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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2006

Truss Performance and Packaging Metrics

In the present paper a set of performance metrics are derived from first principals to assess the efficiency of competing space truss structural concepts in terms of mass, stiffness, and strength, for designs that are constrained by packaging. The use of these performance metrics provides unique insight into the primary drivers for lowering structural mass and packaging volume as well as enabling quantitative concept performance evaluation and comparison. To demonstrate the use of these performance metrics, data for existing structural concepts are plotted and discussed. Structural performance data is presented for various mechanical deployable concepts, for erectable structures, and for rigidizable structures.

Mikulas, Martin M.↗
NASA NTRS1996

Parallel Climate Data Assimilation PSAS Package

We have designed and implemented a set of highly efficient and highly scalable algorithms for an unstructured computational package, the PSAS data assimilation package, as demonstrated by detailed performance analysis of systematic runs on up to 512node Intel Paragon. The equation solver achieves a sustained 18 Gflops performance. As the results, we achieved an unprecedented 100-fold solution time reduction on the Intel Paragon parallel platform over the Cray C90. This not only meets and exceeds the DAO time requirements, but also significantly enlarges the window of exploration in climate data assimilations.

PSAS data scalable algorithms Intel Paragon 512nod↗
NASA NTRS1996

Advanced Failure Determination Measurement Techniques Used in Thermal Fatigue Life Testing of Electronic Packaging

Thermal fatigue life testing of various electronic packaging technologies is being performed by the Reliability Technology Group at the Jet Propulsion Laboratory. These testing efforts are in progress to improve uderstanding of the reliability issues associated with low volume packaging technologies for space applications and to develop qualification and acceptance approaches for these technologies. The work described here outlines the electrical failure detection techniques used during testing by documenting the circuits and components used to make these measurements, the sensitivity of the measurements, and the applicability of each specific measurement.

fatigue surface mount measurement testing thermal ↗
NASA NTRS1997

A Packaged Silicon MEMS Vibratory Gyroscope for Microspacecraft

In this paper, we present recent work on the design, fabrication, and packaging of a silicon MIcro-Electro-Mechanical System (MEMS) microgyroscope designed for space applications. A hermetically sealed package that houses the microgyroscope and most of its control electronics has been built and tested.

MEMS micro-electromechanical system microspacecraf↗
NASA NTRS2003

Development of reliable electronic packaging solutions for spacecraft avionics miniaturization using embedded passice devices

Miniaturization of electronic packages will play a key rule in future space avionics systems. Smaller avionics packages will reduce payloads while providing greater functionality for information processing and mission instrumentation. Current surface mount technology discrete passive devices not only take up significant space but also add weight. To that end, the use of embedded passive devices, such as capacitors, inductors and resistors will be instrumental in allowing electronics to be made smaller and lighter. Embedded passive devices fabricated on silicon or like substrates using thin film technology, promise great savings in circuit volume, as well as potentially improving electrical performance by decreasing parasitic losses. These devices exhibit a low physical profile and allow the circuit footprint to be reduced by stacking passive elements within a substrate. Thin film technologies used to deposit embedded passive devices are improving and costs associated with the process are decreasing.

Schatzel, Don↗
NASA NTRS2007

Beagle to the Moon: An Experiment Package to Measure Polar Ice and Volatiles in Permanently Shadowed Areas or Beneath the Lunar Surface

Near the beginning of the next decade we will see the launch of scientific payloads to the lunar surface to begin laying the foundations for the return to the moon in the Vision for Space Exploration. Shortly thereafter, astronauts will return to the lunar surface and have the ability to place scientific packages on the surface that will provide information about lunar resources and compositions of materials in permanently shadowed regions of the moon (1). One of the important questions which must be answered early in the program is whether there are lunar resources which would facilitate "living off the land" and not require the transport of resources and consumables from Earth (2). The Beagle science package is the ideal payload (3) to use on the lunar surface for determining the nature of hydrogen, water and lunar volatiles found in the polar regions which could support the Vision for Space Exploration

Gibson, E. K.↗
NASA NTRS2006

VIIRS Product Aggregation and Packaging

Areas where the end-users can help define the Visible/Infrared Imager Radiometer Suite (VIIRS) products distributed by NOAA include: temporal aggregation, band packaging, and gelolocation packaging. Proposals in these areas are presented along with background information, advantages and disadvantates of each proposal. The proposals are based on experience with NASA EOS missions and programs (MODIS and SeaWIFS).

Wolfe, Robert↗
NASA NTRS1979

Electronic Packaging Techniques

A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

Source record↗
NASA NTRS2007

Remotely Operated Aircraft (ROA) Impact on the National Airspace System (NAS) Work Package: Data Modeling and Sharing Perspective for Development of a Common Operating Picture

This report documents analyses that were performed in support of Task #3 of Work Package #3 (WP3), ROA Impact on the NAS. The purpose of the overall work package was to determine if there are any serious issues that would prevent or prohibit ROA's flying in the NAS on a routine basis, and if so, what actions should be taken to address them. The purpose of Task #3 was to look at this problem from the perspective of data modeling and sharing.

Source record↗
NASA NTRS2007

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

LaBel, Kenneth A.↗
NASA NTRS2007

A Hard X-Ray Telescope Science Enhancement Package for the Constellation X-Ray Mission

Details of a hard-x-ray science enhancement package for the Constellation-X mission are presented. A scientific case is made for the inclusion of such an instrument on the planned mission and a detailed design is presented that will satisfy science requirements yet fall within the ground rules for enhancement packages: a cost of less than $100M and a mass of no more than 100 kg.

Ramsey, Brian↗
NASA NTRS2001

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗
NASA NTRS2008

Comparative Packaging Study

This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

Perchonok, Michele↗
NASA NTRS2009

Alternative Packaging for Back-Illuminated Imagers

An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

Pain, Bedabrata↗
NASA NTRS2009

Flexible Packaging Concept for a Space Suit Portable Life Support Subsystem

Neither the Shuttle Extravehicular Mobility Unit (EMU), the space suit currently used for space shuttle and International Space Station (ISS) missions, nor the Apollo EMU, the space suit successfully used on previous lunar missions, will satisfy the requirements for the next generation Constellation Program (CxP) lunar suit. The CxP system or Constellation Space Suit Element (CSSE) must be able to tolerate more severe environmental and use conditions than any previous system. These conditions include missions to the severely cold lunar poles and up to 100 Extravehicular Activity (EVA) excursions without ground maintenance. Much effort is focused on decreasing the mass and volume of the Portable Life Support Subsystem (PLSS) over previous suit designs in order to accommodate the required increase in functionality. This paper documents the progress of a conceptual packaging effort of a flexible backpack for the CSSE PLSS. The flexible backpack concept relies on a foam protection system to absorb, distribute, and dissipate the energy from falls on the lunar surface. Testing and analysis of the foam protection system concept that was conducted during this effort indicates that this method of system packaging is a viable solution.

Thomas, Gretchen↗
NASA NTRS2009

MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

Methods of bulk manufacturing high temperature sensor subassembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub-assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attaching wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

Okojie, Robert S.↗