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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2004

Packaging a Successful NASA Mission to Reach a Large Audience with a Small Budget. Earth's Dynamic Space: Solar-Terrestrial Physics and NASA's Polar Mission

To showcase the on-going and wide-ranging scope of the Polar science discoveries, the Polar science team has created a one-stop shop for a thorough introduction to geospace physics, in the form of a DVD with supporting website. The DVD, Earth's Dynamic Space: Solar-Terrestrial Physics & NASA's Polar Mission, can be viewed as an end-to-end product or split into individual segments and tailored to lesson plans. Capitalizing on the Polar mission and its amazing science return, the Polar team created an exciting multi-use DVD intended for audiences ranging from a traditional classroom and after school clubs, to museums and science centers. The DVD tackles subjects such as the aurora, the magnetosphere and space weather, whilst highlighting the science discoveries of the Polar mission. This platform introduces the learner to key team members as well as the science principles. Dramatic visualizations are used to illustrate the complex principles that describe Earth's dynamic space. In order to produce such a wide-ranging product on a shoe-string budget, the team poured through existing NASA resources to package them into the Polar story. Team members also created visualizations using Polar data to complement the NASA stock footage. Scientists donated their time to create and review scripts to make this a real team effort, working closely with the award winning audio-visual group at JHU/Applied Physics Laboratory. The team was excited to be invited to join NASA's Sun-Earth Day 2005 E/PO program and the DVD will be distributed as part of the supporting educational packages.

Fox, Nicola J.↗
NASA NTRS2005

MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

Methods of bulk manufacturing high temperature sensor sub-assembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub- assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attach- ing wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

Okojie, Robert S.↗
NASA NTRS2004

Evaluation of Open-Source Hard Real Time Software Packages

Reliable software is, at times, hard to find. No piece of software can be guaranteed to work in every situation that may arise during its use here at Glenn Research Center or in space. The job of the Software Assurance (SA) group in the Risk Management Office is to rigorously test the software in an effort to ensure it matches the contract specifications. In some cases the SA team also researches new alternatives for selected software packages. This testing and research is an integral part of the department of Safety and Mission Assurance. Real Time operation in reference to a computer system is a particular style of handing the timing and manner with which inputs and outputs are handled. A real time system executes these commands and appropriate processing within a defined timing constraint. Within this definition there are two other classifications of real time systems: hard and soft. A soft real time system is one in which if the particular timing constraints are not rigidly met there will be no critical results. On the other hand, a hard real time system is one in which if the timing constraints are not met the results could be catastrophic. An example of a soft real time system is a DVD decoder. If the particular piece of data from the input is not decoded and displayed to the screen at exactly the correct moment nothing critical will become of it, the user may not even notice it. However, a hard real time system is needed to control the timing of fuel injections or steering on the Space Shuttle; a delay of even a fraction of a second could be catastrophic in such a complex system. The current real time system employed by most NASA projects is Wind River's VxWorks operating system. This is a proprietary operating system that can be configured to work with many of NASA s needs and it provides very accurate and reliable hard real time performance. The down side is that since it is a proprietary operating system it is also costly to implement. The prospect of replacing this somewhat costly implementation is the focus of one of the SA group s current research projects. The explosion of open source software in the last ten years has led to the development of a multitude of software solutions which were once only produced by major corporations. The benefits of these open projects include faster release and bug patching cycles as well as inexpensive if not free software solutions. The main packages for hard real time solutions under Linux are Real Time Application Interface (RTAI) and two varieties of Real Time Linux (RTL), RTLFree and RTLPro. During my time here at NASA I have been testing various hard real time solutions operating as layers on the Linux Operating System. All testing is being run on an Intel SBC 2590 which is a common embedded hardware platform. The test plan was provided to me by the Software Assurance group at the start of my internship and my job has been to test the systems by developing and executing the test cases on the hardware. These tests are constructed so that the Software Assurance group can get hard test data for a comparison between the open source and proprietary implementations of hard real time solutions.

Mattei, Nicholas S.↗
NASA NTRS2001

Software Package Completed for Alloy Design at the Atomic Level

As a result of a multidisciplinary effort involving solid-state physics, quantum mechanics, and materials and surface science, the first version of a software package dedicated to the atomistic analysis of multicomponent systems was recently completed. Based on the BFS (Bozzolo, Ferrante, and Smith) method for the calculation of alloy and surface energetics, this package includes modules devoted to the analysis of many essential features that characterize any given alloy or surface system, including (1) surface structure analysis, (2) surface segregation, (3) surface alloying, (4) bulk crystalline material properties and atomic defect structures, and (5) thermal processes that allow us to perform phase diagram calculations. All the modules of this Alloy Design Workbench 1.0 (ADW 1.0) are designed to run in PC and workstation environments, and their operation and performance are substantially linked to the needs of the user and the specific application.

Bozzolo, Guillermo H.↗
NASA NTRS2003

Alloy Design Workbench-Surface Modeling Package Developed

NASA Glenn Research Center's Computational Materials Group has integrated a graphical user interface with in-house-developed surface modeling capabilities, with the goal of using computationally efficient atomistic simulations to aid the development of advanced aerospace materials, through the modeling of alloy surfaces, surface alloys, and segregation. The software is also ideal for modeling nanomaterials, since surface and interfacial effects can dominate material behavior and properties at this level. Through the combination of an accurate atomistic surface modeling methodology and an efficient computational engine, it is now possible to directly model these types of surface phenomenon and metallic nanostructures without a supercomputer. Fulfilling a High Operating Temperature Propulsion Components (HOTPC) project level-I milestone, a graphical user interface was created for a suite of quantum approximate atomistic materials modeling Fortran programs developed at Glenn. The resulting "Alloy Design Workbench-Surface Modeling Package" (ADW-SMP) is the combination of proven quantum approximate Bozzolo-Ferrante-Smith (BFS) algorithms (refs. 1 and 2) with a productivity-enhancing graphical front end. Written in the portable, platform independent Java programming language, the graphical user interface calls on extensively tested Fortran programs running in the background for the detailed computational tasks. Designed to run on desktop computers, the package has been deployed on PC, Mac, and SGI computer systems. The graphical user interface integrates two modes of computational materials exploration. One mode uses Monte Carlo simulations to determine lowest energy equilibrium configurations. The second approach is an interactive "what if" comparison of atomic configuration energies, designed to provide real-time insight into the underlying drivers of alloying processes.

Abel, Phillip B.↗
NASA NTRS2006

Truss Performance and Packaging Metrics

In the present paper a set of performance metrics are derived from first principals to assess the efficiency of competing space truss structural concepts in terms of mass, stiffness, and strength, for designs that are constrained by packaging. The use of these performance metrics provides unique insight into the primary drivers for lowering structural mass and packaging volume as well as enabling quantitative concept performance evaluation and comparison. To demonstrate the use of these performance metrics, data for existing structural concepts are plotted and discussed. Structural performance data is presented for various mechanical deployable concepts, for erectable structures, and for rigidizable structures.

Mikulas, Martin M.↗
NASA NTRS1996

Parallel Climate Data Assimilation PSAS Package

We have designed and implemented a set of highly efficient and highly scalable algorithms for an unstructured computational package, the PSAS data assimilation package, as demonstrated by detailed performance analysis of systematic runs on up to 512node Intel Paragon. The equation solver achieves a sustained 18 Gflops performance. As the results, we achieved an unprecedented 100-fold solution time reduction on the Intel Paragon parallel platform over the Cray C90. This not only meets and exceeds the DAO time requirements, but also significantly enlarges the window of exploration in climate data assimilations.

PSAS data scalable algorithms Intel Paragon 512nod↗
NASA NTRS1996

Advanced Failure Determination Measurement Techniques Used in Thermal Fatigue Life Testing of Electronic Packaging

Thermal fatigue life testing of various electronic packaging technologies is being performed by the Reliability Technology Group at the Jet Propulsion Laboratory. These testing efforts are in progress to improve uderstanding of the reliability issues associated with low volume packaging technologies for space applications and to develop qualification and acceptance approaches for these technologies. The work described here outlines the electrical failure detection techniques used during testing by documenting the circuits and components used to make these measurements, the sensitivity of the measurements, and the applicability of each specific measurement.

fatigue surface mount measurement testing thermal ↗
NASA NTRS1997

A Packaged Silicon MEMS Vibratory Gyroscope for Microspacecraft

In this paper, we present recent work on the design, fabrication, and packaging of a silicon MIcro-Electro-Mechanical System (MEMS) microgyroscope designed for space applications. A hermetically sealed package that houses the microgyroscope and most of its control electronics has been built and tested.

MEMS micro-electromechanical system microspacecraf↗
NASA NTRS2003

Development of reliable electronic packaging solutions for spacecraft avionics miniaturization using embedded passice devices

Miniaturization of electronic packages will play a key rule in future space avionics systems. Smaller avionics packages will reduce payloads while providing greater functionality for information processing and mission instrumentation. Current surface mount technology discrete passive devices not only take up significant space but also add weight. To that end, the use of embedded passive devices, such as capacitors, inductors and resistors will be instrumental in allowing electronics to be made smaller and lighter. Embedded passive devices fabricated on silicon or like substrates using thin film technology, promise great savings in circuit volume, as well as potentially improving electrical performance by decreasing parasitic losses. These devices exhibit a low physical profile and allow the circuit footprint to be reduced by stacking passive elements within a substrate. Thin film technologies used to deposit embedded passive devices are improving and costs associated with the process are decreasing.

Schatzel, Don↗
NASA NTRS2007

Beagle to the Moon: An Experiment Package to Measure Polar Ice and Volatiles in Permanently Shadowed Areas or Beneath the Lunar Surface

Near the beginning of the next decade we will see the launch of scientific payloads to the lunar surface to begin laying the foundations for the return to the moon in the Vision for Space Exploration. Shortly thereafter, astronauts will return to the lunar surface and have the ability to place scientific packages on the surface that will provide information about lunar resources and compositions of materials in permanently shadowed regions of the moon (1). One of the important questions which must be answered early in the program is whether there are lunar resources which would facilitate "living off the land" and not require the transport of resources and consumables from Earth (2). The Beagle science package is the ideal payload (3) to use on the lunar surface for determining the nature of hydrogen, water and lunar volatiles found in the polar regions which could support the Vision for Space Exploration

Gibson, E. K.↗
NASA NTRS2006

VIIRS Product Aggregation and Packaging

Areas where the end-users can help define the Visible/Infrared Imager Radiometer Suite (VIIRS) products distributed by NOAA include: temporal aggregation, band packaging, and gelolocation packaging. Proposals in these areas are presented along with background information, advantages and disadvantates of each proposal. The proposals are based on experience with NASA EOS missions and programs (MODIS and SeaWIFS).

Wolfe, Robert↗
NASA NTRS1979

Electronic Packaging Techniques

A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

Source record↗
NASA NTRS2007

Remotely Operated Aircraft (ROA) Impact on the National Airspace System (NAS) Work Package: Data Modeling and Sharing Perspective for Development of a Common Operating Picture

This report documents analyses that were performed in support of Task #3 of Work Package #3 (WP3), ROA Impact on the NAS. The purpose of the overall work package was to determine if there are any serious issues that would prevent or prohibit ROA's flying in the NAS on a routine basis, and if so, what actions should be taken to address them. The purpose of Task #3 was to look at this problem from the perspective of data modeling and sharing.

Source record↗
NASA NTRS2007

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

LaBel, Kenneth A.↗
NASA NTRS2007

A Hard X-Ray Telescope Science Enhancement Package for the Constellation X-Ray Mission

Details of a hard-x-ray science enhancement package for the Constellation-X mission are presented. A scientific case is made for the inclusion of such an instrument on the planned mission and a detailed design is presented that will satisfy science requirements yet fall within the ground rules for enhancement packages: a cost of less than $100M and a mass of no more than 100 kg.

Ramsey, Brian↗
NASA NTRS2001

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗