traditional experimental approaches as data collection & experimentation in space is resource-intensive. As such, benchmark experiments and focused, properly instrumented technology demonstration efforts in space can collect sufficient data that – when combined with verified computational models in an integrated computational materials engineering (ICME) approach – can validate ICME tools capable of translating more readily obtained ground data to in-space, in situ, computationally informed Q&C of ISLM techniques. Several ISLM projects at MSFC are obtaining the data required to validate ICME tools through both ground and flight experiments. A parabolic flight experiment of LBW under vacuum is manifested for August 2024, including both microgravity and Lunar gravity profiles. This collaboration with the Ohio State University is investigating common aerospace alloys such as 316L stainless steel, 2219 aluminum alloy, and Ti64 titanium alloy. In situ data collection includes videography, thermography, and reference thermocouples to build a thermal model of the welds. This will elucidate the relevant physics when combined with post-flight microstructural examination and mechanical testing. MSFC is also progressing towards a suborbital flight experiment of LBW under vacuum, which could provide reams of data on ISW during sustained, high-quality reduced gravity. The effect of combined thermal (cryogenic and high-temperature) and vacuum exposure on both LBW (NASA-funded) and LF (DARPA-funded) is being investigated through ground experiments. In addition to the copious data collected during these ground experiments, ruggedization of LBW hardware will also be pursued. The datasets from these experiments will be used to validate computational models which will inform future ISLM efforts in an ICME framework. A variety of techniques across lengths scales, from CALPHAD-driven thermodynamics & kinetics to phase field modeling of solidification to kinetic Monte Carlo simulations of grain evolution at the mesoscale, will be employed to accelerate the infusion and eventual Q&C of LBW and LF for use in space. The development of data-driven surrogate models to bridge ground to flight experiments and thereby reduce the need for resource-intensive experiments in space will also be investigated. These ICME techniques, surrogate models, and datasets from ground testing can also be employed to advance manufacturing in terrestrial environments.

in-space welding↗

Robotic space construction

Research at Langley AFB concerning automated space assembly is reviewed, including a Space Shuttle experiment to test astronaut ability to assemble a repetitive truss structure, testing the use of teleoperated manipulators to construct the Assembly Concept for Construction of Erectable Space Structures I truss, and assessment of the basic characteristics of manipulator assembly operations. Other research topics include the simultaneous coordinated control of dual-arm manipulators and the automated assembly of candidate Space Station trusses. Consideration is given to the construction of an Automated Space Assembly Laboratory to study and develop the algorithms, procedures, special purpose hardware, and processes needed for automated truss assembly.

Mixon, Randolph W.↗

Traffic model for commercial payloads in the Materials Experiment Assembly (MEA)

One hundred individuals representing universities, technical institutes, government agencies, and industrial facilities were surveyed to determine potential commercial use of a self-contained, automated assembly for the space processing of materials during frequent shuttle flights for the 1981 to 1987 period. The approach used and the results of the study are summarized. A time time-phased projection (traffic model) of commercial usage of the materials experiment assembly is provided.

Tietzel, F. A.↗

Process Development for Automated Solar Cell and Module Production. Task 4: Automated Array Assembly

A baseline sequence for the manufacture of solar cell modules was specified. Starting with silicon wafers, the process goes through damage etching, texture etching, junction formation, plasma edge etch, aluminum back surface field formation, and screen printed metallization to produce finished solar cells. The cells were then series connected on a ribbon and bonded into a finished glass tedlar module. A number of steps required additional developmental effort to verify technical and economic feasibility. These steps include texture etching, plasma edge etch, aluminum back surface field formation, array layup and interconnect, and module edge sealing and framing.

Source record↗

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

System integration and demonstration of adhesive bonded high temperature aluminum alloys for aerospace structure, phase 2

Adhesive bonding materials and processes were evaluated for assembly of future high-temperature aluminum alloy structural components such as may be used in high-speed civil transport aircraft and space launch vehicles. A number of candidate high-temperature adhesives were selected and screening tests were conducted using single lap shear specimens. The selected adhesives were then used to bond sandwich (titanium core) test specimens, adhesive toughness test specimens, and isothermally aged lap shear specimens. Moderate-to-high lap shear strengths were obtained from bonded high-temperature aluminum and silicon carbide particulate-reinforced (SiC(sub p)) aluminum specimens. Shear strengths typically exceeded 3500 to 4000 lb/in(sup 2) and flatwise tensile strengths exceeded 750 lb/in(sup 2) even at elevated temperatures (300 F) using a bismaleimide adhesive. All faceskin-to-core bonds displayed excellent tear strength. The existing production phosphoric acid anodize surface preparation process developed at Boeing was used, and gave good performance with all of the aluminum and silicon carbide particulate-reinforced aluminum alloys investigated. The results of this program support using bonded assemblies of high-temperature aluminum components in applications where bonding is often used (e.g., secondary structures and tear stoppers).

Falcone, Anthony↗

Integrated oxygen recovery system

Life Systems has conceptualized an innovative Integrated Oxygen Recovery System (IORS) applicable to advanced mission air revitalization. The IORS provides the capability to electrochemically generate metabolic oxygen (O2) and recover O2 from the space habitat atmosphere via a carbon dioxide (CO2) reduction process within a single assembly. To achieve this capability, the IORS utilizes a Solid Metal Cathode (SMC) water electrolysis unit that simultaneously serves as the Sabatier CO2 reduction reactor. The IORS enables two major life support systems currently baselined in closed loop air revitalization systems to be combined into one smaller, less complex system. This concept reduces fluidic and electrical interface requirements and eliminates a hydrogen (H2) interface. Life Systems is performing an evaluation of the IORS process directed at demonstrating performance and quantifying key physical characteristics including power, weight, and volume. Technical progress achieved during the first two months of the program is summarized.

Lee, M. Gene↗

Integrated oxygen recovery system

Life Systems has conceptualized an innovative Integrated Oxygen Recovery System (IORS) applicable to advanced mission air revitalization. The IORS provides the capability to electrochemically generate metabolic oxygen (O2) and recover O2 from the space habitat atmosphere via a carbon dioxide (CO2) reduction process within a single assembly. To achieve this capability, the IORS utilizes a Solid Metal Cathode (SMC) water electrolysis unit that simultaneously serves as the Sabatier CO2 reduction reactor. The IORS enables two major life support systems currently baselined in closed loop air revitalization systems to be combined into one smaller, less complex system. This concept reduces fluidic and electrical interface requirements and eliminates a hydrogen (H2) interface. Life Systems is performing an evaluation of the IORS process directed at demonstrating performance and quantifying key physical characteristics including power, weight, and volume. The results of the checkout, shakedown, and initial parametric tests are summarized.

Lee, M. Gene↗

Control of Technology Transfer at JPL

Controlled Technology: 1) Design: preliminary or critical design data, schematics, technical flow charts, SNV code/diagnostics, logic flow diagrams, wirelist, ICDs, detailed specifications or requirements. 2) Development: constraints, computations, configurations, technical analyses, acceptance criteria, anomaly resolution, detailed test plans, detailed technical proposals. 3) Production: process or how-to: assemble, operated, repair, maintain, modify. 4) Manufacturing: technical instructions, specific parts, specific materials, specific qualities, specific processes, specific flow. 5) Operations: how-to operate, contingency or standard operating plans, Ops handbooks. 6) Repair: repair instructions, troubleshooting schemes, detailed schematics. 7) Test: specific procedures, data, analysis, detailed test plan and retest plans, detailed anomaly resolutions, detailed failure causes and corrective actions, troubleshooting, trended test data, flight readiness data. 8) Maintenance: maintenance schedules and plans, methods for regular upkeep, overhaul instructions. 9) Modification: modification instructions, upgrades kit parts, including software

Jet Propulsion Laboratory (JPL)↗

Computer Tomography Analysis of Fastrac Composite Thrust Chamber Assemblies

Computed tomography (CT) inspection has been integrated into the production process for NASA's Fastrac composite thrust chamber assemblies (TCAs). CT has been proven to be uniquely qualified to detect the known critical flaw for these nozzles, liner cracks that are adjacent to debonds between the liner and overwrap. CT is also being used as a process monitoring tool through analysis of low density indications in the nozzle overwraps. 3d reconstruction of CT images to produce models of flawed areas is being used to give program engineers better insight into the location and nature of nozzle flaws.

Beshears, Ronald D.↗

Use of networked workstations for parallel nonlinear structural dynamic simulations of rotating bladed-disk assemblies

The principal objective of this research is to investigate, develop and demonstrate coarse-grained, parallel-processing strategies for nonlinear dynamic simulations for rotating bladed-disk assemblies. The parallel -processing strategies addressed include numerical algorithms for parallel nonlinear solutions and techniques to effect load balancing among processors. The parallel environment employed is a distributed-memory, coarse-grained one consisting of networked workstations. A parallel explicit time integration method has been implemented for transient nonlinear solutions of rotationg bladed-disk assemblies. Automatic domain partitioning techniques have been investigated for load balancing among processors. Advanced computing environments, data structures and interactive computer graphics all contribute to an integrated parallel finite element analysis system to facilitate more efficient and powerful dynamic simulations.

Hsieh, Shang-Hsien↗

Advanced planar array development for space station

The results of the Advanced Planar Array Development for the Space Station contract are presented. The original objectives of the contract were: (1) to develop a process for manufacturing superstrate assemblies, (2) to demonstrate superstrate technology through fabrication and test, (3) to develop and analyze a preliminary solar array wing design, and (4) to fabricate a wing segment based on wing design. The primary tasks completed were designing test modules, fabricating, and testing them. LMSC performed three tasks which included thermal cycle testing for 2000 thermal cycles, thermal balance testing at the Boeing Environmental Test Lab in Kent, Washington, and acceptance testing a 15 ft x 50 in panel segment for 100 thermal cycles. The surperstrate modules performed well during both thermal cycle testing and thermal balance testing. The successful completion of these tests demonstrate the technical feasibility of a solar array power system utilizing superstrate technology. This final report describes the major elements of this contract including the manufacturing process used to fabricate modules, the tests performed, and the results and conclusions of the tests.

Source record↗

Ground Processing Affordability for Space Vehicles

Launch vehicles and most of their payloads spend the majority of their time on the ground. The cost of ground operations is very high. So, why so often is so little attention given to ground processing during development? The current global space industry and economic environment are driving more need for efficiencies to save time and money. Affordability and sustainability are more important now than ever. We can not continue to treat space vehicles as mere science projects. More RLV's (Reusable Launch Vehicles) are being developed for the gains of reusability which are not available for ELV's (Expendable Launch Vehicles). More human-rated vehicles are being developed, with the retirement of the Space Shuttles, and for a new global space race, yet these cost more than the many unmanned vehicles of today. We can learn many lessons on affordability from RLV's. DFO (Design for Operations) considers ground operations during design, development, and manufacturing-before the first flight. This is often minimized for space vehicles, but is very important. Vehicles are designed for launch and mission operations. You will not be able to do it again if it is too slow or costly to get there. Many times, technology changes faster than space products such that what is launched includes outdated features, thus reducing competitiveness. Ground operations must be considered for the full product Lifecycle, from concept to retirement. Once manufactured, launch vehicles along with their payloads and launch systems require a long path of processing before launch. Initial assembly and testing always discover problems to address. A solid integration program is essential to minimize these impacts, as was seen in the Constellation Ares I-X test rocket. For RLV's, landing/recovery and post-flight turnaround activities are performed. Multi-use vehicles require reconfiguration. MRO (Maintenance, Repair, and Overhaul) must be well-planned--- even for the unplanned problems. Defect limits and standard repairs need to be in-place as well as easily added. Many routine inspections and maintenance can be like an aircraft overhaul. Modifications and technology upgrades should be expected. Another factor affecting ground operations efficiency is trending. It is essential for RLV's, and also useful for ELV's which fly the same or similar models again. Good data analysis of technical and processing performance will determine fixes and improvements needed for safety, design, and future processing. Collecting such data on new or low-frequency vehicles is a challenge. Lessons can be learned from the Space Shuttle, or even the Concorde aircraft. For all of the above topics, efficient business systems must be established for comprehensive program management and good throughput. Drawings, specifications, and manuals for an entire launch vehicle are often in different formats from multiple vendors, plus they have proprietary constraints. Nonetheless, the integration team must ensure that all data needed is compatible and visible to each appropriate team member. Ground processing systems for scheduling, tracking, problem resolution, etc. must be well laid-out. The balance between COTS (commercial off the shelf) and custom software is difficult. Multiple customers, vendors, launch sites, and landing sites add to the complexity of efficient IT (Information Technology) tools.

Ingalls, John↗

Embossed Teflon AF Laminate Membrane Microfluidic Diaphragm Valves

A microfluidic system has been designed to survive spaceflight and to function autonomously on the Martian surface. It manipulates microscopic quantities of liquid water and performs chemical analyses on these samples to assay for the presence of molecules associated with past or present living processes. This technology lies at the core of the Urey Instrument, which is scheduled for inclusion on the Pasteur Payload of the ESA ExoMars rover mission in 2013. Fabrication processes have been developed to make the microfabricated Teflon-AF microfluidic diaphragm pumps capable of surviving extreme temperature excursions before and after exposure to liquid water. Two glass wafers are etched with features and a continuous Teflon membrane is sandwiched between them (see figure). Single valves are constructed using this geometry. The microfabricated devices are then post processed by heating the assembled device while applying pneumatic pressure to force the Teflon diaphragm against the valve seat while it is softened. After cooling the device, the embossed membrane retains this new shape. This solves previous problems with bubble introduction into the fluid flow where deformations of the membrane at the valve seat occurred during device bonding at elevated temperatures (100-150 C). The use of laminated membranes containing commercial Teflon AF 2400 sheet sandwiched between spun Teflon AF 1600 layers performed best, and were less gas permeable than Teflon AF 1600 membranes on their own. Spinning Teflon AF 1600 solution (6 percent in FLOURINERT(Registered TradeMark) FC40 solvent, 3M Company) at 500 rpm for 1.5 seconds, followed by 1,000 rpm for 3 seconds onto Borofloat glass wafers, results in a 10-micron-thick film of extremely smooth Teflon AF. This spinning process is repeated several times on flat, blank, glass wafers in order to gradually build a thick, smooth membrane. After running this process at least five times, the wafer and Teflon coating are heated under vacuum at 220 C for one hour in order to drive off any residual solvent present in the composite film. After this, a second blank, glass wafer is brought down from above and the stack is held under vacuum at 3 atm mechanical pressure for ten 10 hours.

Willis, Peter↗

Development of an Advanced Recycle Filter Tank Assembly for the ISS Urine Processor Assembly

Recovering water from urine is a process that is critical to supporting larger crews for extended missions aboard the International Space Station. Urine is collected, preserved, and stored for processing into water and a concentrated brine solution that is highly toxic and must be contained to avoid exposure to the crew. The brine solution is collected in an accumulator tank, called a Recycle Filter Tank Assembly (RFTA) that must be replaced monthly and disposed in order to continue urine processing operations. In order to reduce resupply requirements, a new accumulator tank is being developed that can be emptied on orbit into existing ISS waste tanks. The new tank, called the Advanced Recycle Filter Tank Assembly (ARFTA) is a metal bellows tank that is designed to collect concentrated brine solution and empty by applying pressure to the bellows. This paper discusses the requirements and design of the ARFTA as well as integration into the urine processor assembly.

Link, Dwight E., Jr.↗

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗